111results about "Transfer patterning" patented technology

Methods here disclosed provide for selectively coating the top surfaces or ridges of a 3-D substrate while avoiding liquid coating material wicking into micro cavities on 3-D substrates. The substrate includes holes formed in a three-dimensional substrate by forming a sacrificial layer on a template. The template includes a template substrate with posts and trenches between the posts. The steps include subsequently depositing a semiconductor layer and selectively etching the sacrificial layer. Then, the steps include releasing the semiconductor layer from the template and coating the 3-D substrate using a liquid transfer coating step for applying a liquid coating material to a surface of the 3-D substrate. The method may further include coating the 3-D substrate by selectively coating the top ridges or surfaces of the substrate. Additional features may include filling the micro cavities of the substrate with a filling material, removing the filling material to expose only the substrate surfaces to be coated, coating the substrate with a layer of liquid coating material, and removing said filling material from the micro cavities of the substrate.

A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

The invention relates to a transfer element comprising a base having thereon a transfer layer of inorganic conductive particles in a polymer matrix wherein said transfer layer of inorganic conductive particles has an adhesion to said base of between 20 and 400 grams/cm.

The invention relates to the deposition or transfer of material using a laser induced forward transfer process. More specifically, the invention relates to the transfer of material using a laser induced forward transfer process wherein the transfer process is facilitated or enabled by nanomaterials. Nanomaterials in the form of nanoparticles or nanofilms may be employed, optionally including a surface coating or self-assembled monolayer surface coating, making use of properties of the nanomaterials that allow the laser induced forward transfer process to be practiced at irradiation energies and temperatures lower than commonly used. The technique may be well suited for depositing organic layers.

A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.

A method of making an electrically conductive patterned film (74), such as an RFID antenna, is disclosed. The method includes the steps of providing a layer of conductive metal (24) adjacent a layer of release coating (20); providing a patterned adhesive layer (400) adjacent a target substrate (42); contacting the layer of conductive metal (24) and the patterned adhesive layer (40), such that a corresponding portion (70) of the layer of conductive metal (24) contacts the patterned adhesive layer (40); and the patterned adhesive layer (40) stripping the corresponding portion (70) of the layer of conductive metal (24) from the release coating (20). The patterned adhesive layer (40) can be formed in the shape of an RFID antenna. An electrical component or a computer chip (80) can be directly applied to the layer of conductive metal (24). An RFID device, such as an RFID tag or label is also disclosed.

The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component of a device. The present invention also relates to methods pertinent to such transfers.

A laser decal transfer is used to generate thin film features by directing laser pulses of very low energy at the back of a target substrate illuminating an area of a thin layer of a high viscosity rheological fluid coating the front surface of the target. The illuminated area is shaped and defined by an aperture centered about the laser beam. The decal transfer process allows for the release and transfer from the target substrate to the receiving substrate a uniform and continuous layer identical in shape and size of the laser irradiated area. The released layer is transferred across the gap with almost no changes to its initial size and shape. The resulting patterns transferred onto the receiving substrate are highly uniform in thickness and morphology, have sharp edge features and exhibit high adhesion, independent of the surface energy, wetting or phobicity of the receiving substrate.

The present invention relates to a donor laminate for transfer of a conductive layer comprising at least one electronically conductive polymer on to a receiver, wherein the receiver is a component of a device. The present invention also relates to methods pertinent to such transfers.

A method of manufacturing a circuit board embedding a thin film capacitor, the method including: forming a sacrificial layer on a first substrate; forming a dielectric layer on the sacrificial layer; forming a first electrode layer on the dielectric layer; disposing the first substrate on the second substrate in such a way that the first electrode layer is bonded to a top of a second substrate; decomposing the sacrificial layer by irradiating a laser beam onto the sacrificial layer through the first substrate; separating the first substrate from the second substrate; and forming a second electrode layer on the dielectric layer.

A thermal transfer ribbon comprised of a support and an ink layer disposed above the support. The ink layer has a thickness of from about 0.1 to about 10 microns; it contains at least 75 weight percent of particulate conductive metal material and from about 1 to about 25 weight percent of binder; and it has a surface resistivity of less than about 1,000,000 ohms per square. When the ink layer is transferred to a substrate, the surface resistivity of the transferred ink is less than 100 ohms per square when printed onto a flexible substrate at a printing speed of 2 centimeters per second and a printing energy of 7.6 joules per square centimeter. The particulate conductive metal preferably contains a noble metal and has a melting point of at least 800 degrees Celsius and a particle size such that least about 95 weight percent of its particles are smaller than 50 microns.

