Method for Producing Patterned Structures by Printing a Surfactant Resist on a Substrate for Electrodeposition

a technology of surfactant resist and substrate, applied in the field of lithography, can solve the problems of inability to use in conjunction with sputter deposition or evaporation, inability to deposit material from the vapor phase, and inability to produce patterned structures. the effect of high energy, low cost and considerable cos
US20080283405A1Inactive Publication Date: 2008-11-20THE JOHN HOPKINS UNIV SCHOOL OF MEDICINE
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
THE JOHN HOPKINS UNIV SCHOOL OF MEDICINE
Publication Date
2008-11-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

Methods for electrodeposition of conductive material on a conductive substrate that contains a pattern of a chemisorbed surfactant formed by a stamp having a patterned surface which is pressed onto the surface of the substrate for printing the substrate. Electrodeposition occurs by immersing the patterned substrate in a plating bath upon application of deposition potential or current to the conductive substrate. In embodiment, the chemisorbed surfactant on the surface of the substrate acts as a positive resist so that electrodeposition occurs on regions of the substrate not covered with surfactant. In another embodiment, electrodeposition occurs preferentially in regions of the substrate covered with the chemisorbed surfactant.
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Description

RELATED APPLICATIONS

[0001] This application is a continuation-in-part of U.S. application Ser. No. 11 / 638,137, filed Dec. 13, 2006, which is a divisional of U.S. application Ser. No. 10 / 836,021, filed Apr. 29, 2004, now abandoned, which claims priority to U.S. Provisional Application Nos. 60 / 523,498, filed Nov. 19, 2003 and 60 / 467,248, filed May 1, 2003, the disclosures of which are hereby incorporated by reference in their entireties.GOVERNMENT INTEREST

[0002] This invention was made with government support under NASA Contract NGT5-50372 and NSF Grant DMR05-20491. The government has certain rights in the invention.FIELD OF THE INVENTION

[0003] This invention relates to lithography and, in particular, to a method of high resolution lithography using a surfactant pattern to direct the electrolytic deposition of materials on a substrate surface. The process can be used to produce structures patterned in one, two and three dimensions.BACKGROUND OF THE INVENTION

[0004] Electrodeposition of con...

Claims

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