Semiconductor device comprising: an insulating substrate (1); a
semiconductor element (3) arranged on a first surface of the insulating substrate (1); a housing (51) connected to the insulation substrate (1) and configured to accommodate the
semiconductor element (3) therein; and a resin (6) filled into the housing (51) to bury the
semiconductor element (3), wherein, assuming that the thickness of the insulating substrate (1) is denoted by t1, the thickness of the resin (6) is denoted by t2, the
linear expansion coefficient of the insulating substrate (1) is denoted by α1 and the
linear expansion coefficient of the resin (6) is denoted by α2, the relationship therebetween t2 ≥ t1 and α2 ≥ α1 is satisfied, the housing (51) is provided with an overlapping portion which overlaps with an outer edge of the insulating substrate (1) in plan view, and an extension portion (53) which extends from the overlapping portion further outward than the outer edge of the insulating substrate (1), the
semiconductor device further comprises a fixing member (52) configured to fix the extension portion (53) of the housing (51) to an external member (54) arranged outside the
semiconductor device, a heat
radiation grease (7) is arranged between the insulation substrate (1) and the external element (54) and the overlapping portion is provided with a stepped portion (511) to accommodate the outer edge of the insulation substrate (1), and the depth of the stepped portion (511) is greater than the sum of the thickness (t1) of the insulating substrate (1) and a thickness of the heat
radiation grease (7) in a state in which the extension portion (53) of the housing (51) is fixed to the external member (54) by the fixing member (52), and the depth of the stepped portion (511) is smaller than the sum of the thickness (t1) of the insulating substrate (1) and a degree of
distortion of the insulating substrate (1) in a state in which the outer edge of the insulating substrate (1) has not yet been pressed by the stepped portion (511) of the housing (51), and wherein, in the state where the extension portion (53) of the housing (51) is fixed to the external member (54) by the fixing member (52), a second surface of the insulation substrate (1) opposite to the first surface thereof is distorted into a convex shape.