99results about How to "Excellent solvent solubility" patented technology

There is disclosed a method of forming a conductive metal region on a substrate, comprising depositing on the substrate a solution of a metal ion, and depositing on the substrate a solution of a reducing agent, such that the metal ion and the reducing agent react together in a reaction solution to form a conductive metal region on the substrate.

The invention discloses a method for preparing a high-toughness thermoplastic fluorine-containing polyurethane elastomer, which is characterized in that a bulk polymerization two-step method is adopted to synthesize the fluorine-containing polyurethane elastomer, the isocyanate index is 0.98, and the hard segment content is between 20 and 40 weight percent. The method comprises the following steps of: weighing 6 to 40 parts of non-fluorine macromolecular polylol and/or 30 to 80 parts of fluorine-containing polyether diol in a reactor, performing vacuum dehydration on the mixture for 2h at thetemperature of 120 DEG C, cooling the mixture to be between 70 and 100 DEG C, adding 16 to 33 parts of polyisocyanate into the mixture, stirring the mixture to react for 3h, heating the mixture to bebetween 120 and 140 DEG C, adding 0.1 to 15 parts of low molecular (fluorine-containing) diol chain extender into the mixture, uniformly stirring the mixture, then dumping the mixture into a preheated container, and performing vacuum baking for 20 hours at the temperature of between 120 and 140 DEG C to obtain the high-toughness thermoplastic fluorine-containing polyurethane elastomer.

A compound represented by the following formula (1) has sufficient solubility, a wide usable concentration range, and excellent haze-lowering performance. In the formula, L¹ to L⁶ represent a single bond, —O—, —CO—, —COO—, etc; Sp¹ to Sp⁴ represent a single bond or alkylene of 1 to 10 carbon atoms; A¹ and A² represent trivalent or tetravalent aromatic hydrocarbon or heterocyclic; T represents the following formulae, etc; Hb represent perfluoroalkyl of 2 to 30 carbon atoms; m and n are 2 or 3; and o and p are an integer of 0 or more.

There is provided a novel phenolic resin which can be used as a coating agent or a resist resin for a semiconductor, which has a high carbon concentration and a low oxygen concentration in the resin, which has a relatively high heat resistance and also a relatively high solvent solubility, and which can be applied to a wet process. There are also provided a material useful for forming a novel photoresist underlayer film which has a relatively high solvent solubility, which can be applied to a wet process, and which is excellent in etching resistance as an underlayer film for a multilayer resist, an underlayer film formed using the same, and a pattern forming method using the same. A resin of the present invention is obtained by reacting a compound having a specified structure and an aldehyde having a specified structure in the presence of an acidic catalyst. In addition, a material for forming an underlayer film for lithography of the present invention includes at least the resin and an organic solvent.

The purpose is to provide a technique which enables various kinds of conductive polymer composition to be dissolved in an organic solvent and to be used to form a conductive membrane on a target portion easily. Provided is a composite conductive polymer composition, a method of manufacturing the same, and a solution obtained by dissolving the composition in an aromatic solvent, ester-based solvent or ketone-based solvent. The composition is obtained by doping a π-conjugated polymer (β) with a polymer compound (A), wherein the polymer compound (A) is obtained from (a-1) a monomer having a sulfonic acid group and a polymerizable vinyl group in an amount of 20 to 60 mol %, (a-2) a polar monomer having a hydrophilic group and a polymerizable vinyl group in an amount of 20 to 60 mol %, and (a-3) another polymerizable monomer in an amount of 20 to 60 mol %, and the n-conjugated polymer (β) is obtained from a monomer compound selected from the formulas (I) to (III)

in the formula (I) to (III), at least one of R₁ to R₄ represent an alkoxy group of C₁ to C₁₀, and the other groups represent H, an alkyl group of C₁ to C₁₀, or an alkoxy group of C₁ to C₁₀; at least one of R₅ and R₆ represent an alkoxy group of C₁ to C₁₀, and the other group represents H, an alkyl group or an alkoxy group of C₁ to C₁₀, or R₅ and R₆ jointly represent an alkylenedioxy group of C₁ to C₈; and R₇ represents H, an alkyl group of C₁ to C₆, or an aromatic ring group.

