9results about "Transfer patterning" patented technology

Method for creating an electrode on a substrate using a laser assisted deposition process. A metal paste is printed and dried on the substrate to form a conductive layer, and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.

A process of forming an electric circuit on an insulating ceramic substrate or on an insulating ceramic layer of a substrate that includes depositing a conductive material over a surface of the ceramic substrate or layer; and directing a laser beam onto the conductive material over the ceramic substrate or layer and moving the laser beam relative to the ceramic substrate or layer along a predetermined pattern for the electric circuit, whereby the conductive material is melted over the ceramic substrate or layer to form a conductive track.

A substrate having at least one surface that is bounded by microstructures and / or nanostructures and having a filling mass within the bounded surface, and the filling mass forms on or on top of the boundary an apparent static contact angle of ≥ 30°, preferably ≥ 35°, more preferably ≥ 40° and particularly preferably ≥ 42°.

Apparatus for printing a viscous substance by means of Laser Induced Forward Transfer on a product, the apparatus comprising: • - a substrate handler (4) arranged for holding a substrate (5) and positioning a first surface (7) of the substrate (5) into a coating position (9) and a printing position (11), wherein, in the printing position (11), the first surface (7) of the substrate (5) is at a predetermined position relative to the product (3) for printing the viscous substance (2) on the product (3); • - a support (13) for positioning the product (3) in relation to the first surface (7) of the substrate (5) in the printing position (11) of the substrate (5); • - a coater (15) arranged for providing a layer (17) of the viscous substance (2) on the first surface (7) of the substrate (5) in the coating position (9) of the substrate (5); • - a printing device (19) comprising a first emitter unit (21) arranged for transmitting a beam of electromagnetic radiation (23) for printing, in the printing position (11) of the substrate (5), the viscous substance (2) on the product (3); • - a scanning device (25) arranged for scanning the beam of electromagnetic radiation (23) across the first surface (7) of the substrate (5) for printing a selective layer-part (27) of the viscous substance (2); and • - a heating device (29) arranged for heating the selective layer- part (27) of the viscous substance (2) on the substrate (5) to a first predetermined temperature range for reducing the viscosity of the viscous substance (2) of the selective layer-part (27) before printing the selective layer-part (27) of the viscous substance (2) on the product (3). A method for printing viscous substance by means of Laser Induced Forward Transfer on a product using the apparatus.

Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and / or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.