297 results about "Film frame" patented technology

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

The invention discloses a covered stent with side openings and a binding method of the covered stent. The covered stent is helpful for accurately positioning stent openings and renal artery openings, so as to improve the operation success ratio. The covered stent comprises a plurality of ring-shaped waveform stent units and a membrane sewn up with the stent units to form a tubular piece, wherein at least one side opening is opened on the tubular piece, an opening fixing filament is sewn on the opening site to support the opening. The covered stent can be used in surgical operation equipment.

A protective shipper comprises a cover and a base that are held together by a latching member. The base is configurable to retain and protect semiconductor wafers or film frames with wafers within a storage pocket. The base comprises latching member and a support wall that defines a storage pocket. The cover encloses the storage pocket. One or both of the cover may receive recesses for gripability. The cover may receive one or more latching apertures configured to minimize unintended unlatching. The shipper of the present invention may be manufactured in a mold capable of producing film frame or wafer containing configurations of the shipper by using an interchangeable mold insert.

In one embodiment, a movie set includes a motion-picture camera and a visible-talent tracking system having several elements. Based on the camera's characteristics, items in a portion of the movie set called the view frustum will appear in focus in the film. The camera and a camera-tracking system provide camera-location, orientation, and settings information to a culling processor. The culling processor delineates the location and dimensions of the view frustum based on the received camera information. Wireless tags are attached to talent on set. A tag-locating system tracks the real-time respective locations of the wireless tags and provides real-time spatial information regarding the tags to the culling processor, which determines which tags, if any, are considered to be within the view frustum, and provides information associated with the intra-frustum tags to a track recorder for recording along with the corresponding film frames. That information is variously used after editing.

The present invention provides a temporary carrier bonding and detaching process. A first surface of a semiconductor wafer is mounted on a first carrier by a first adhesive layer, and a first isolation coating disposed between the first adhesive layer and the first carrier. Then, a second carrier is mounted on the second surface of the semiconductor wafer. The first carrier is detached. Then, the first surface of the semiconductor wafer is mounted on a film frame. The second carrier is detached. The method of the present invention utilizes the second carrier to support and protect the semiconductor wafer, after which the first carrier is detached. Therefore, the semiconductor wafer will not be damaged or broken, thereby improving the yield rate of the semiconductor process. Furthermore, the simplicity of the detaching method for the first carrier allows for improvement in efficiency of the semiconductor process.

Whether or not an input video signal is an video signal telecine-converted is decided on the basis of correlation values between an interpolated field and fields located one-field-period before and after the interpolated field. Where the interpolated field is an editing point field of a film frame of one field, adaptive interpolating processing is executed instead of film interpolating processing.

A method and a related apparatus for compressing images included in media content and editing the media content. The method can include providing an image-matching algorithm and a memory device, using the image-matching algorithm to identify images that are similar in a selection of media content extracting the images that are similar from the selection of media content, storing a single image that represents the extracted images in the memory device, and replacing the extracted images in the selection of media content with a metadata link that points to the single image. The method can further include providing a previously edited video program that originally was created from film footage, determining which of the video fields from the program include a unique film frame from the footage, and extracting the video fields from the program that include a unique film frame.

The invention discloses a method for manufacturing a polydimethylsiloxane (PDMS) film with an integrated microstructure. The method is characterized in that firstly a PDMS rotary die technology is utilized to replicate a targeted microstructure from a female die manufactured based on micro-processing technology to the surface of a hot melting or water soluble material so as to form a sacrificial layer die with a meltable or dissolution characteristic; and then the surface of the manufactured sacrificial layer die is coated with a thin layer of PDMS rotationally, simultaneously an outer film frame is attached to the PDMS in a pressing manner, finally a PDMS film structure is released through hearing or smelting in water or dissolving the sacrificial layer die after the PDMS is cured, and the transferring and application of the PDMS film are achieved with the assistance of the outer film frame. The method utilizes the sacrificial layer die to manufacture and release the PDMS film with the integrated structure, prevents traditional manual mechanical peeling methods from damaging the PDMS film, substantially reduces difficulty in manufacturing of fragile PDMS film structure, increases the success rate of manufacturing the PDMS film and can achieve the high-yield mass production of the PDMS film structure.

An interlockable film frame carrier has central and peripheral portions for securely storing a film frame, the film frame supporting a film, a semiconductor wafer disposed on the film. The central portion has structure for supporting the semiconductor wafer and for allowing access to a lower surface of the stored film frame. The peripheral portion of the film frame carrier includes structure for supporting a peripheral portion of the film frame and matable stacking members. When the film frame is stored, two film frame carriers are interlocked by mating the stacking members. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72 (b).

A mechanism for handling semiconductor wafers includes a feed section which comprises a vertically movable elevator able to hold a number of vertically spaced carriers. Each carrier has a film frame mounted thereon for supporting a wafer. A pulling mechanism pulls a selected carrier out of the elevator along a first axis and into a pick and place section. A transfer mechanism removes individual dies from the wafer and moves them to a flip station along a second axis oriented perpendicularly to the first axis. The transfer mechanism can move different distances along the second axis to be able to remove dies arranged in a row along the second axis. The flip station is driven by a single motor to both lower and invert the dies.