A method for forming a resist pattern on a substrate (18) places a donor element (12) having a layer of thermoresist material proximate the substrate. A gap is maintained such that the surface of the layer of thermoresist material is spaced apart from the surface of the substrate by a number of spacing elements. Thermal energy is directed toward the donor element (12) according to the resist pattern, whereby a portion of thermoresist material is transferred from the donor element (12) across the gap by ablative transfer and is deposited onto the substrate (18) forming the resist pattern.

Provided are processes for making a transparent conducting pattern. The invention is also directed to electronic devices containing such transparent conducting patterns. Further provided is a substrate comprising a base film and a transparent conducting layer disposed on the base film; wherein the substrate has an OD of about 0.1 to 0.6 at 830 nm, and the transparent conducting layer comprises polyethylene dioxythiophene and has an OD of less than 0.1 in the range of 400 to 700 nm.

A manufacturing method for a printing circuit uses an adhesive as a printing material to print a line pattern of a printing circuit on a carrier by means of printing, and then cause an adhesive to stick with a mother film with a release type metal to allow a part of the carrier with the adhesive to pull and attach itself with a metal film, and another part without the adhesive does not pull and attach itself with the metal film such that a metal line is formed on the carrier. The manufacturing method can simplify the manufacturing process of the printing circuit, the line fabrication is very fast, the production efficiency can be enhanced and the production cost is low.

Exemplary embodiments of the present invention provide a method to form a patterned conductive film by modifying a conductive thin film on a substrate irrespective of the material used for the substrate. Exemplary embodiments include a substrate having a conductive layer containing a conductive material and a photothermal conversion layer containing a photothermal conversion material that converts light energy into heat energy that is irradiated with a laser beam to fire at least part of the conductive layer with the photothermal conversion material.

A technique for bonding two dissimilar materials includes positioning a second material over a first material at an oblique angle and applying a tamping layer over the second martial. A laser beam is directed at the second material that generates a plasma at the location of impact on the second material. The plasma generates pressure that accelerates a portion of the second material to a very high velocity and towards the first material. The second material impacts the first material causing bonding of the two materials.

The invention relates to a PCB pad compensation design technology and application thereof, and belongs to the technical field of PCB manufacture. In PCB pad compensation design technology, the line width of a CAM design circuit is greater than that of an original design drawing, the diameter of a solder mask window of CAM design is greater than that of the original design drawing, and a solder mask negative image of CAM design compensates a line-solder mask overlap portion beyond the pad range. Patterns of solder mask windows in a solder mask negative are compensated in design, the shapes of pads formed finally are relatively unified, problems as incomplete soldering and short circuit during tinning can be avoided, and the yield rate of production is improved.

A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.

The invention relates to an additional preparation technology of a double-side multilayer printed circuit. An electroplating template is prepared, a single-side circuit board is prepared, holes are drilled in the single-side circuit board, another electroplating template is adhered, the holes are metalized by chemical coppering, the holes are thickened by electro-coppering, the other electroplating template is peeled to obtain the needed double-side printed circuit board, and the multi-layer printed circuit is obtained by repeating the above steps. The electroplating template for preparing conductive lines can be reused via post processing, repeated mask layer preparation in traditional circuit board preparation is avoided, and development of the mask layer and pollution of a waste liquid are both reduced. According to a template transfer technology, as the additional preparation technology, etching of metal foils is not needed, there is no waste of metal, and the cost of handling waste liquid pollution and treating waste water caused by metal etching is reduced. Thus, compared with a traditional reduction type corrosion method for preparing the double-side multilayer printed circuit, the technology has the advantages of being waste-free and low in pollution and reducing the cost, and is worthy of application.

A thermally transferable electrically conductive ribbon includes a carrier web having first and second sides and an electrically conductive layer disposed on the first side of the carrier web. A portion of the electrically conductive layer is transferable to an associated object to form an electrically conductive circuit thereon. A method for making and using the ribbon are also disclosed.