Standoff/mask structure for electrical interconnect

Abstract

A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings.

Description

BACKGROUND OF THE DISCLOSURE[0001] The subject disclosure is generally directed to techniques for interconnecting circuit structures.[0002] Circuit structures such as circuit boards, integrated circuit die, and circuit packages are mechanically and / or electrically interconnected by a variety of techniques and it can be difficult to reliably and efficiently mechanically and electrically interconnect circuit structures.[0003] FIG. 1 is a schematic plan view of an embodiment of an interconnected electrical circuit structure.[0004] FIG. 2 is a schematic elevational view of the interconnected electrical circuit structure of FIG. 1.[0005] FIGS. 3, 4, 5, 6, 7, 8 and 9 are schematic transverse cross-sectional views illustrating various stages in the manufacture of the interconnected circuit structure of FIG. 1.DETAILED DESCRIPTION OF THE DISCLOSURE[0006] FIG. 1 and FIG. 2 are a schematic plan view and a schematic elevational cross-sectional view of an embodiment of an interconnected circuit...

AI Technical Summary

Problems solved by technology

Circuit structures such as circuit boards, integrated circuit die, and circuit packages are mechanically and / or electrically interconnected by a variety of techniques and it can be difficult to reliably and efficiently mechanically and electrically interconnect circuit structures.

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