A C4 grind tape and a laser-ablative adhesive layer are formed on a front side of a semiconductor substrate. A carrier substrate is thereafter attached to the laser-ablative adhesive layer. The back side of the semiconductor substrate is thinned by polishing or grinding, during which the carrier substrate provides mechanical support to enable thinning of the semiconductor substrate to a thickness of about 25 μm. A film frame tape is attached to the back side of the thinned semiconductor substrate and the laser-ablative adhesive layer is ablated by laser, thereby dissociating the carrier substrate from the back side of the C4 grind tape. The assembly of the film frame tape, the thinned semiconductor substrate, and the C4 grind tape is diced. The C4 grind tape is irradiated by ultraviolet light to become less adhesive, and is subsequently removed.

A continuous film scanning system for high resolution digital archival and duplication of motion picture film on a frame by frame basis. Film is driven through the film scanning system through the use of rollers and maintained at a consistent tension throughout the scanning process. Optical interrogation of the perforations associated with each film frame is used to trigger digital image capture. The continuous film scanning system is particularly well adapted to safely handle imperfect or damaged film stock.

An exposed film package for preserving one strip of exposed photographic film includes a film sheath, which has plural pockets. Plural film pieces are formed by cutting the one strip of the exposed film, and contained respectively in the pockets in the film sheath. An index photograph is constituted of photographic paper, on which positive images of frames from the one strip of the exposed film are printed. The photographic paper has a size substantially equal to the film pieces. The positive images are formed in reducing a size of the frames, and grouped in association with the film pieces. Groups of the positive images are arranged in consideration of an order of exposure of the frames. The index photograph is contained in one of the pockets in association with the film pieces constituting the one strip.

A cassette, particularly suitable for storing film frames, in a preferred embodiment utilizes an integral shell portion with a plurality of shelves to support a plurality of axially aligned horizontally stacked film frames. A door, preferably vacuum-formed, covers the open front of the shell to enclose the film frames therein. The cassette may have a robotic top and collapsible handles. In a preferred embodiment the handles are U-shaped and slideably engaged with a pair of brackets integral with the sidewall. In another embodiment the handles pivot about an axis parallel to the top of the cassette and attach by a pair of split prongs insertable into a pair of receiving holes. A pair of film frame retention members are pivotally and rotatably attached at the sides of the shell inside the front opening. The restraints are pivotable between an open position where they are aligned with the sidewalls and pointing toward the open front to a film frame retention position where they are rotated to face inwardly in an approximately radial direction. The film frame retention members may be actuated by handles positioned on the top of the enclosure. Alternatively, the retention members may be automatically actuated by a helical cam mechanism with a engagement portion extending below the cassette to contact a surface upon which the cassette is placed. The members may be biased and spring loaded such that they remain in the retention position and/or the open position when so placed.

The invention relates to a walking winding machine, which is provided with a walking mechanism, a base plate, an upright post and a film frame, wherein the film frame is arranged on the upright post, a lifting device is arranged on the base plate, the upright post is connected on the lifting device, the walking mechanism is provided with walking wheels which comprise a left wheel and a right wheel, the walking mechanism is also provided with a sensor, the sensor controls the work of a driving motor of the walking wheels positioned at the side of a rolling element, the rolling element is connected on a swinging mechanism, and the sensor induces the action of the swinging mechanism. The invention can realize the maneuvering under the driven effect by the motor, the automatic turning can be realized, and the film winding work can be completed automatically when the walking winding machine is maneuvered to the position of an object. At the same time, the upright post of the invention can be lifted. Because the upright post per se is a height orientation part, the invention can still make the film frame have a certain lifting height to be applicable to the film winding on an large-sized object under the condition that the upright post does not have the same height as the traditional upright post, and the external shape of the winding machine is more applicable to the maneuvering.

Cameras and methods are provided for recording more than one image on a photosensitive element. The cameras and methods record the images in the form of separate patterns of concentrated image elements. Apparatuses and methods are provided for recovering images from the concentrated image elements.

The invention relates to a system and a method for automatically adapting the gait of a virtual character to the terrain. The system and the method use input gait action of the character as reference data, the system automatically analyze key film frames of leg motion in the gait action, and use analyzed information to automatically generate various leg motion parameter combinations required by different terrains, thereby enabling input gait action data to be suitable for various terrains, and enabling generated results of gait animation to approach referenced motion capture data as much as possible. Through the system and the method in the invention, a user can achieve the animation production effect of automatically adapting the gait to any landform in real time only by inputting a virtual character and a segment of ideal gait motion data (a motion clip) of the character without giving a walking path and information of obstacles in the virtual environment in advance.

An action camera system is disclosed that comprises an action camera and a mount where the mount is configured to detachably couple the camera. The mount comprises a battery, a base, a body, and a vertical support. The base can be attached to a helmet, a harness, an armband, a board, or a ski pole. The battery powers the action camera when it is attached to the mount. The action camera comprises two lenses with a separate image sensor or film frame for each lens. The action camera may be connected to the mount via a folding extension. The action camera communicates wirelessly with a smartphone or a control device. The smartphone can be attached to an armband. A ski pole mount may comprise a computer, a display, and user interface.