2results about How to "Increase the number density" patented technology

This invention belongs to the field of aluminum alloy materials technology, and relates to a high-strength and ductile aluminum alloy and its preparation method. The alloy comprises, by mass fraction: 2-6% Mg, 0.4-0.9% Mn, 0.2-0.6% Si, 0.05-0.15% Sn, Fe≤0.15%, Ti≤0.1%, with the balance being Al. By introducing Sn, a low-melting-point MgSiSn primary phase is formed in the as-cast stage, and transforms from a continuous network to a discontinuous granular structure during homogenization heat treatment, weakening the adverse effects of brittle intermetallic compounds at grain boundaries. Simultaneously, Sn dissolved in the aluminum matrix forms a nanoscale MgSiSn precipitate during homogenization, serving as a heterogeneous nucleation core for the Mn-containing second phase, lowering its nucleation energy barrier, and promoting high-density, fine, and uniform precipitation, thereby achieving a synergistic improvement in the alloy's strength and ductility.

This invention discloses a high-strength, high-conductivity copper-silver alloy for communication connectors and its preparation method, belonging to the technical field of copper alloy materials. The process includes: S1 melting and casting, the alloy containing Ag and one or more of the amplitude modulation decomposition inducing elements Ni, Co, Al, Ti, and Fe; S2 homogenization treatment; S3 cooling at 10-50℃ / h to 350-550℃ and holding for 2-24h to induce amplitude modulation decomposition and form a nanoscale periodic amplitude modulation structure; S4 cold deformation processing; S5 multi-stage gradient aging: holding at 200-350℃ for 1-5h, heating at 5-20℃ / h to 400-500℃ and holding for 2-8h, cooling at ≤10℃ / h to 300-350℃ and holding for 4-12h to form a periodically arrayed coherent nano-precipitated phase; S6 preparing an inner self-lubricating plating layer and an outer protective coating. This invention guides the orderly growth of precipitates using an amplitude-modulated template, resulting in an alloy with tensile strength ≥470MPa, conductivity ≥89%IACS, elongation ≥6%, and excellent high-temperature stability, making it suitable for connectors used in extreme environments such as 5G communication and deep space exploration.