1898 results about "Linear expansion coefficient" patented technology

A composite characterized by comprising an aluminum alloy shaped item having a surface roughness of 5 to 50 μm or more, the surface provided with 1 μm or less fine depressions or protrusions, and a thermoplastic resin composition composed mainly of a polyphenylene sulfide or polybutylene terephthalate resin whose average of lengthwise and crosswise linear expansion coefficients is in the range of 2 to 4×10⁻⁵° C.⁻¹, the thermoplastic resin composition penetrating and anchored in the depressions or protrusions. The thermoplastic resin composition is not easily detached from the aluminum alloy shaped item. Thus, in, for example, electronic equipments and household electrical appliances, the advantage of metallic cage body can be reconciled with the advantage of synthetic resin structure. This composite can ensure high production efficiency and is suitable for mass production. Further, morphology and structure designing thereof can be accomplished freely.

A semiconductor device capable of reducing a temperature increase during operation thereof is provided. In the semiconductor device, an interface chip is stacked on a plurality of stacked semiconductor elements. Both an “Si” interposer and a resin interposer are arranged under the plural semiconductor elements. The Si interposer is arranged between the resin interposer and the plural semiconductor elements. The Si interposer owns a thickness which is thicker than a thickness of a semiconductor element, and also has a linear expansion coefficient which is smaller than a linear expansion coefficient of the resin interposer, and further, is larger than, or equal to linear expansion coefficients of the plural semiconductor elements.

A substrate system of the kind having a buffer region interposed between a silicon substrate proper and a nitride semiconductor region in order to make up for a difference in linear expansion coefficient therebetween. Electrodes are formed on the nitride semiconductor layer or layers in order to provide HEMTs or MESFETs. The buffer region is a lamination of a multiplicity of buffer layers each comprising a first, a second, and a third buffer sublayer of nitride semiconductors, in that order from the silicon substrate proper toward the nitride semiconductor region. The three sublayers of each buffer layer contain aluminum in varying proportions including zero. The aluminum proportion of the third buffer sublayer is either zero or intermediate that of the first buffer sublayer and that of the second. The low aluminum proportion of the third buffer sublayer serves to prevent two-dimensional electron gas from generating in the buffer region and hence to make this region sufficiently high in resistance to inhibit current leakage from the HEMTs or MESFETs.

An optical semiconductor element 2 is mounted on a lead frame 1, the optical semiconductor element 2 is encapsulated with a mold resin portion 14 of a first layer that has light permeability, and the mold resin portion 14 of the first layer is encapsulated with a mold resin portion 15 of a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portion 14 of the first layer is made smaller than a coefficient of linear expansion of the mold resin portion 15 of the second layer.

The invention provides a film capacitor and its manufacturing method suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic.

A film capacitor comprises a film capacitor element 1, a bus bar 3 as metal terminal connected to electrode 2 of this film capacitor element 1, and a case 8 for containing them, in which the film capacitor element 1 and bus bar 3 are packed within the case 8 by plural layers of epoxy resin compositions 6, 7, and the plural layers of epoxy resin compositions 6, 7 are formed in layers, and are composed so that the coefficient of linear expansion may be smallest in the epoxy resin composition 7 disposed in the uppermost layer, and therefore resin cracks can be prevented at the time of heat cycle, and a film capacitor of high reliability excellent inhumidity resistance is obtained.

A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties.

A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10⁻³ [° C.⁻¹] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

A plurality of single lenses (11a to 11d) form images of a subject in a plurality of imaging regions (17a to 17d), respectively, and electrical signals from the plurality of imaging regions are synthesized, whereby an image is obtained. The plurality of single lenses are held by a lens holder (12), and the plurality of imaging regions are held by an imaging device holder (16). The lens holder and the imaging device holder are disposed so as to be opposed to each other. The lens holder includes a member different from a member of the imaging device holder, and a linear expansion coefficient of a material of the lens holder is substantially equal to a linear expansion coefficient of a material of the imaging device holder. The materials of the lens holder and the imaging device holder are different from a material of the plurality of single lenses. Thereby, a high quality image can be obtained stably irrespective of a temperature change, and a distance to a subject can be measured accurately.

