Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

137results about How to "Easily form" patented technology

Bottle-shaped can manufacturing method

A bottle-shaped can manufacturing method for forming a shoulder portion having a slope and a diametrically small cylindrical neck portion integrally by further working a bottom side of a bottomed cylindrical can which is formed thinner at its trunk wall than at its bottom wall by drawing a metallic sheet having a thickness of 0.1 to 0.4 mm and by executing at least one thinning working of a bending / extending working and an ironing working.
Owner:DAIWA CAN

Gear transmission assembly for electrical power tool

A gear transmission assembly for an electrical power tool includes a housing (6), a multi-stage gear train (1) located in the housing and having a plurality of axially displaceable indexing gears (4a, 4b) associated with respective stages of the gear train (1) and a shift device (2) for shifting the gear train (1) from one stage to another and having a shifting slide (3) displaceable from one shift stage to another, and a plurality of springable shifting stirrups (5a, 5b) connected with the shifting slide (3) and cooperating with respective indexing gears (4a, 4b) for displacing same in response to displacement of the shifting slide (3) between shift stages.
Owner:HILTI AG

Novel amphiphilic substance, and drug delivery system and molecular imaging system using the same

The present invention provides a novel amphiphilic substance, a nanoparticle using the novel amphiphilic substance, which can be used as a nanocarrier having high biocompatibility, a drug delivery system and a probe useful for the system, and, a molecular imaging system and a probe useful for the system. An amphiphilic block polymer comprising a hydrophilic block; and a hydrophobic block, wherein the hydrophilic block is a hydrophilic polypeptide chain having 10 or more sarcosine units, and the hydrophobic block is a hydrophobic molecular chain comprising units selected from the group consisting of amino acid units and hydroxyl acid units as essential structural units, and having 5 or more of the essential structural units.
Owner:SHIMADZU CORP

Water-based ink, and image formation method and recorded image using the ink

A water-based ink that comprises a liquid medium containing water, a water-dispersible coloring material and a surfactant, wherein when the ink is attached onto a recording material, the water-dispersible coloring material forms a plurality of minute interspersed aggregations and is fixed on the recording material, and a recording method using the ink.
Owner:CANON KK

Light transmitting conductive film, light transmitting electromagnetic wave shielding film, optical filter and method of producing display filter

A light transmitting conductive film formed by patterning a conductive metal part and a visible light transmitting part on a transparent support, wherein the conductive metal part is made up of mesh-forming thin lines of from 1 μm to 40 μm size and the mesh pattern continues for 3 m or longer. A method of producing a display filter wherein the end sections of at least two sides facing each other are in a mesh shape, which comprises using an electromagnetic wave shielding material (C), wherein a conductive layer (B) having the conductive parts being in the mesh shape of the geometric pattern is formed on one face of a polymer film (A) continuously in the machine direction of the polymer film (A), and cutting the mesh-like parts.
Owner:FUJIFILM CORP

Redrawn capillary imaging reservoir

Methods and apparatus for depositing a high density biological or chemical array onto a solid support. Specifically, the apparatus is made up of a plurality of open ended channels collectively forming a matrix. The matrix has been redrawn and cut such that the pitch of the channels on the loading end is larger than the pitch of the channels on the liquid delivery end. The upper portion of each channel serves as a reservoir, while the opposing end, which has been formed by the redrawing process, is diametrically sized such that liquid in the reservoir is retained by capillary pressure at the delivery end. At any point along the height of the capillary reservoir device, all cross-sectional dimensions and areas are uniformly reduced. In other words, the on-center orientation of any two channels, also referred to as the pitch between 2 channels, measured as a function of the diameter of any cross section, is constant throughout the structure. The liquid within the channels is either printed directly from the tool onto a substrate or transferred to a substrate by a typographical pin plate. In another embodiment, the device may be used in transferring sample between multiwell plates of different well density.
Owner:CORNING INC

