102results about How to "Excellent solvent solubility" patented technology

Material for forming an underlayer film for lithography, which has a high carbon concentration, a low oxygen concentration, a relatively high heat resistance and also a relatively high solvent solubility, and which can be applied to a wet process is disclosed. Material for forming an underlayer film for lithography contains a compound represented by general formula (1).

The invention provides a novel binder resin composition with good adherence onto prime materials of polyolefin, poly (vinyl chloride), polycarbonate, PET, ABS and nylon, and also with excellent solvent solubility.A binder resin composition characterized by being chlorinated propylenic random copolymer with weight average molecular weight of 3000 to 250000, wherein propylenic random copolymer with melting point (Tm) measured by differential scanning calorimeter (DSC) of 115 to 165° C. obtained by copolymerizing propylene with other α-olefin in the coexistence of metallocene type catalyst is chlorinated to chlorine content of 10 to 40% by weight, after thermal degradation or directly without thermal degradation, and / or a binder resin composition characterized by containing carboxyl group-containing chlorinated propylenic random copolymer with weight average molecular weight of 30000 to 220000, wherein propylenic random copolymer with melting point (Tm) measured by differential scanning calorimeter (DSC) of 115 to 165° C. obtained by copolymerizing propylene with other α-olefin in the coexistence of metallocene type catalyst is grafted with α,β-unsaturated carboxylic acid or its anhydride in amounts of 0.1 to 20% by weight, after thermal degradation or directly without thermal degradation, and then chlorinated to chlorine content of 10 to 40% by weight, stabilizer and organic solvent.

The purpose is to provide a technique which enables various kinds of conductive polymer composition to be dissolved in an organic solvent and to be used to form a conductive membrane on a target portion easily. Provided is a composite conductive polymer composition, a method of manufacturing the same, and a solution obtained by dissolving the composition in an aromatic solvent, ester-based solvent or ketone-based solvent. The composition is obtained by doping a π-conjugated polymer (β) with a polymer compound (A), wherein the polymer compound (A) is obtained from (a-1) a monomer having a sulfonic acid group and a polymerizable vinyl group in an amount of 20 to 60 mol %, (a-2) a polar monomer having a hydrophilic group and a polymerizable vinyl group in an amount of 20 to 60 mol %, and (a-3) another polymerizable monomer in an amount of 20 to 60 mol %, and the n-conjugated polymer (β) is obtained from a monomer compound selected from the formulas (I) to (III)in the formula (I) to (III), at least one of R1 to R4 represent an alkoxy group of C1 to C10, and the other groups represent H, an alkyl group of C1 to C10, or an alkoxy group of C1 to C10; at least one of R5 and R6 represent an alkoxy group of C1 to C10, and the other group represents H, an alkyl group or an alkoxy group of C1 to C10, or R5 and R6 jointly represent an alkylenedioxy group of C1 to C8; and R7 represents H, an alkyl group of C1 to C6, or an aromatic ring group.

A polymerizable composition comprising a bifunctional (meth)acrylate compound represented by general formula (1) and a monofunctional (meth)acrylate compound having a nitrile group at the terminal thereof represented by general formula (2). The mass ratio of them (the former / the latter) is from 90 / 10 to 40 / 60.

The present invention provides an epoxy resin composition including 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.

The present invention provides a dispersant excellent in the solubility to a solvent, the adsorption power to a coloring material, and the coloring material dispersibility, and reduced in the self-coloring property, a compound and a polymerizable compound for preparing the dispersant, and a toner using the dispersant.The dispersant has a structure in which a structure represented by the following specific formula (3) or a tautomer thereof is bonded with a polymer, and the toner contains the dispersant.