There are many inventions described and illustrated herein. In one aspect, there is described a thin film or
wafer encapsulated MEMS, and technique of fabricating or manufacturing a thin film or
wafer encapsulated MEMS employing anti-
stiction techniques. In one embodiment, after encapsulation of the MEMS, an anti-
stiction channel is formed thereby providing “access” to the chamber containing some or all of the active members or electrodes of the mechanical structures. Thereafter, an anti-
stiction fluid (for example, gas or gas-vapor) is introduced into the chamber via the anti-stiction channel. The anti-stiction fluid may deposit on one, some or all of the active members of the mechanical structures thereby providing an anti-stiction layer (for example, a
monolayer coating or self-assembled
monolayer) and / or out-gassing molecules on such members or electrodes. After introduction and / or application of the anti-stiction fluid, the anti-stiction channel may be sealed, capped, plugged and / or closed.