33results about "Transfer patterning" patented technology

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

Method for creating an electrode on a substrate using a laser assisted deposition process. A metal paste is printed and dried on the substrate to form a conductive layer, and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Provided herein is a printing device (1) for printing a substance onto a target surface (TS) of a target (T), comprising a carrier (2) having, on a first main surface (21), a carrier surface (2s) for carrying a sample (SB1, SB2, SB3) of the substance to be printed, a heater arrangement (23) for heating the carrier surface to evaporate a portion of the sample on the carrier surface side and induce a vapor pressure that transfers the remaining portion of the sample to the target surface, and a structured thermal buffer layer (25) for providing a position-dependent delay in heat transfer from the heater arrangement to the carrier surface.

A printing device (1) is provided herein for printing a substance on a target surface (TS) of a target (T). The printing device comprises a carrier (2) having at a first main side (21) a carrier surface (2s) for carrying a specimen (SB1, SB2, SB3) of the substance to be printed. The printing device further comprises a heater facility (23) for heating the carrier surface to vaporize a portion of the specimen at the side of the carrier surface and inducing a vapor pressure that causes a transfer of a remainder of said specimen towards the target surface and a structured thermal buffer layer (25) that provides for a position dependent delay with which heat is transferred from the heater facility to the carrier surface.

Method for creating an electrode on a substrate (10) using a laser assisted deposition process. A metal paste (14) is printed and dried (15) on the substrate to form a conductive layer (16), and by 2D or 3D inspection, the dimensions of the conductive layer are measured. The substrate is subject to a pretreatment process (12) so as to increase adhesion and / or conduction of the conductive layer to the substrate. An electrode that is produced according to the present method may be used in flexible devices.

Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.

A process of forming an electric circuit on an insulating ceramic substrate or on an insulating ceramic layer of a substrate that includes depositing a conductive material over a surface of the ceramic substrate or layer; and directing a laser beam onto the conductive material over the ceramic substrate or layer and moving the laser beam relative to the ceramic substrate or layer along a predetermined pattern for the electric circuit, whereby the conductive material is melted over the ceramic substrate or layer to form a conductive track.

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and / or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

The present invention relates to a method of coating or surface treatment, in which a substrate holder (2) and a slot die head (3) are provided. The slot die head has a slit nozzle (4). A substrate (5) is placed on the substrate holder. The substrate is moved relative to the slit nozzle such that liquid is deposited on the substrate by supplying a conductive liquid onto the substrate through the slit nozzle. A potential difference is applied between the slit nozzle and the substrate by a power source (6) while supplying the conductive liquid to the substrate through the slit nozzle. The power source applies a first potential to the slit nozzle and a second, different potential to the substrate.

A method of depositing a donor material onto a target surface is provided herein, in which a first main side of a substrate is covered with a stretchable layer that is attaching thereto with a sealing around an enclosed area at the first main side, therewith defining an enclosure. The stretchable layer has an outer surface that faces away from the substrate, and that is patterned with one or more recessed areas filled with the donor material to be deposited. A relatively high pressure is provided in an interior of the enclosure so that its volume is increased and the patterned surface of the stretchable layer is pressed against the target surface. In that state of the stretchable layer the substrate is irradiated at a second main side opposite its first main side with photon radiation that has an intensity and a duration that causes a transfer of donor material from the one or more recessed areas to the target surface. Also a plate and a deposition device are provided.

A system and method for addressing mis-jetting while avoiding problems caused by the screen printing process is provided. [Solution] A system and method includes printing or otherwise transferring dot-like portions of a material (e.g., a viscous material such as solder paste) onto an intermediate substrate in a first printing unit, moving the intermediate substrate with the printed dot-like portions of the material to a second printing unit, and then transferring the dot-like portions of the material from the intermediate substrate to a final substrate in the second printing unit. Optionally, the first printing unit includes a coating system that produces a uniform layer of material on the donor substrate, and the material is transferred in discrete dot-like portions from the donor substrate onto the intermediate substrate in the first printing unit. Each of the first and second printing units can use different printing or other transfer technologies. The system can also include a material curing unit and an imaging unit to support the overall process.

In a method and system for laser-induced forward transfer (LIFT), energy (E1, E2) is applied according to a non-Gaussian intensity profile (Ixy), which is spatially tailored across an interface (11xy) of a donor material (11m) to cause the donor material (11m) to be ejected from the donor substrate (11) as an elongated jet (Je) that instantaneously bridges a transfer distance (Zt) between the donor substrate (11) and the acceptor substrate (12) during a transfer period (Tt). A locally increased intensity spike (Is) at the center of the intensity profile (Ixy) causes a relatively thick jet (J1) of donor material to bifurcate into a relatively thin jet (J2) at a bifurcation location (J12) between the donor substrate (11) and the acceptor substrate (12). The thick jet (J1) allows for a relatively large transfer distance (Zt), while the thin jet (J2) deposits a relatively small droplet (Jd) of donor material (Hm).

