6results about "Decalcomania" patented technology

Provided herein is a printing device (1) for printing a substance onto a target surface (TS) of a target (T), comprising a carrier (2) having, on a first main surface (21), a carrier surface (2s) for carrying a sample (SB1, SB2, SB3) of the substance to be printed, a heater arrangement (23) for heating the carrier surface to evaporate a portion of the sample on the carrier surface side and induce a vapor pressure that transfers the remaining portion of the sample to the target surface, and a structured thermal buffer layer (25) for providing a position-dependent delay in heat transfer from the heater arrangement to the carrier surface.

An apparatus and method are disclosed for transferring patterns carried by a web of a deformable plastics material onto substrates. The apparatus comprises a nip defined between at least one nip roller and a backing support through which the substrates are passed simultaneously with the web and by means of which pressure is applied to effect transfer of the patterns from the web to the substrates. In the invention, a web heater and a web tensioner are arranged upstream of the nip, and a control unit is provided for controlling the web heater and the web tensioner in dependence upon data indicative of the lengths and widths of the patterns on the web prior to transfer, or of the patterns on the substrates after transfer, so as to ensure that, after transfer to the substrates, the patterns conform to a desired length and width.

An apparatus and method for transferring a pattern on a web of deformable plastic material onto a substrate is disclosed. The apparatus includes a pressure roller located between at least one pressure roller and a support through which the substrate and the web pass simultaneously and through which pressure is applied, thereby transferring the pattern from the web onto the substrate. In the present invention, the mesh heater and the mesh tensioner are arranged upstream of the pressure roller, and a control unit is provided for controlling the mesh heater and the mesh tensioner according to data indicative of the length and width of the pattern on the mesh before the pattern is transferred or the length and width of the pattern on the substrate after the pattern is transferred, therefore, after the pattern is transferred to the base material, the length and the width of the pattern meet the required requirements.

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated metal plate (11); a step of providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by etching the metal plate (11) provided with the resist pattern (17).

Provided is a method for producing a circuit pattern, with which it is possible to satisfactorily apply plating to a circuit pattern attached to a release sheet and to satisfactorily peel the circuit pattern to which plating has been applied from the release sheet. A method for manufacturing a circuit pattern, comprising: a step for applying plating to a predetermined portion on the surface of a metal plate (11); a step for attaching a release sheet (14) to the back surface of the plated metal plate (11); a step for providing a resist pattern (17) covering the plating on the surface of the metal plate (11); and a step for manufacturing a circuit pattern on the metal plate (11) provided with the resist pattern (17). And a step for forming a circuit pattern (2) attached to the release sheet (14) by etching.