Gaming machine

In a gaming machine including a symbol region where reels having symbols are arranged in predetermined arrangement, so that the symbols are displayed in an arranged manner in longitudinal and transverse directions, there are provided a reel control unit that independently controls movement and stop of each of the reels, such that the symbols appearing in the symbol region change and a winning determination unit that determines whether the symbols appearing on a valid line set to span the reels form a predetermined winning pattern, when each of the reels is stopped, layers are set in the symbol region, and in the gaming machine, at least one reel is disposed in each layer, a symbol group is provided in at least one specific reel arranged in a specific layer of the layers in such a manner that symbols capable of forming at least portion of the winning pattern are arranged in the symbol group, at least one of the symbols capable of forming at least portion of the winning pattern overlaps the other reel in the other layer different from the specific layer, and that the symbol group move integrally with the specific reel, the symbols that are disposed in the symbol group in the specific reel can be viewed from a player, and when the symbol group is stopped on the valid line, the winning determination unit make the symbols disposed in the symbol group be included in a determination target and determines whether the winning pattern is formed.
Owner:KONAMI GAMING

Polyester compositions containing cyclobutanediol and articles made therefrom

Described are polyesters containing (a) a dicarboxylic acid component having from 70 to 100 mole % of terephthalic acid residues, and up to 30 mole% of aromatic dicarboxylic acid residues or aliphatic dicarboxylic acid residues; and (b) a glycol component having from 40 to 65 mole % of 2,2,4,4-tetramethyl-1,3-cyclobutanediol residues, and from 35 to 60 mole % of cyclohexanedimethanol residues; wherein the total mole % of the dicarboxylic acid component is 100 mole %, and the total mole % of the glycol component is 100 mole %. The polyesters may be manufactured into articles such as fibers, films, containers, bottles or sheets.
Owner:EASTMAN CHEM CO

Process for producing high-strength polypyrrole film

In polypyrrole films obtained by a process for producing polypyrrole films comprising the steps of forming polypyrrole layers on working electrodes by electrochemical polymerization methods using pyrroles and / or pyrrole derivatives, followed by stripping off said polypyrrole layers, wherein said electrochemical polymerization methods use electrolytes including organic compounds comprising at least one bond or one functional group of ether bond, ester bond, carbonate bond, hydroxyl group, nitro group, sulfone group, and nitryl group and / or halogenated hydrocarbon as lo solvents and wherein said electrolytes include anions including trifluoromethanesulfonate ion and / or plural of fluorine atoms which bond to central atom and said working electrodes are metal electrodes, conductivity can be stably sustainable in the presence of oxygen and are excellent in mechanical strength.
Owner:EAMEX

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
Owner:SEMICON ENERGY LAB CO LTD

Camera-equipped cellular phone

The present invention provides a portable telephone with camera having a camera 7 mounted as opposed to a camera window 22 provided on a casing. The casing is provided with an auxiliary light window 23 adjacent to the camera window 22. Arranged in the rear of the auxiliary light window 23 is an auxiliary light source 8 for emitting light in photographing with the camera 7. The camera window 22 is covered with a main optical cover 4. The auxiliary light window 23 is covered with an auxiliary optical cover 5. A light-shield surface 52 is formed between the main optical cover 4 and the auxiliary optical cover 5. Consequently the degradation of picture quality when the camera 7 and the auxiliary light source 8 are arranged close to each other is prevented.
Owner:KYOCERA CORP

Strain inducing multi-layer cap

A strained transistor includes a silicon transistor, an encapsulating layer of silicon insulating material with an outer surface, and a stress inducing multilayer cap deposited on the outer surface of the encapsulating layer with at least two layers including a layer of rare earth oxide and a layer including silicon. The stress inducing cap can be designed to provide either compressive strain or tensile strain and virtually any desired amount of strain without producing dislocations, defects, and fractures in the structure.
Owner:IQE

Electric contact and method for producing the same and connector using the electric contacts

A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the copper foils on the other side and through-holes simultaneously, and copper foils and insides of the blind holes and the through-holes are plated with copper. A metal ball plated with a noble metal is fixed on the copper foil by solidification of a metal paste to form an electric contact. Two superimposed plastic sheets are formed with holes each having a projection on inner wall of the hole, thereby vertically holding conductors by the projections of the holes of the superimposed plastic sheets. A laser beam machining method fabricates grooves or slits in a workpiece.
Owner:THE FUJIKURA CABLE WORKS LTD

