73results about "Pre-fabricated insulating pattern transfer" patented technology

A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.

The invention provides a method to form a pattern of a functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. The mask material is removed from the substrate, forming the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.

A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.

Methods are provided for producing large volumes of small antenna arrays. In one embodiment, the method comprises the steps of creating an antenna array pattern as a computer file, printing the created pattern onto the surface of a suitable transfer paper, placing the printed image surface in contact with the surface of a material to be etched, and transferring the printed image to the surface of the material to be etched. The transfer can be effected by any combination of chemicals, heat, and / or pressure. After transfer of the printed image, the transfer paper is removed. The step of removing the transfer paper optionally includes wetting the transfer paper in a manner that dissolves the transfer paper leaving the printed antenna pattern on the surface of the material to be etched. The method further includes the step of etching the non-printed portions of the material, preferably by chemical etching, and removing the printed pattern from the surface of the material to yield an antenna array comprising a non-etched portion of the substrate surface. Arrays, and substrates having an etch-resistant mask for making the arrays, are also provided.

Methods for electrodeposition of conductive material on a conductive substrate that contains a pattern of a chemisorbed surfactant formed by a stamp having a patterned surface which is pressed onto the surface of the substrate for printing the substrate. Electrodeposition occurs by immersing the patterned substrate in a plating bath upon application of deposition potential or current to the conductive substrate. In embodiment, the chemisorbed surfactant on the surface of the substrate acts as a positive resist so that electrodeposition occurs on regions of the substrate not covered with surfactant. In another embodiment, electrodeposition occurs preferentially in regions of the substrate covered with the chemisorbed surfactant.

A method for forming a pattern is provided that includes: providing a cliché having a plurality of convex patterns; applying an adhesive force reinforcing agent onto each surface of the convex patterns; forming an etching object layer on a substrate and then applying ink onto an upper portion of the etching object layer; attaching the cliché and the substrate to each other such that the convex patterns onto which the adhesive force reinforcing agent is applied can come in contact with the ink applied onto the etching object layer; and forming ink patterns which selectively remain on the etching object layer by separating the substrate and the cliché from each other.

The invention provides a method to form a pattern of functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. Contact of an adhesive material to an exterior surface opposite the substrate and separation of the adhesive from the substrate forms the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.

The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width.

Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.

Disclosed is a paste pattern formation method comprising the steps of: forming a transfer pattern material on a film base material to prepare a transfer film; sticking the transfer film on a substrate on which a transfer pattern is formed so that the transfer pattern material contacts the substrate; separating the film base material from the transfer pattern material; filling a paste into the transfer pattern depression; solidifying the paste; and removing the transfer pattern material.

A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.

A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.

An article includes a polymeric film having a major surface, a discontinuous layer of a catalytic material on the major surface, and a metal pattern on the catalytic material. The discontinuous layer of catalytic material has an average thickness of less than 200 angstroms. Methods of forming these articles are also disclosed.

A multi-layer standoff / mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings.

Disclosed is a paste pattern formation method comprising the steps of: forming a transfer pattern material on a film base material to prepare a transfer film; sticking the transfer film on a substrate on which a transfer pattern is formed so that the transfer pattern material contacts the substrate; separating the film base material from the transfer pattern material; filling a paste into the transfer pattern depression; solidifying the paste; and removing the transfer pattern material.

A method for forming a pattern is provided that includes: providing a cliche having a plurality of convex patterns; applying an adhesive force reinforcing agent onto each surface of the convex patterns; forming an etching object layer on a substrate and then applying ink onto an upper portion of the etching object layer; attaching the cliche and the substrate to each other such that the convex patterns onto which the adhesive force reinforcing agent is applied can come in contact with the ink applied onto the etching object layer; and forming ink patterns which selectively remain on the etching object layer by separating the substrate from each other.

A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating / softening on the intermediate transfer base; and transferring a heated / softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly to the first pattern formation.

A method produces a conductive paste comprising 15-20% by weight of PDMS and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of PDMS to a heptane diluted PDMS low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of PDMS. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste.

A method of fabricating a printing plate includes: preparing a substrate; forming a metal layer on an entire surface of the substrate; forming a resist pattern on the metal layer, the resist pattern having a fine pattern exposing a portion of the metal layer; wet etching the exposed metal layer, and removing the resist pattern to form a metal layer pattern exposing a portion of the substrate; wet etching the exposed substrate, and removing the metal layer pattern to form a recessed pattern; and forming a compensation layer on an entire surface of the substrate where the recessed pattern is formed.

Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.

A method of metal deposition may include chemically modifying a surface of a substrate to make the surface hydrophobic. The method may further include depositing a layer of metal over the hydrophobic surface and masking at least a portion of the deposited metal layer to define a conductive metal structure. The method may also include using an etching agent to etch unmasked portions of the deposited metal layer.

A printed circuit board can be formed by a method that includes the step of cutting a circuit pattern out of a low cost plastic sheet material, and transferring the pattern onto a tape. The tape, with the pattern adhesively attached, is transferred onto a conductive film surface on a dielectric board. Thereafter, the tape is removed, leaving the pattern on the conductive film. An acid-etching step is performed on the exposed areas of the conductive film, after which the pattern is removed from the non-etched areas of the conductive film.

The present invention relates to a printing method using a structure coated with ultraviolet radiation responsive material. Wetting and print transfer from a printing patterned transfer surface is enhanced by applying an ultraviolet radiation responsive material to the patterned transfer surface. Ultraviolet activation of the ultraviolet responsive coating is performed during a transfer of printing material to a substrate. The technique increases precision of the printing process and is useful for transfer of printing material to a substrate in order to establish printed circuit components such as circuit traces and printed circuit elements on the substrate. In a particular configuration the ultraviolet radiation responsive material can be made of azobenzene material or free radical initiators.

The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

A multi-layer standoff / mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings.

An imprint process of a thermosetting material is described, comprising: providing a mold including pattern structures, wherein convex portions and concave portions of the pattern structures are covered with a transferred material layer; providing a substrate, wherein a thermosetting material layer and a sacrificial layer cover the substrate in sequence; performing an imprint step to transfer the transferred material layer on the convex portions onto a first portion of the sacrificial layer; etching a second portion of the sacrificial layer and the underlying thermosetting material layer by using the transferred material layer as a mask; and performing a wet stripping step by using a stripper to completely etch the sacrificial layer and the overlying transferred material layer, wherein the stripper has a first etching rate and a second etching rate to the thermosetting material layer and the sacrificial layer respectively, and a ratio of the second etching rate to the first etching rate is greater than or equal to 30.