12results about "Decalcomania" patented technology

Provided herein is a printing device (1) for printing a substance onto a target surface (TS) of a target (T), comprising a carrier (2) having, on a first main surface (21), a carrier surface (2s) for carrying a sample (SB1, SB2, SB3) of the substance to be printed, a heater arrangement (23) for heating the carrier surface to evaporate a portion of the sample on the carrier surface side and induce a vapor pressure that transfers the remaining portion of the sample to the target surface, and a structured thermal buffer layer (25) for providing a position-dependent delay in heat transfer from the heater arrangement to the carrier surface.

A printing device (1) is provided herein for printing a substance on a target surface (TS) of a target (T). The printing device comprises a carrier (2) having at a first main side (21) a carrier surface (2s) for carrying a specimen (SB1, SB2, SB3) of the substance to be printed. The printing device further comprises a heater facility (23) for heating the carrier surface to vaporize a portion of the specimen at the side of the carrier surface and inducing a vapor pressure that causes a transfer of a remainder of said specimen towards the target surface and a structured thermal buffer layer (25) that provides for a position dependent delay with which heat is transferred from the heater facility to the carrier surface.

The embodiment of the invention provides a preparation method of a conductive pattern. The method comprises the following steps: providing an imprint mold with a first pattern shape on a male mold of the imprint mold, smearing a catalyst colloid on the male mold, forming a first pattern on the surface of the catalyst colloid, contacting the male mold with a substrate for 1 s < = T < = 10 min under the pressure of 1 Mpa < = P < = 5 Mpa, so that the catalyst colloid with the first pattern is transferred to the substrate, and soaking the substrate in the metal plating solution to obtain the conductive pattern. Compared with the traditional photoetching technology, the conductive pattern prepared by the method does not need the complicated steps of photoresist coating, exposure, development and the like, and the transfer printing process of the first pattern can be realized only by applying certain pressure to the first pattern and the substrate. The whole preparation process does not need assistance of a light source and is not limited by the light source. The catalyst colloid only needs to be smeared on the male die and then transferred to the base plate, the using amount of the catalyst colloid is saved, the thickness of the metal coating can be automatically adjusted according to needs, and certain operation flexibility is achieved.

An apparatus and method are disclosed for transferring patterns carried by a web of a deformable plastics material onto substrates. The apparatus comprises a nip defined between at least one nip roller and a backing support through which the substrates are passed simultaneously with the web and by means of which pressure is applied to effect transfer of the patterns from the web to the substrates. In the invention, a web heater and a web tensioner are arranged upstream of the nip, and a control unit is provided for controlling the web heater and the web tensioner in dependence upon data indicative of the lengths and widths of the patterns on the web prior to transfer, or of the patterns on the substrates after transfer, so as to ensure that, after transfer to the substrates, the patterns conform to a desired length and width.

An apparatus and method are disclosed for transferring patterns carried by a web of a deformable plastics material onto substrates. The apparatus comprises a nip defined between at least one nip roller and a backing support through which the substrates are passed simultaneously with the web and by means of which pressure is applied to effect transfer of the patterns from the web to the substrates. In the invention, a web heater and a web tensioner are arranged upstream of the nip, and a control unit is provided for controlling the web heater and the web tensioner in dependence upon data indicative of the lengths and widths of the patterns on the web prior to transfer, or of the patterns on the substrates after transfer, so as to ensure that, after transfer to the substrates, the patterns conform to a desired length and width.

An apparatus and method for transferring a pattern on a web of deformable plastic material onto a substrate is disclosed. The apparatus includes a pressure roller located between at least one pressure roller and a support through which the substrate and the web pass simultaneously and through which pressure is applied, thereby transferring the pattern from the web onto the substrate. In the present invention, the mesh heater and the mesh tensioner are arranged upstream of the pressure roller, and a control unit is provided for controlling the mesh heater and the mesh tensioner according to data indicative of the length and width of the pattern on the mesh before the pattern is transferred or the length and width of the pattern on the substrate after the pattern is transferred, therefore, after the pattern is transferred to the base material, the length and the width of the pattern meet the required requirements.

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

A printing device (1) for printing a substance on a target surface (TS) of a target (T) is provided. The printing device comprises a carrier (2) having, on a first main side (21), a carrying surface (2s) for carrying a sample (SB1, SB2, SB3) of a substance to be printed. The printing apparatus further comprises: a heating device (23) for heating the bearing surface to evaporate a portion of the sample on the bearing surface side and generating a vapor pressure that transports a remaining portion of the sample toward a target surface; and a structured thermal buffer layer (25) that provides a position-dependent delay with which heat is transferred from the heating device to the bearing surface.

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

Provided is a method for producing a circuit pattern, with which it is possible to satisfactorily apply plating to a circuit pattern attached to a release sheet and to satisfactorily peel the circuit pattern to which plating has been applied from the release sheet. A method for manufacturing a circuit pattern, comprising: a step for applying plating to a predetermined portion on the surface of a metal plate (11); a step for attaching a release sheet (14) to the back surface of the plated metal plate (11); a step for providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step for manufacturing a circuit pattern on the metal plate (11) provided with the resist pattern (17). And a step for forming a circuit pattern (2) attached to the release sheet (14) by etching.