The invention relates to a high-temperature-resistant pressure-sensitive adhesive tape and a heat-resistant pressure-sensitive adhesive used by the same. The high-temperature-resistant pressure-sensitive adhesive tape comprises a substrate layer, a heat-resistant primer layer and a heat-resistant adhesive layer which are sequentially laminated. The heat-resistant pressure-sensitive adhesive comprises 40-80 parts of 2-acetaminoacrylic acid, 30-50 parts of ethylene glycol dimethacrylate, 10-20 parts of octadecyl acrylate, 2-10 parts of phenyltrimethoxy silane, 2-10 parts of vinyltriethoxysilane, 2-8 parts of gamma-(2,3-epoxy-propoxy)propyltrimethoxy silane, 1-6 parts of nano silicon dioxide, 1-3 parts of hexafluoro-2,4-acetyldione aluminum, 2-6 parts of polyethyleneglycol, 2-5 parts of emulsifier, 0.5-2 parts of initiator and 200-400 parts of deionized water. The prepared heat-resistant pressure-sensitive adhesive tape can work at 70-160 DEG C, can resist the high temperature of greater than 600 DEG C within a short time, and has the advantages of small surface compression deformation, wear resistance, impact resistance, heat resistance and abrasion resistance.