Provided is a method for producing a circuit pattern, the method capable of satisfactorily plating a circuit pattern bonded to a release sheet and satisfactorily peeling the plated circuit pattern from the release sheet. The method for producing a circuit pattern includes: a step of plating a predetermined portion on a surface of a
metal plate (11); a step of bonding a release sheet (14) to a back surface of the plated
metal plate (11); a step of providing a
resist pattern (17) covering the plating on the surface of the
metal plate (11); and a step of forming a circuit pattern (2) bonded to the release sheet (14) by
etching the metal plate (11) provided with the
resist pattern (17).