36results about "Decalcomania" patented technology

A separation layer is formed over a substrate having a depressed portion, using a silane coupling agent; a conductive layer and an insulating layer that covers the conductive layer are formed in the depressed portion over the separation layer; and a sticky member is attached to the insulating layer, then the conductive layer and the insulating layer are separated from the substrate. Alternatively, after these steps, a flexible substrate is attached to the conductive layer and the insulating layer.

A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

The invention discloses a lead-free electroplating method based on a reserved larger finger connection position. The method comprises the following steps that a production board is provided, the surface of the production board comprises an external line area and a finger area, and finger positions to be electroplated are made in the finger area; the external line area in the production board is silk-screened with anti-electricity gold printing ink or a coating adhesive tape, and copper surfaces of the finger positions are exposed; a copper surface, not formed by etching, of the external line area is used for conducting, and the finger positions are electroplated to form coatings; an external line is prepared in the external line area; and solar mask preparation, surface processing and molding are carried out on the production board successively to form a finished board. According to the method, the external line part is prepared after that the larger finger connection position is reserved, a final graph is formed via twice graph transfer, the problem of a residual electroplating lead of a traditional method is avoided, the signal completeness and anti-breakdown performance can be improved, and the problem that a signal line is too thin and etched of a traditional lead-removing chemical etching method is avoided.