5results about "Pre-fabricated insulating pattern transfer" patented technology

An apparatus and method are disclosed for transferring patterns carried by a web of a deformable plastics material onto substrates. The apparatus comprises a nip defined between at least one nip roller and a backing support through which the substrates are passed simultaneously with the web and by means of which pressure is applied to effect transfer of the patterns from the web to the substrates. In the invention, a web heater and a web tensioner are arranged upstream of the nip, and a control unit is provided for controlling the web heater and the web tensioner in dependence upon data indicative of the lengths and widths of the patterns on the web prior to transfer, or of the patterns on the substrates after transfer, so as to ensure that, after transfer to the substrates, the patterns conform to a desired length and width.

An apparatus and method for transferring a pattern on a web of deformable plastic material onto a substrate is disclosed. The apparatus includes a pressure roller located between at least one pressure roller and a support through which the substrate and the web pass simultaneously and through which pressure is applied, thereby transferring the pattern from the web onto the substrate. In the present invention, the mesh heater and the mesh tensioner are arranged upstream of the pressure roller, and a control unit is provided for controlling the mesh heater and the mesh tensioner according to data indicative of the length and width of the pattern on the mesh before the pattern is transferred or the length and width of the pattern on the substrate after the pattern is transferred, therefore, after the pattern is transferred to the base material, the length and the width of the pattern meet the required requirements.

The invention relates to a printed circuit board (1), wherein solder contacts (2) with components (31, 32,...) soldered thereon, conductor tracks (4) and areas (5) isolating the solder contacts (2) and / or the conductor tracks (4) from each other are provided on at least one surface (11) of the printed circuit board (1). A first film (61) acting as a solder stop layer is applied to at least one first portion of the isolating areas (5), preferably the major part of the isolating areas (5). At least one of the components (31) is arranged in a direction (RS) which is substantially perpendicular to the surface (11) of the printed circuit board (1) between the printed circuit board (1) and the first film and is at least partially, particularly completely, covered by the first film (4).

A laminator according to an exemplary embodiment of the present invention includes: a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part for adjusting tension of the substrate and the film transferred to the heating roller part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the heating roller part bonds the substrate and the film; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.