Temperature sensor

A temperature sensor has a thermistor element equipped with a pair of electrodes, a sheath pin into which a pair of signal lines is built, and a cover surrounding the thermistor element. A front part of each signal line is exposed from the sheath pin. The cover is placed at a front part of the temperature sensor. The cover has a contact positioning part with which the front part of the sheath pin is contacted. Cement is filled into a space between the cover and the thermistor element in front of the front part of the contact positioning part. Through the cement, the thermistor element is supported by and fixed to the cover. A front inside space formed in front of the front part of sheath pin and a peripheral inside space formed in a rear side of the front part of the sheath pin are formed between the front part of the sheath pin and the inside surface of the cover.
Owner:DENSO CORP

Universal disc-shaped connectors

The present invention provides a versatile construction kit that can be used to easily form models of virtually any conceivable person, place or thing including a variety of vehicles, buildings, people, animals, weapons, machinery, caricatures, objects and the like. The construction kit comprises plural disc-shaped connectors that are connectable by way of a tongue-and-recessed retainer mechanism and optionally also by way of interconnectable notches by which they can be perpendicularly and detachably interconnected and / or optionally by way of a tongue-in-slot mechanism. The universal connectors are so versatile they can form virtually any geometric, regular, irregular, asymmetric, or symmetric configuration.
Owner:MATOS JOSE R

Semiconductor device and manufacturing method thereof

A semiconductor device includes an element formed on a substrate, at least one insulating film formed on the substrate, and a seal ring formed in the insulating film so as to surround a region where the element is formed and to extend through the insulating film. The semiconductor device further includes a void region including a void and formed in the insulating film in a region located outside the seal ring when viewed from the element.
Owner:PANNOVA SEMIC

Method of forming isolation layer of semiconductor device

A method of forming an isolation layer of a semiconductor device includes forming first trenches in an isolation region of a semiconductor substrate. A spacer is formed on sidewalls of each of the first trenches. Second trenches are formed in the isolation region below the corresponding first trenches. Each second trench is narrower and deeper than the corresponding first trench. A first oxide layer is formed on sidewalls and a bottom surface of each of the second trenches. The first trench is filled with an insulating layer.
Owner:SK HYNIX INC

Method of injection molding thermoplastic resin using supercritical fluid and injection molding apparatus

The present invention provides an injection molding method capable of impregnating a supercritical fluid stably and partially in molten resin in a plasticizing cylinder of an injection molding apparatus. The above object is achieved by providing the method of injection molding which includes measuring a filling amount of the molten resin in the plasticizing cylinder, introducing a supercritical fluid into the molten resin in the plasticizing cylinder while moving back the screw by a predetermined distance without rotating the screw from a position of the screw at the time of completing the measuring, detecting a pressure of the molten resin, and determining based on the pressure an injection start position for the screw.
Owner:MAXELL HLDG LTD

Jumping toy top

A toy top that can repeatedly jump on a curved playing surface to attack an opponent toy top from above. The jumping toy top includes a toy main body, a spinning shaft body having a spinning shaft, and a shaft body supporting portion disposed on the toy main body to support the spinning shaft body. A distal end of the spinning shaft has one side projecting downward more than another diametrically opposite side to configure a portion to contact a playing surface of a playing board. When the jumping toy top spins on a central axis of the toy main body, the contact portion revolves around the central axis of the toy main body in a circular orbit.
Owner:TOMY CO LTD

