23results about "Transfer patterning" patented technology

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

Method for creating an electrode on a substrate using a laser assisted deposition process. A metal paste is printed and dried on the substrate to form a conductive layer, and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Provided herein is a printing device (1) for printing a substance onto a target surface (TS) of a target (T), comprising a carrier (2) having, on a first main surface (21), a carrier surface (2s) for carrying a sample (SB1, SB2, SB3) of the substance to be printed, a heater arrangement (23) for heating the carrier surface to evaporate a portion of the sample on the carrier surface side and induce a vapor pressure that transfers the remaining portion of the sample to the target surface, and a structured thermal buffer layer (25) for providing a position-dependent delay in heat transfer from the heater arrangement to the carrier surface.

A printing device (1) is provided herein for printing a substance on a target surface (TS) of a target (T). The printing device comprises a carrier (2) having at a first main side (21) a carrier surface (2s) for carrying a specimen (SB1, SB2, SB3) of the substance to be printed. The printing device further comprises a heater facility (23) for heating the carrier surface to vaporize a portion of the specimen at the side of the carrier surface and inducing a vapor pressure that causes a transfer of a remainder of said specimen towards the target surface and a structured thermal buffer layer (25) that provides for a position dependent delay with which heat is transferred from the heater facility to the carrier surface.

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.

A process of forming an electric circuit on an insulating ceramic substrate or on an insulating ceramic layer of a substrate that includes depositing a conductive material over a surface of the ceramic substrate or layer; and directing a laser beam onto the conductive material over the ceramic substrate or layer and moving the laser beam relative to the ceramic substrate or layer along a predetermined pattern for the electric circuit, whereby the conductive material is melted over the ceramic substrate or layer to form a conductive track.

A method of depositing a donor material onto a target surface is provided herein, in which a first main side of a substrate is covered with a stretchable layer that is attaching thereto with a sealing around an enclosed area at the first main side, therewith defining an enclosure. The stretchable layer has an outer surface that faces away from the substrate, and that is patterned with one or more recessed areas filled with the donor material to be deposited. A relatively high pressure is provided in an interior of the enclosure so that its volume is increased and the patterned surface of the stretchable layer is pressed against the target surface. In that state of the stretchable layer the substrate is irradiated at a second main side opposite its first main side with photon radiation that has an intensity and a duration that causes a transfer of donor material from the one or more recessed areas to the target surface. Also a plate and a deposition device are provided.

A system and method for addressing mis-jetting while avoiding problems caused by the screen printing process is provided. [Solution] A system and method includes printing or otherwise transferring dot-like portions of a material (e.g., a viscous material such as solder paste) onto an intermediate substrate in a first printing unit, moving the intermediate substrate with the printed dot-like portions of the material to a second printing unit, and then transferring the dot-like portions of the material from the intermediate substrate to a final substrate in the second printing unit. Optionally, the first printing unit includes a coating system that produces a uniform layer of material on the donor substrate, and the material is transferred in discrete dot-like portions from the donor substrate onto the intermediate substrate in the first printing unit. Each of the first and second printing units can use different printing or other transfer technologies. The system can also include a material curing unit and an imaging unit to support the overall process.

The present disclosure provides a method for transferring a viscous functional material onto a receiving substrate. The method includes providing a plate (10) having a cavity surface (11) containing cavities (12). The method further includes providing a plurality of individually addressable resistive heating elements (131, 132, 133) in thermal contact with respective regions (121, 122, 123) of the cavity (12). The method provides a viscous functional material within the cavity having a material composition that, when heated sufficiently, generates a gas at an interface between the cavity surface and the functional material within the cavity, thereby transferring the functional material from the cavity onto the receiving substrate via gas generation. According to the improved transfer method, respective portions of the viscous functional material within each region of the cavity are heated by supplying respective time-dependent magnitudes of power (C131, C132, C133) to each of the plurality of individually addressable heating elements.

A substrate having at least one surface that is bounded by microstructures and / or nanostructures and having a filling mass within the bounded surface, and the filling mass forms on or on top of the boundary an apparent static contact angle of ≥ 30°, preferably ≥ 35°, more preferably ≥ 40° and particularly preferably ≥ 42°.

Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

A printing device (1) for printing a substance on a target surface (TS) of a target (T) is provided. The printing device comprises a carrier (2) having, on a first main side (21), a carrying surface (2s) for carrying a sample (SB1, SB2, SB3) of a substance to be printed. The printing apparatus further comprises: a heating device (23) for heating the bearing surface to evaporate a portion of the sample on the bearing surface side and generating a vapor pressure that transports a remaining portion of the sample toward a target surface; and a structured thermal buffer layer (25) that provides a position-dependent delay with which heat is transferred from the heating device to the bearing surface.

Apparatus for printing a viscous substance by means of Laser Induced Forward Transfer on a product, the apparatus comprising: • - a substrate handler (4) arranged for holding a substrate (5) and positioning a first surface (7) of the substrate (5) into a coating position (9) and a printing position (11), wherein, in the printing position (11), the first surface (7) of the substrate (5) is at a predetermined position relative to the product (3) for printing the viscous substance (2) on the product (3); • - a support (13) for positioning the product (3) in relation to the first surface (7) of the substrate (5) in the printing position (11) of the substrate (5); • - a coater (15) arranged for providing a layer (17) of the viscous substance (2) on the first surface (7) of the substrate (5) in the coating position (9) of the substrate (5); • - a printing device (19) comprising a first emitter unit (21) arranged for transmitting a beam of electromagnetic radiation (23) for printing, in the printing position (11) of the substrate (5), the viscous substance (2) on the product (3); • - a scanning device (25) arranged for scanning the beam of electromagnetic radiation (23) across the first surface (7) of the substrate (5) for printing a selective layer-part (27) of the viscous substance (2); and • - a heating device (29) arranged for heating the selective layer- part (27) of the viscous substance (2) on the substrate (5) to a first predetermined temperature range for reducing the viscosity of the viscous substance (2) of the selective layer-part (27) before printing the selective layer-part (27) of the viscous substance (2) on the product (3). A method for printing viscous substance by means of Laser Induced Forward Transfer on a product using the apparatus.

The invention relates to a method for pattern recognition to assemble printed circuit boards by digital printing and a system for implementing the method In the method, pattern recognition methods are applied to extract information from the imaging of the printed circuit board, thereby automating the printing of the targeted object on the board. The method comprises the digital printing of a material that is uniformly coated on a transparent donor substrate and placed in parallel to a receiver substrate. A laser pulse irradiates the donor substrate resulting in the detachment and printing of part of the material on the receiver. This method allows to minimize the time of the overall process, with high alignment accuracy and high printing resolution.

Methods for creating a conductive pillar on a receiver substrate may include forming a dried metal paste pillar by printing metal paste over an area of a receiver substrate, drying the metal paste, and repeating the printing and drying steps. The dried metal paste pillar may be inspected so as to determine a height of the dried metal paste pillar. If the height of the dried metal paste pillar is less than a desired height, additional metal paste may be printed onto to the dried metal paste pillar and dried. If the height of the dried metal paste pillar exceeds the desired height, a portion of the dried metal paste pillar may be ablated. The dried metal paste pillar may be sintered so as to form the conductive pillar. Conductive pillars that are produced according to the methods may be used as part of the formation of a flip-chip assembly.

A deposition apparatus (1) for depositing a material (Ma, Mb,..., Mn) on a target (T) is provided. The apparatus is configured to start spraying a portion of material from a spraying position of the donor plate (2) at a point in time at which a space vector defined between the deposition position (ps) and the spraying position (pe) corresponds to a movement of the donor plate (2) relative to the target (T). A corresponding deposition method is also provided.

A method, plate and deposition apparatus for depositing donor material on a target surface are provided. The first major surface (11) of a substrate (10) is coated with a stretchable layer (4), which is attached by a sealing (43) applied around an enclosed area (13) of the first major surface to define an enclosure (6). The stretchable layer (4) faces the opposite side of the substrate and has an outer surface (41) patterned with one or more recesses (42a, ..., 42e) into which a donor material to be deposited is filled. A relatively high pressure is applied to the interior (61) of the enclosure (6), causing the volume (V 61 ) and pressing the patterned surface (41) of the elastic layer (4) against the target surface (51). With the elastic layer (4) in this state, the second major surface (12) of the substrate opposite the first major surface (11) is irradiated with photon radiation at an intensity and duration that causes transfer of the donor material (2) from one or more of the recesses (42a, ..., 42e) to the target surface (51).

Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and / or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.