313 results about "Electric fuses" patented technology

The ability to repair defective cells in a memory array, by replacing those cells with redundant cells, is improved using a redundant memory line control circuit that employs two types of redundancy programming. Most, or all, redundant memory lines can be programmed while the memory array is in a wafer state by, e.g., cutting laser fuses. But at least one memory line can be programmed subsequent to device packaging ("post repair") using, e.g., commands that cut electric fuses. Preferably, the redundant memory line(s) that are reserved for post repair are selectable among the same redundant memory lines that can be programmed using laser fuses. This allows all redundant memory lines to be available for laser repair, if needed, but also allows a redundant memory line to be selected for post repair after it has been determined that that redundant memory line is defect-free. This increases the likelihood that a device will be repairable, and yet does not unnecessarily waste redundant memory lines by pre-dedicating them to laser or post repair.

Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has at least one OTP element coupled to at least one diode in a memory cell. The diode can be constructed by P+ and N+ active regions in a CMOS N well, or on an isolated active region as the P and N terminals of the diode. The isolation between P+ and the N+ active regions of the diode in a cell or between cells can be provided by dummy MOS gate, SBL, or STI/LOCOS isolations. The OTP element can be polysilicon, silicided polysilicon, silicide, metal, metal alloy, local interconnect, thermally isolated active region, CMOS gate, or combination thereof.

Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has an OTP element coupled to a diode in a memory cell. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. By applying a high voltage to the P terminal of a diode and switching the N terminal of a diode to a low voltage for suitable duration of time, a current flows through an OTP element in series with the program selector may change the resistance state. The P+ active region of the diode can be isolated from the N+ active region in the N well by using dummy MOS gate, SBL, or STI/LOCOS isolations. If the resistive element is an interconnect fuse based on CMOS gate material, the resistive element can be coupled to the P+ active region by an abutted contact such that the element, active region, and metal are connected in a single rectangular contact.

Polysilicon diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has an OTP element coupled to a diode in a memory cell. The diode can be constructed by P+/N+ implants on a polysilicon as a program selector. By applying a high voltage to an OTP element coupled to the P-terminal of a diode and switching the N-terminal of a diode to a low voltage for suitable duration of time, a current flows through the OTP element may change the resistance state. On the polysilicon diode, the spacing and doping level of a gap between the P- and N-implants can be controlled for different breakdown voltages and leakage currents. The Silicide Block Layer (SBL) can be used to block silicide formation on the top of polysilicon to prevent shorting. If the OTP element is a polysilicon electrical fuse, the fuse element can be merged with the polysilicon diode in one piece to save area.

Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The OTP device has at least one OTP element coupled to at least one diode in a memory cell. The diode can be constructed by P+ and N+ active regions in a CMOS N well, or on an isolated active region as the P and N terminals of the diode. The isolation between P+ and the N+ active regions of the diode in a cell or between cells can be provided by dummy MOS gate, SBL, or STI/LOCOS isolations. The OTP cell can have a MOS in series with the OTP element as a read selector. The OTP element can be polysilicon, silicided polysilicon, silicide, polymetal, metal-0, metal, metal alloy, local interconnect, thermally isolated active region, CMOS gate, or combination thereof.

A method of programming electrical fuses reliably is disclosed. If a programming current exceeds a critical current, disruptive mechanisms such as rupture, thermal runaway, decomposition, or melt, can be a dominant programming mechanism such that programming is not be very reliable. Advantageously, by controlled programming where programming current is maintained below the critical current, electromigration can be the sole programming mechanism and, as a result, programming can be deterministic and very reliable. In this method, fuses can be programmed in multiple shots with progressive resistance changes to determine a lower bound that all fuses can be programmed satisfactorily and an upper bound that at least one fuse can be determined failed. If programming within the lower and upper bounds, defects due to programming can be almost zero and, therefore, defects are essentially determined by pre-program defects.

Provided is a semiconductor device having an electric fuse structure which receives the supply of an electric current to be permitted to be cut without damaging portions around the fuse. An electric fuse is electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the supply of an electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers.

A memory device that includes a plurality of data storage cells; at least one redundancy data storage cell; a redundancy match detection circuit; and a means for coupling programmable fuses to the redundancy match detection circuit, wherein a defective data storage is replaced by one redundancy data storage when the redundancy match detection detects a pre-determined condition set by said programmable fuse is described. Decoding is accomplished by a data bus selecting the e-fuse to be blown. The data bus is also used for reading the state of the e-fuses to ensure that the e-fuses are correctly blown. Power is effectively applied to the selected e-fuses while sharing the data bus for e-fuse decoding and verification. In order to reduce the number of communication channels between e-fuses and the redundancy match detection circuitry, the transfer operation uses time multiplexing, allowing e-fuse information to be transferred to the redundancy match detection circuitry sequentially. The actual time multiplexing operation for performing the transfer is preferably enabled only after the chip power-up state.

A fuse device has a fuse element provided with a first terminal and a second terminal and an electrically breakable region, which is arranged between the first terminal and the second terminal and is configured to undergo breaking as a result of the supply of a programming electrical quantity, thus electrically separating the first terminal from the second terminal. The electrically breakable region is of a phase-change material, in particular a calcogenic material, for example GST.