Filter assembly

A filter assembly for removing material entrained in a fluid stream includes a housing having a head part and a body part, and inlet and outlet ports for the fluid that is to be filtered, in which at least one of the ports is provided in the head part, the head part having a chamber port fluidly connected to the at least one port in the head part, the head and body parts having first formations which enable them to be connected to one another and separated by relative rotation. The assembly includes a filter element for removing material entrained in the fluid stream that can be received in the body part, the filter element and body part having second formations which restrict relative rotation between them, the filter element having a filter port, in which a fluid tight connection can be provided between the filter port and the chamber port by sliding one of them into the other along a first axis. One of the head part and the filter element provides an inclined surface which is inclined relative to the first axis, and the other provides an ejector part which can act against the said inclined surface so as to push the filter element away from the head part as the head part and the body part are separated by relative rotation, so as to free the filter port from the chamber port.
Owner:PARKER HANNIFIN LTD HEMEL HEMPSTEAD

Production method for electronic component and pressure-sensitive adhesive sheet to be used in the production method

A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.The production method of the present invention includes: attaching a pressure-sensitive adhesive sheet to a substrate, the pressure-sensitive adhesive sheet including a base, a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microspheres provided on one surface of the base, and a dielectric layer including a weak pressure-sensitive adhesive layer and an adhesive layer provided on another surface of the base in this order from a side of the base, so that the thermally expandable pressure-sensitive adhesive layer is placed on a side of the substrate; attaching and fixing a plurality of chip-shaped electronic components to a surface of the pressure-sensitive adhesive sheet on a side of the adhesive layer so that electrode surfaces of the plurality of chip-shaped electronic components are placed on the side of the adhesive layer; covering an entire surface of the plurality of chip-shaped electronic components excluding fixed surfaces with a protective substance to obtain an encapsulated body including the plurality of chip-shaped electronic components; subjecting the pressure-sensitive adhesive sheet to heating treatment to cause the thermally expandable microspheres in the thermally expandable pressure-sensitive adhesive layer to expand to decrease an adhesion of the thermally expandable pressure-sensitive adhesive layer and peeling the thermally expandable pressure-sensitive adhesive layer from the substrate; peeling the weak pressure-sensitive adhesive layer from the adhesive layer to obtain a laminate of the adhesive layer and the encapsulated body; and cutting the laminate between the plurality of chip-shaped electronic components to separate individual chip-shaped electronic components.
Owner:NITTO DENKO CORP

Semiconductor device having ESD structure

Semiconductor layers on active areas for transistors in a memory cell region (region A) and a peripheral circuit region (region B) are simultaneously epitaxially grown in the same thickness in which the adjacent semiconductor layers in region A do not come into contact with each other. Only semiconductor layer (10) in region B is also grown from the surface of a substrate which is exposed when only the surface of STI (2) in region B is drawn back, so that a facet (F) of the semiconductor layer 10 is formed outside the active area, followed by ion-implantation to form a high density diffusion layer (11) in region B. Accordingly, short circuit between semiconductor layers on source / drain electrodes of transistors in region A is prevented, and uniformity of the junction depth of the layer (11) of the source / drain electrodes including an ESD region in a transistor of region B is obtained, thereby restricting the short channel effect.
Owner:LONGITUDE LICENSING LTD

Adhesive composition and sheet for forming semiconductor wafer-protective film

There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2), wherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80° C. to 180° C. and a surface tension of 20 to 30 dyne / cm at 25° C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness.
Owner:SHIN ETSU CHEM CO LTD

Composite conductive polymer composition, method of manufacturing the same, solution containing the composition, use of the composition

The purpose is to provide a technique which enables various kinds of conductive polymer composition to be dissolved in an organic solvent and to be used to form a conductive membrane on a target portion easily. Provided is a composite conductive polymer composition, a method of manufacturing the same, and a solution obtained by dissolving the composition in an aromatic solvent, ester-based solvent or ketone-based solvent. The composition is obtained by doping a π-conjugated polymer (β) with a polymer compound (A), wherein the polymer compound (A) is obtained from (a-1) a monomer having a sulfonic acid group and a polymerizable vinyl group in an amount of 20 to 60 mol %, (a-2) a polar monomer having a hydrophilic group and a polymerizable vinyl group in an amount of 20 to 60 mol %, and (a-3) another polymerizable monomer in an amount of 20 to 60 mol %, and the n-conjugated polymer (β) is obtained from a monomer compound selected from the formulas (I) to (III)in the formula (I) to (III), at least one of R1 to R4 represent an alkoxy group of C1 to C10, and the other groups represent H, an alkyl group of C1 to C10, or an alkoxy group of C1 to C10; at least one of R5 and R6 represent an alkoxy group of C1 to C10, and the other group represents H, an alkyl group or an alkoxy group of C1 to C10, or R5 and R6 jointly represent an alkylenedioxy group of C1 to C8; and R7 represents H, an alkyl group of C1 to C6, or an aromatic ring group.
Owner:SOKEN CHEM & ENG CO LTD

