Polyimide resin composition and laminate including same

A technology of polyimide resin and polyimide, which is applied in the direction of synthetic resin layered products, dental prostheses, layered products, etc., can solve the problems of applicable process and component limitations, and achieve high viscoelasticity, Excellent solubility and high flexibility

Active Publication Date: 2013-09-11
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, thermoplastic polyimide resins are generally obtained through the process of imidizing the coating film of polyamic acid varnish at a high temperature of 300°C or higher, so there is a problem that applicable processes and members are limited.

Method used

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  • Polyimide resin composition and laminate including same
  • Polyimide resin composition and laminate including same
  • Polyimide resin composition and laminate including same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0175] Preparation of polyimide varnish

[0176] Two kinds of acid dianhydrides (s-BPDA, BTDA) and three kinds of diamines were mixed in a solvent prepared by mixing NMP (N-methylpyrrolidone) and 1,3,5-trimethylbenzene at a ratio of 7 / 3. (APB, 14EL, XTJ-542) The molar ratio of s-BPDA:BTDA:APB:14EL:XTJ-542=0.79:0.2:0.8:0.1:0.1 was compounded. The obtained mixture was stirred for 4 hours or more in a flask into which dry nitrogen gas could be introduced, and a polyamic acid solution having a resin solid content of 20% by mass to 25% by mass was obtained. After fully stirring the obtained polyamic acid solution, heat the reaction system to about 180°C while stirring in a flask with a Dean-Stark tube, and then remove the water generated in the dehydration reaction Exported out of the system to obtain polyimide varnish.

[0177] 1) Stability of varnish

[0178] The prepared polyimide varnish was put into a vial, and stored in a refrigerator adjusted to 3° C. for three months. A...

Embodiment 2）

[0203] Two acid dianhydrides (s-BPDA, BTDA) and three diamines (APB, 14EL, XTJ- 542) The molar ratio of s-BPDA: BTDA: APB: 14EL: XTJ-542 = 0.39: 0.6: 0.8: 0.1: 0.1 was compounded, except that the polyimide varnish and polyimide varnish were produced in the same manner as in Example 1. imide films, and were evaluated.

Embodiment 3）

[0205] Two acid dianhydrides (s-BPDA, BTDA) and three diamines (p-BAPP, 14EL, XTJ-542) was compounded at a molar ratio of s-BPDA: BTDA: p-BAPP: 14EL: XTJ-542 = 0.78: 0.2: 0.8: 0.1: 0.1, and polyimide was produced in the same manner as in Example 1. Amine varnishes and polyimide films were evaluated.

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Abstract

The present invention addresses the problem of providing a resin composition including a polyimide that is soluble in a solvent and from which a resulting film will be highly viscoelastic and flexible at high temperatures. In order to resolve this problem, a polyimide resin composition includes a polyimide including polycondensate units of tetracarboxylic dianhydride and diamine, wherein either the tetracarboxylic dianhydride includes a dianhydride (alpha 1) represented by general formula (1) or the diamine includes an aromatic diamine (beta 1) represented by general formula (2) and the diamine includes an aliphatic diamine (beta 2) represented by general formula (3) or (4), the sum amount of the dianhydride (alpha 1) and aromatic diamine (beta 1) contained therein being 5-49 mol% with respect to the sum of the tetracarboxylic dianhydride and the diamine, and the amine equivalent thereof being 4,000-20,000. In the formula (3), R1 is an aliphatic chain; H2N-R2-NH2... (4), in the formula (4), R2 is an aliphatic chain.

Description

technical field [0001] The present invention relates to a polyimide resin composition and a laminate containing the same. Background technique [0002] Conventionally, epoxy resins are generally used as adhesives for electronic circuit boards, semiconductor components, and the like. However, the heat resistance and flexibility of epoxy resins are not sufficient, and a long time is required for thermosetting reaction. [0003] On the other hand, it is known that thermoplastic polyimide resin not only has high heat resistance and flexibility, but also has relatively short thermal curing reaction time. However, thermoplastic polyimide resins are generally obtained through the process of imidizing the coating film of polyamic acid varnish at a high temperature of 300° C. or higher, so there is a problem that applicable processes and members are limited. [0004] The method of obtaining a thermoplastic polyimide resin without imidization at high temperature has the following me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10A61K6/087B32B15/088B32B18/00B32B27/34C08L79/08C09J179/08H01L23/29H01L23/31H01L31/042H01M2/16H01M4/62H05K1/03A61K6/891C09J7/22C09J7/35
CPCC08G73/1042C08G73/105C08L79/08C08G73/1067C08G73/1071C08G73/16H05K1/0346H01L23/293H01L23/295H05K2201/0154H01G9/2077H01L2224/16225H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73204H01L2924/15311Y02E10/50H01L31/0481C09J7/35C09J7/22Y10T428/2896Y10T428/2804C09J179/08A61K6/20Y02E60/10H10K30/88H01L2924/00014H01L2924/00A61K6/35C08L33/08A61K6/30C08G73/10B32B15/088H01M4/622
Inventor 饭田健二富田裕介今川清水木场繁夫
Owner MITSUI CHEM INC
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