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Adjustable Width Cassette for Wafer Film Frames

a cassette and film frame technology, applied in the field of cassettes for wafer film frame, can solve the problems of increasing storage space requirements, costly work stoppages, and multiple cassette sizes, and achieve the effects of reducing equipment set-up time, reducing storage space requirements, and reducing inventory costs

Inactive Publication Date: 2011-05-05
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention provides an adjustable width cassette for storing and transporting thin planar objects of different widths. The cassette includes side panels, an expandable sliding bar assembly, and an adjustable length panel. The front of the cassette is open to allow objects to be inserted, and the depth and height of the cassette are fixed. A stop mechanism prevents the objects from escaping or extending outside the cassette. The adjustable length panel includes a base plate and screws, which can be moved to change the width of the cassette. The sliding bar assembly on the bottom of the cassette includes a rod and brackets for positioning and aligning frames. The adjustable width cassette is applicable to various thin planar materials and reduces storage space, inventory costs, equipment set-up time, and errors associated with different single width cassettes.

Problems solved by technology

The multiplicity of cassette sizes adds to storage space requirements, as well as inventory cost.
Modifications to automated equipment or equipment interfaces in order to facilitate different wafer and frame sizes result in costly work stoppages and increased cycle time.
Equipment changes, particularly those involving mechanical modifications to interface mechanisms are labor intensive, time consuming, and are subject to set-up errors.
A significant problem associated with multiple cassette sizes requiring equipment set-up changes is the increased probability of improper alignment resulting in damage to costly wafers as a result of frames jamming into each other and sliding across the surface of a wafer.

Method used

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  • Adjustable Width Cassette for Wafer Film Frames
  • Adjustable Width Cassette for Wafer Film Frames
  • Adjustable Width Cassette for Wafer Film Frames

Examples

Experimental program
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first embodiment

[0029]FIG. 1 provides a perspective view of the invention, an adjustable width cassette 10 for holding and transporting planar objects. The cassette 10 includes a substantially open front facing side 11 to allow insertion of thin, planar objects, a pair of vertical side panels 12 opposite and parallel to each other having a plurality of elongated opposing horizontal slots 121 on the inner surface for supporting the planar members, a sliding bar assembly 13 on the bottom side of the cassette providing connection between the side panels 12, and an adjustable length horizontal panel 14 on the top side of the cassette providing connection between the side panels 12. The horizontal structures, a sliding bar assembly 13 on the bottom and the adjustable length panel 14 on the top, are approximately centered front to back of the cassette in order to provide dimensional stability to the vertical side panels 12.

[0030]The adjustable length panel 14 on the cassette top side is an assemblage whi...

second embodiment

[0043]In a second embodiment, the adjustable width cassette is a film frame holder for storing and transporting semiconductor wafers. A film frame holder is typically used to position and secure a wafer on tape by a controlled release adhesive during the processes of sawing the wafer into individual chips, transporting the frame with sawed wafer to a pick and place equipment, and aligning the wafer in a pick and place equipment.

[0044]In FIG. 6, a top view of the adjustable width cassette 60 is shown with a film frame 67 having a semiconductor wafer 68 adhered to a support film 69. Curved sides of the frame 67 rest on slots in opposite side panels 62 of the cassette. The film frame 67 is typically fabricated with flat sides adjacent to the curves sides. Spring loaded screws 643 in the top panel 64 engage in holes at predefined locations to secure the cassette width for the selected frame and wafer width.

[0045]Diameter of the wafer 68 is a major determining factor in the film frame 67...

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PUM

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Abstract

An expandable width cassette for storing and transporting thin planar objects of different widths is provided. The cassette 10 includes two side panels 12 of fixed height opposite and parallel to one another having a series of elongated slots on the inner surface of the side panels for supporting planar objects, a sliding bar assembly 13 on the bottom side of the cassette, and an adjustable length panel 14 on the top side of the cassette. Spring loaded press screws 143 disengaged from locator holes at predefined locations in the top panel allow the cassette width to be altered by pushing or pulling the side panels. A wafer film frame cassette includes a back stop mechanism which further serves to align with a frame notch.

Description

FIELD OF THE INVENTION[0001]The invention relates generally to semiconductor processing equipment, and more particularly to cassettes for wafers on film frames.BACKGROUND OF THE INVENTION[0002]The semiconductor industry, as well as unrelated industries, frequently hold and transfer thin planar objects in cassettes having a series of parallel, spaced apart horizontal slots which receive and hold a single planar object in each slot. Semiconductor wafers are frequently transferred from one processing station to another via cassettes. In some cases, cassettes are sized and shaped to hold film frames or other similar devices upon which a wafer has been mounted for processing and / or transporting.[0003]Cassettes are used within the semiconductor industry primarily in processes which retrieve and process one wafer at a time. In particular, wafer cassettes are often used in conjunction with chemical mechanical planarization machines and in the packaging and assembly operations film frame cas...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/67B65D85/90H01L21/673
CPCH01L21/6732
Inventor MOHAMED, ZAINUDIN BIN
Owner TEXAS INSTR INC
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