A semiconductor device includes an electric fuse formed on a semiconductor substrate and composed of an electric conductor. The electric fuse includes an upper layer interconnect, a via coupled to the upper interconnect and a lower layer interconnect coupled to the via, which are formed in different layers, respectively, in a condition before cutting the electric fuse, and wherein the electric fuse includes a flowing-out region formed of the electric conductor being flowed toward outside from the second interconnect and a void region formed between the first interconnect and the via or in the via, in a condition after cutting the electric fuse.

An independent fused salt heat storage power plant belongs to the technical field of energy storage, and comprises a power supply, an electric fused salt heater, a high-temperature hot salt tank, a low-temperature cold salt tank, a fused salt pump, a fused salt circuit system, a brine heat exchanger, a conventional power generation island, a water-steam circuit system and an intelligent control system. When unstable or redundant electric energy such as photovoltaic power, wind power and off-peak power is stored, the electric energy is converted into high-temperature heat energy to be stored in the high-temperature fused salt through heating the high-temperature fused salt by the electric fused salt heater. When electricity utilization is needed, high-temperature heat energy stored in the high-temperature fused salt can heat water to generate water steam to drive a steam turbine to generate power to realize the energy release. In addition, a large-scale high-temperature thermal storage power plant built in cities can also be combined with city heat supply to construct a large-scale high-temperature heat storage and combined heat and power supply station.

An electric fuse includes a wide interconnect and a narrow interconnect. The electric fuse has a juxtaposed region in which a plurality of straight line portions are juxtaposed with each other by folding the wide interconnect and the narrow interconnect has a narrower width than that of the wide interconnect, and, at the same time, is connected to the wide interconnect outside the juxtaposed region.

The embodiment of the invention provides a plurality of kinds of electric-fuse structures and formation methods thereof, and semiconductor devices and formation methods thereof, e.g., doping is carried out in a nanowire or a fin part so that an electric-fuse structure is formed and while a full-surrounding gate transistor or a fin-type field effect transistor is formed, a corresponding electric-fuse structure is formed at the same time and thus diversity of the electric-fuse structures and the semiconductor devices is realized. And when a step of forming the electric-fuse structure parasitizes in a step of forming the full-surrounding gate transistor or the fin-type field effect transistor, no extra process step is added so that production cost is low.

CMOS image sensor is realized, wherein a pre-amp amplifies the voltage of a photo detector, and a main amp amplifies the output of the pre-amp. And the pre-amp is adjustable for receiving the output of the photo detector, and also the main amp is adjustable for optimizing the output swing. With the adjustable amps, low sensitivity photo detector can be amplified more, and high sensitivity photo detector can be amplified less, which enables to adjust the gain of each amp from the low-sensitive to high-sensitive photo detector. The information for adjusting the amps is stored in the latches of the chip, wherein include laser-blown fuses or electric fuses. In doing so, the photo detector can be stacked over the access device. In particular, photo detector is repairable, wherein failed photo detector is replaced with non-failed photo detector.

A first transistor is connected in series with one end of a fuse element. A second transistor is connected in series with the other end of the fuse element. A current flows through the fuse element when both the first and second transistors are turned on.

The present invention relates to an apparatus and a method for protecting an electric line in a vehicle, it being possible to adapt the apparatus to the properties of the electric line to be protected. The apparatus for protecting an electric line comprises an electric fuse and a controllable switching element, the controllable switching element and the electric fuse being formed as a parallel circuit, and the parallel circuit being connectable in series to the electric line, the electric fuse being disposed in a first branch of the parallel circuit, which has a first resistance, and the controllable switching element being disposed in a second branch of the parallel circuit, and the controllable switching element being configured to accommodate at least two states, a first state with a second resistance higher than the first resistance, and a second state with a third resistance lower than the first resistance, and to switch into the second state when there is a pulse load condition.

An electric fuse circuit is provided which has a capacitor that forms an electric fuse; a write circuit for breaking an insulating film of the capacitor, by applying a voltage to a terminal of the capacitor in response to a write signal; and at least two transistors, including a first transistor and a second transistor, which are connected in series between the capacitor and the write circuit.

The invention relates to the technical field of semiconductors and provides an on-chip temperature sensor. The on-chip temperature sensor comprises a basic circuit unit, a chopped wave unit, a resistor trimming unit, an electric fuse array and a resistance (R) and capacity (C) R-C filtering network. Offset voltage, misfitting and noise of an imperfect factor of the temperature sensor are eliminated by the chopped wave unit. Further improvement of precision is achieved by further adopting the resistor trimming unit at the same time. A required control bit of the resistor trimming unit is integrated in a chip by the electric fuse array, packaging cost is effectively controlled, and thus high integration level of a device is guaranteed. Besides, normalization of output voltage is achieved through the R-C filtering network by the on-chip temperature sensor, thus the on-chip temperature sensor of high precision that technology influence is eliminated and output result is consistent on different chips is obtained.