Method of forming multi-piled bump

In the method of forming a multi-piled bump, metal balls can be stably and securely piled so as to form the multi-piled bump having a prescribed height. The method of the present invention comprises the steps of: holding a metal wire by a capillary; sparking and melting the wire so as to form metal balls; piling a plurality of the metal balls with applying a load and ultrasonic vibrations thereto, and characterized in that a tail length of the metal wire, which is held by the capillary, is controlled to make a gap between a center of the metal wire and a center of the metal ball one half of a diameter of the metal wire or less.
Owner:FUJITSU LTD

Piezoelectric thin film resonators

A piezoelectric thin film resonator is formed on a base substrate such as made of Si in which the resonance frequency is substantially determined by the lateral size not by the thickness of the resonator, whereby a resonator for use in TCXO, etc. is provided by the thin film technique, which enables to reduce the thickness of the film and the size of the resonator and integration with Si-based IC incorporating the resonator in one identical substrate.
Owner:HITACHI MEDIA ELECTORONICS CO LTD

Three-dimensional-image forming device, three dimensional-image forming method and program

ActiveUS20090207241A1Easily formAccurately examine and recordImage enhancementImage analysisOptical axisEffect light
In a three-dimensional image forming device for forming a phantom three-dimensional image in accordance with an image of an inner face of a tubular structure to be observed, luminance information of pixels corresponding to a prescribed range of each frame image of the tubular structure is obtained under prescribed lighting conditions when an imaging device with an optical axis extending to an axial direction of the tubular structure moves, a relative distances in a depth direction between points and an objective lens is calculated in accordance with the luminance information, pixels corresponding to the prescribed range of each frame image in the inner face of the tubular structure is arrayed in reflection of the relative distance, and the arrayed pixels are combined for a plurality of the frame images to form a three-dimensional image of the inner face of the tubular structure.
Owner:IGARASHI

Figure-forming composition, process for production of figures in three dimensions by using the composition and process for production of three-dimensional structures

It is an object of the present invention to provide a figure-forming composition which enables the initiation of hardening even with a small amount of water and can attain a prescribed hardness, and which is suitable particularly for the production of three-dimensional living body models for surgical training by a rapid prototype process; and provide a three dimensional figure and a three-dimensional structure which are formed by using the composition. The figure-forming composition, for example, comprises a calcium-based material such as hemihydrate gypsum and polyvinyl alcohol resin, wherein the content of the polyvinyl alcohol resin is 2 to 20 weight parts when the total weight of the calcium-based material and the polyvinyl alcohol resin is 100 weight parts.
Owner:NEXT21 KK

Microphone manufacturing method

A sacrifice layer 36 is exposed through a chemical charging port 31 so that the sacrifice layer 36 and sacrifice layer 35 are etched and removed by an etchant introduced from the chemical charging port 31. Since the surface of an Si substrate 22 is exposed to an etching window 34 corresponding to the removed portion of the sacrifice layer 35, the Si substrate 22 is crystal anisotropically etched below the etching window 34 to form a cavity 23. In contrast, in a space corresponding to the etched and removed portion of the sacrifice layer 36, since the surface of the Si substrate 22 is covered with a protective film 32, the Si substrate 22 is not etched to form a bent hole 26 therein. The cavity can be formed in the semiconductor substrate by an etching process from the surface side. Moreover, a bent hole having a great acoustic resistance can be easily formed.
Owner:MMI SEMICON CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products