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137results about How to "Easily form" patented technology

Gaming machine

In a gaming machine including a symbol region where reels having symbols are arranged in predetermined arrangement, so that the symbols are displayed in an arranged manner in longitudinal and transverse directions, there are provided a reel control unit that independently controls movement and stop of each of the reels, such that the symbols appearing in the symbol region change and a winning determination unit that determines whether the symbols appearing on a valid line set to span the reels form a predetermined winning pattern, when each of the reels is stopped, layers are set in the symbol region, and in the gaming machine, at least one reel is disposed in each layer, a symbol group is provided in at least one specific reel arranged in a specific layer of the layers in such a manner that symbols capable of forming at least portion of the winning pattern are arranged in the symbol group, at least one of the symbols capable of forming at least portion of the winning pattern overlaps the other reel in the other layer different from the specific layer, and that the symbol group move integrally with the specific reel, the symbols that are disposed in the symbol group in the specific reel can be viewed from a player, and when the symbol group is stopped on the valid line, the winning determination unit make the symbols disposed in the symbol group be included in a determination target and determines whether the winning pattern is formed.
Owner:KONAMI GAMING

Production method for electronic component and pressure-sensitive adhesive sheet to be used in the production method

A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.
The production method of the present invention includes: attaching a pressure-sensitive adhesive sheet to a substrate, the pressure-sensitive adhesive sheet including a base, a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microspheres provided on one surface of the base, and a dielectric layer including a weak pressure-sensitive adhesive layer and an adhesive layer provided on another surface of the base in this order from a side of the base, so that the thermally expandable pressure-sensitive adhesive layer is placed on a side of the substrate; attaching and fixing a plurality of chip-shaped electronic components to a surface of the pressure-sensitive adhesive sheet on a side of the adhesive layer so that electrode surfaces of the plurality of chip-shaped electronic components are placed on the side of the adhesive layer; covering an entire surface of the plurality of chip-shaped electronic components excluding fixed surfaces with a protective substance to obtain an encapsulated body including the plurality of chip-shaped electronic components; subjecting the pressure-sensitive adhesive sheet to heating treatment to cause the thermally expandable microspheres in the thermally expandable pressure-sensitive adhesive layer to expand to decrease an adhesion of the thermally expandable pressure-sensitive adhesive layer and peeling the thermally expandable pressure-sensitive adhesive layer from the substrate; peeling the weak pressure-sensitive adhesive layer from the adhesive layer to obtain a laminate of the adhesive layer and the encapsulated body; and cutting the laminate between the plurality of chip-shaped electronic components to separate individual chip-shaped electronic components.
Owner:NITTO DENKO CORP

Composite conductive polymer composition, method of manufacturing the same, solution containing the composition, use of the composition

The purpose is to provide a technique which enables various kinds of conductive polymer composition to be dissolved in an organic solvent and to be used to form a conductive membrane on a target portion easily. Provided is a composite conductive polymer composition, a method of manufacturing the same, and a solution obtained by dissolving the composition in an aromatic solvent, ester-based solvent or ketone-based solvent. The composition is obtained by doping a π-conjugated polymer (β) with a polymer compound (A), wherein the polymer compound (A) is obtained from (a-1) a monomer having a sulfonic acid group and a polymerizable vinyl group in an amount of 20 to 60 mol %, (a-2) a polar monomer having a hydrophilic group and a polymerizable vinyl group in an amount of 20 to 60 mol %, and (a-3) another polymerizable monomer in an amount of 20 to 60 mol %, and the n-conjugated polymer (β) is obtained from a monomer compound selected from the formulas (I) to (III)
in the formula (I) to (III), at least one of R1 to R4 represent an alkoxy group of C1 to C10, and the other groups represent H, an alkyl group of C1 to C10, or an alkoxy group of C1 to C10; at least one of R5 and R6 represent an alkoxy group of C1 to C10, and the other group represents H, an alkyl group or an alkoxy group of C1 to C10, or R5 and R6 jointly represent an alkylenedioxy group of C1 to C8; and R7 represents H, an alkyl group of C1 to C6, or an aromatic ring group.
Owner:SOKEN CHEM & ENG CO LTD
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