An optical element is disclosed which is resistant to changes in environmental characteristics such as temperature and humidity and achieves a stable and favorable reflection suppressing effect. The optical element has a base member and a resin layer which is formed on the base member and has a linear expansion coefficient different from that of the base member. The resin layer has a minute periodic structure which has a period smaller than the wavelength of incident light on the optical element.

PCT No. PCT/JP96/03880 Sec. 371 Date Sep. 8, 1997 Sec. 102(e) Date Sep. 8, 1997 PCT Filed Dec. 27, 1996 PCT Pub. No. WO97/24404 PCT Pub. Date Oct. 7, 1997The present invention provides a liquid crystal polymer composition wherein the low coefficient of linear expansion is attained without significantly deteriorating mechanical properties by incorporating plural fibrous fillers or a fibrous filler and a particulate filler with liquid crystal polymer in a specified ratio.

An ink jet head has a head substrate including discharge elements for discharging ink, with an electric wiring board being electrically connected to the head substrate, in which the periphery of the head substrate is sealed with a first sealant, and an electric splice between the head substrate and the electric wiring board is sealed with a second sealant. The first and second sealants contain the same base resin and curing agent, and the second sealant shows higher hardness than the first sealant after curing. This ink jet head is free from problems such as cavities and fissures at the boundary of the two sealants caused by a difference in linear expansion coefficients.

The invention belongs to the technical field of high polymer materials, and discloses low coefficient of thermal expansion thermoplastic resin composition, a preparation method and application of the low coefficient of thermal expansion thermoplastic resin composition. The resin composition is composed of, by weight, 340 to 900 parts of thermoplastic resin, 100 to 500 parts of carbon fibers, 0 to 5 parts of antioxygen, 0 to 5 parts of lubricating agent and 0 to 150 parts of flexibilizer. The preparation method comprises adding the 340 to 900 parts of the thermoplastic resin, the 0 to 5 parts of the antioxygen, 0 to 5 parts of the lubricating agent and the 0 to 150 parts of the flexibilizer to a high mixing machine to mix for 1 to 30 min, adding the mixture to a double-screw extruder, adding the 100 to 500 parts of the carbon fibers from the glass fiber feeding port or the side feeding port of the double-screw extruder to mix evenly, and carrying out extruding, dragging and prilling on mixed materials in the double-screw extruder to obtain the low coefficient of thermal expansion thermoplastic resin composition. The use of the low coefficient of thermal expansion thermoplastic resin composition applied to the fittings of a metal piece is provided. The thermoplastic resin is high in flexural modulus, tensile strength and impact strength, and low in linear expansion coefficient.

A transparent composite composition is provided which comprises an epoxy resin (a) and a glass filler (b) and in which the epoxy resin (a) comprises at least one epoxy resin whose refractive index after curing is lower than the refractive index of the glass filler (b) and at least one epoxy resin whose refractive index after curing is higher than the refractive index of the glass filler (b). The transparent composite composition of the invention has a low coefficient of linear expansion and is excellent in transparency, heat resistance and solvent resistance, among others and, therefore, is judiciously used, for example, in the form of liquid crystal display device substrates and organic EL device substrates (in particular of the active matrix type) and, further, transparent sheets, optical lenses, color filter substrates, solar cell substrates, touch panels, optical devices, optical waveguides, LED sealing materials and so forth.

A capacitance-type force sensor is provided with a fixed plate, a fixed portion on which the fixed plate is mounted, a load transmission portion, and an elastic portion through which the load transmission portion is mounted on the fixed portion. All these members are formed of materials having substantially equal coefficients of linear expansion. Further, a displacement electrode secured to the load transmission portion and/or a fixed electrode secured to the fixed plate is divided into three or more electrically independent electrodes such that the displacement and fixed electrodes form three or more capacitance elements.

