36results about "Decalcomania" patented technology

A separation layer is formed over a substrate having a depressed portion, using a silane coupling agent; a conductive layer and an insulating layer that covers the conductive layer are formed in the depressed portion over the separation layer; and a sticky member is attached to the insulating layer, then the conductive layer and the insulating layer are separated from the substrate. Alternatively, after these steps, a flexible substrate is attached to the conductive layer and the insulating layer.

A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Provided is a method for manufacturing a ductile circuit. The method uses a "roll-to-roll" type process, and involves: (S1) integrating a conductive layer and a first auxiliary substrate layer into one body and then making same into a coiled material, using one end of the coiled material as an initial feeding unrolling end, and extending same to a set length after unrolling; (S2) patterning the conductive layer of the coiled material unrolled to the set length to prepare a required circuit structure; (S3) using a first elastomer layer provided with a first auxiliary substrate as a feeding end, sending same to a pair of rollers, transfer printing the circuit structure to the surface of the first elastomer layer, and then removing the first auxiliary substrate layer; (S4) assembling a chip and the circuit structure together by using double-roll pressing and a bonding difference so as to obtain a ductile circuit layer semi-finished product; and (S5) transfer printing a second elastomer layer to the surface of the ductile circuit layer semi-finished product, wherein the second elastomer layer is used for a packaging layer of the ductile circuit layer semi-finished product. The method improves the production efficiency of the ductile circuit by combining the process of making the ductile circuit with a roll-to-roll motion platform.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

The invention discloses a lead-free electroplating method based on a reserved larger finger connection position. The method comprises the following steps that a production board is provided, the surface of the production board comprises an external line area and a finger area, and finger positions to be electroplated are made in the finger area; the external line area in the production board is silk-screened with anti-electricity gold printing ink or a coating adhesive tape, and copper surfaces of the finger positions are exposed; a copper surface, not formed by etching, of the external line area is used for conducting, and the finger positions are electroplated to form coatings; an external line is prepared in the external line area; and solar mask preparation, surface processing and molding are carried out on the production board successively to form a finished board. According to the method, the external line part is prepared after that the larger finger connection position is reserved, a final graph is formed via twice graph transfer, the problem of a residual electroplating lead of a traditional method is avoided, the signal completeness and anti-breakdown performance can be improved, and the problem that a signal line is too thin and etched of a traditional lead-removing chemical etching method is avoided.

The invention relates to the technical field of hot stamping, in particular to a high-temperature hot stamping film for making conductive circuits, a manufacturing method and application thereof. The high-temperature hot stamping film includes a base layer, a release layer, a conductive layer and a hot-melt adhesive layer in sequence, and the required conductive lines can be hot-stamped at a temperature of 160-180°C by using ironing heads of different shapes. The conductive circuit hot stamping special film of the present invention has a simple structure and low cost, and can be used to prepare various irregular conductive circuits, such as RFID antennas, connecting wires on PCB boards, and the like.

Methods are provided for producing large volumes of small antenna arrays. In one embodiment, the method comprises the steps of creating an antenna array pattern as a computer file, printing the created pattern onto the surface of a suitable transfer paper, placing the printed image surface in contact with the surface of a material to be etched, and transferring the printed image to the surface of the material to be etched. The transfer can be effected by any combination of chemicals, heat, and / or pressure. After transfer of the printed image, the transfer paper is removed. The step of removing the transfer paper optionally includes wetting the transfer paper in a manner that dissolves the transfer paper leaving the printed antenna pattern on the surface of the material to be etched. The method further includes the step of etching the non-printed portions of the material, preferably by chemical etching, and removing the printed pattern from the surface of the material to yield an antenna array comprising a non-etched portion of the substrate surface. Arrays, and substrates having an etch-resistant mask for making the arrays, are also provided.