The present invention provides an epoxy resin composition including 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.

The invention relates to novel polyaromatic and polyheteroaromatic compounds and derivatives thereof. The compounds display high solubility in organic solvents. A further aspect of the invention relates to the use of the novel compounds in the fabrication of organic film based heterojunction devices. In one form the devices display high conversion efficiencies in solar cell applications.

It is an object of the present invention to provide a modified polyolefin resin adhesive agent which is excellent in adhesiveness to a nonpolar substrate, particularly a poorly adhesive polyolefin substrate to which no surface treatment has been given and to a polar substrate, develops the excellent adhesiveness by drying or thermal compression bonding at relatively low temperature, and exhibits a low tack. That is, the present invention provides the modified polyolefin resin obtained by modifying a polyolefin resin with (A) a polarity imparting agent which is at least one selected from chlorine, unsaturated carboxylic acid, derivatives and anhydrides of unsaturated carboxylic acid and radical polymerizable monomers; and (B) an ethylene-α-olefin copolymer having an unsaturated bond at one end, and use of said modified polyolefin resin as an aqueous resin composition or an organic solvent resin composition.

The present invention provides a composite ultra-high molecular weight polyethylene fiber and a preparation method thereof, wherein the method comprises mixing glass fiber, graphene slurry, UHMWPE powder and white oil, and then swelling to a molten state, then cooling into a gel-spun, and finally making the fiber from the gel-spun. The method of the present disclosure not only can solve the problem that the glass fiber has poor dispersibility in the case of high viscoelasticity of the ultra-high molecular weight polyethylene, but also can improve the cut resistance of the ultra-high molecular weight polyethylene fiber on the basis of ensuring the flexibility of the yarn.

The present invention provides a resist base material containing a compound having a specific structure and/or a resin derived from the compound as a monomer.

A process for preparing a carboxylated cellulose ester from oxidized cellulose is described. The carboxylated cellulose esters have improved solvent solubility and coating resin compatibility when compared to cellulose esters made from regular grade cellulose. The process comprises activating the oxidized cellulose with water. The activated oxidized cellulose is then dehydrated by displacing the water with acetic acid and optionally displacing at least some of the acetic acid with butyric acid or propionic acid. After dehydration the activated cellulose is reacted with an esterifying reagent in the presence of a catalyst at about 0 DEG C. The temperature is gradually increased to a level sufficient to complete reaction and to obtain an intrinsic viscosity ranging from about 0.2 to about 1.6 dl/g. The reacted solution is then hydrolyzed to obtain a hydroxyl content ranging from about 0.05 to about 1.0. The catalyst is neutralized with a neutralizing agent and the solution is optionally filtered and the carboxylated cellulose ester is then precipitated with a precipitating agent. The invention also relates to carboxylated cellulose esters prepared by the process described above as well as high solids coating compositions containing carboxylated cellulose esters made by the above process.

The invention relates to semi-interpenetrating polymer network polyimide resin composition and a film-like adhesive prepared from the same. The resin composition is a resin composition adhesive solution comprising polythioetherimide resin, a BMI (bismaleimide) prepolymer containing siloxane, filler and an adhesion promoter, and a semi-interpenetrating polymer network polyimide adhesive film is prepared with a tape casting method. A thermoplastic and thermosetting semi-interpenetrating polymer network structure is formed in the polyimide adhesive film, the advantageous properties of the thermoplastic and thermosetting adhesive films are combined, the CTE value and bonding strength of the adhesive film are controlled by adjusting the thermoplastic and thermosetting ratio, and the adhesive film with better comprehensive performance is obtained. The flexibility and moisture absorption performance of the adhesive film are optimized by using BMI resin containing the siloxane structure; the linear expansion coefficient is further decreased by using nano silica filler, and the stripping strength of the adhesive film with metal is further improved by using high-temperature-resistant 4-(trimethoxysilyl)aniline as the adhesion promoter; polythioetherimide is prepared from bis-nitrophthalimide and alkali metal hydrosulfide, and thus the cost of the adhesive film is reduced.