The invention relates to the technical field of welding, in particular to a method for controlling deformation of a nickel-based ageing-strengthening high-temperature alloy casing welding assembly, and a piece of technological equipment of the method. According to the method, the welding deformation is controlled by using rigid limit of materials with close linear expansion coefficients, a tooling structure that can meet rigid supporting requirements during welding as well as control and eliminate residual stress deformation during welding is adopted, after an inner ring and eight T-shaped supporting plate components form an eight-diagram structure, a heat treatment process at the temperature of 550 DEG C for eliminating stress is additionally performed so as to reduce residual stress between the inner ring and the roots of the supporting plates before electron beam welding; after all welding processes are completed, a vacuum solution treatment process at the temperature of 970 DEG C is additionally performed, and a double aging treatment process at the temperature of 720 DEG C and 620 DEG C is further additionally performed to completely eliminate residual internal stress after welding so as to achieve service performance. According to the invention, the problems that the conventional combustion engine can not control fatigue crack, and requirements on the reliability and the service life of the combustion engine can not be met are solved; by adopting the novel welding technology method and the technological equipment, the investment is small, the operation is simple and the engineering application is facilitated.

A lens array satisfies a+b+d₁+e+ΔL≦W₁ where:

• • a: positional accuracy of first lens faces 11,
  • b: positional accuracy of second lens faces 12,
  • d₁: positional accuracy of light-emitting elements 7,
  • e: positional accuracy of optical fibers 5,
  • ΔL=α×ΔT×L (α: coefficient of linear expansion of lens array main body 4; ΔT: temperature change in the lens array main body 4; and L: distance from a fixed position on a first surface 4a to a position of a lens face on the first surface 4a farthest from the fixed position),
  • W₁: a distance between attachment positions before and after movement, under a premise that a photovoltaic device 3 is moved from an attachment position at which optical coupling efficiency between the light-emitting elements 7 and fiber ends 5a indicates a maximum efficiency to an attachment position at which efficiency reduction equivalent to 2 dB is indicated.

Provided is a semiconductor device having an electric fuse structure which receives the supply of an electric current to be permitted to be cut without damaging portions around the fuse. An electric fuse is electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the supply of an electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers.

One of the aspects of the present invention is to provide a semiconductor device, which includes a radiating plate, a wiring patterned layer on the radiating plate via an insulating layer, at least one semiconductor chip mounted on the wiring patterned layer. The semiconductor chip has a surface electrode. The semiconductor device further includes a conductive lead plate electrically connected with the surface electrode of the semiconductor chip, and a resin package of thermoplastic resin having anisotropic linear expansion coefficient varying based upon directions. The resin package covers the wiring patterned layer, the semiconductor chip, the conductive lead plate, and at least a portion of the radiating plate. The conductive lead plate extends in a direction which provides the resin package with the maximum linear expansion coefficient. In the semiconductor device so structured, the warpage of the resin package is reduced both in longitudinal and transverse directions.

A solid electrolytic capacitor that suppresses capacitance decrease caused by thermal loads. The solid electrolytic capacitor includes an anode body, a dielectric layer formed on a surface of the anode body, a conductive polymer layer formed on the dielectric layer, and a cathode layer formed on the conductive polymer layer. The conductive polymer layer contains a filler material having a negative linear expansion coefficient.

The invention discloses a low-temperature type wood-plastic floor and a preparation technology thereof. The floor comprises substances of: plastic particles, plant fiber, a filling material, a compatibilizer, a lubricant, a pigment, and functional auxiliary agents. Compared with existing technologies, according to the invention, melted and modified plastic particles are adopted, the components are well formulated, and the mold of the product is improved. Under a temperature of -34 DEG C to 60 DEG C, the linear expansion coefficient of the prepared product is smaller than 5*10<-5>. When the product is processed through three times of freeze-thaw cycling tests according to ASTM D6109-10, the bending strength retention of the product is more than 97%.

The invention discloses a glass fiber reinforced polypropylene composite material for a car radiator grid and a preparation process thereof. The composite material comprises the following components in percentage by weight: 32-78% of polypropylene, 0-2% of a thermal stabilizer, 0-2% of an additive, 0-2% of an illumination stabilizer, 0-2% of a nucleating agent, 5-20% of a flexibilizer, 2-10% of a compatilizer and 15-30% of chopped glass fiber. Due to the adoption of the chopped glass fiber for filling, the rigidity and the heat resistance of the material are greatly improved, the linear expansion coefficient (CLTE) of the material can be also reduced, and the problems of size change and deformation of a workpiece due to rapid change of external environment temperature are solved. The prepared composite material is excellent in heat resistance, high in rigidity, excellent in size stability and weather resistance and high in impact resistance, and satisfactorily meets the demand of the car radiator grid.