The present disclosure provides a method for transferring a viscous functional material onto a receiving substrate. The method includes providing a plate (10) having a cavity surface (11) containing cavities (12). The method further includes providing a plurality of individually addressable resistive heating elements (131, 132, 133) in thermal contact with respective regions (121, 122, 123) of the cavity (12). The method provides a viscous functional material within the cavity having a material composition that, when heated sufficiently, generates a gas at an interface between the cavity surface and the functional material within the cavity, thereby transferring the functional material from the cavity onto the receiving substrate via gas generation. According to the improved transfer method, respective portions of the viscous functional material within each region of the cavity are heated by supplying respective time-dependent magnitudes of power (C131, C132, C133) to each of the plurality of individually addressable heating elements.

A substrate having at least one surface that is bounded by microstructures and / or nanostructures and having a filling mass within the bounded surface, and the filling mass forms on or on top of the boundary an apparent static contact angle of ≥ 30°, preferably ≥ 35°, more preferably ≥ 40° and particularly preferably ≥ 42°.

Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

A substrate having at least one surface that is bounded by microstructures and / or nanostructures and having a filling mass within the bounded surface, and the filling mass forms on or on top of the boundary an apparent static contact angle of ≥ 30°, preferably ≥ 35°, more preferably ≥ 40° and particularly preferably ≥ 42°.

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

A printing device (1) for printing a substance on a target surface (TS) of a target (T) is provided. The printing device comprises a carrier (2) having, on a first main side (21), a carrying surface (2s) for carrying a sample (SB1, SB2, SB3) of a substance to be printed. The printing apparatus further comprises: a heating device (23) for heating the bearing surface to evaporate a portion of the sample on the bearing surface side and generating a vapor pressure that transports a remaining portion of the sample toward a target surface; and a structured thermal buffer layer (25) that provides a position-dependent delay with which heat is transferred from the heating device to the bearing surface.

The present invention relates to a coating or surface treatment method. In the method, a substrate holder and slot die head are provided. The slot die head has a slit nozzle. A substrate is mounted on the substrate holder. The substrate is moved relative to the slit nozzle by supplying an electrically conductive liquid through the slit nozzle onto the substrate such that the liquid is deposited onto the substrate. A power source applies an electrical potential difference between the slit nozzle and the substrate while the conductive liquid is supplied through the slit nozzle to the substrate. The power source applies a first electrical potential to the slit nozzle and a second, different electrical potential to the substrate.

Apparatus for printing a viscous substance by means of Laser Induced Forward Transfer on a product, the apparatus comprising: • - a substrate handler (4) arranged for holding a substrate (5) and positioning a first surface (7) of the substrate (5) into a coating position (9) and a printing position (11), wherein, in the printing position (11), the first surface (7) of the substrate (5) is at a predetermined position relative to the product (3) for printing the viscous substance (2) on the product (3); • - a support (13) for positioning the product (3) in relation to the first surface (7) of the substrate (5) in the printing position (11) of the substrate (5); • - a coater (15) arranged for providing a layer (17) of the viscous substance (2) on the first surface (7) of the substrate (5) in the coating position (9) of the substrate (5); • - a printing device (19) comprising a first emitter unit (21) arranged for transmitting a beam of electromagnetic radiation (23) for printing, in the printing position (11) of the substrate (5), the viscous substance (2) on the product (3); • - a scanning device (25) arranged for scanning the beam of electromagnetic radiation (23) across the first surface (7) of the substrate (5) for printing a selective layer-part (27) of the viscous substance (2); and • - a heating device (29) arranged for heating the selective layer- part (27) of the viscous substance (2) on the substrate (5) to a first predetermined temperature range for reducing the viscosity of the viscous substance (2) of the selective layer-part (27) before printing the selective layer-part (27) of the viscous substance (2) on the product (3). A method for printing viscous substance by means of Laser Induced Forward Transfer on a product using the apparatus.

The invention relates to a method for pattern recognition to assemble printed circuit boards by digital printing and a system for implementing the method In the method, pattern recognition methods are applied to extract information from the imaging of the printed circuit board, thereby automating the printing of the targeted object on the board. The method comprises the digital printing of a material that is uniformly coated on a transparent donor substrate and placed in parallel to a receiver substrate. A laser pulse irradiates the donor substrate resulting in the detachment and printing of part of the material on the receiver. This method allows to minimize the time of the overall process, with high alignment accuracy and high printing resolution.

The present invention relates to a coating or surface treatment method. In the method, a substrate holder (2) and slot die head (3) are provided. The slot die head has a slit nozzle (4). A substrate (5) is mounted on the substrate holder. The substrate is moved relative to the slit nozzle by supplying an electrically conductive liquid through the slit nozzle onto the substrate such that the liquid is deposited onto the substrate. A power source (6) applies an electrical potential difference between the slit nozzle and the substrate while the conductive liquid is supplied through the slit nozzle to the substrate. The power source applies a first electrical potential to the slit nozzle and a second, different electrical potential to the substrate.

Methods for creating a conductive pillar on a receiver substrate may include forming a dried metal paste pillar by printing metal paste over an area of a receiver substrate, drying the metal paste, and repeating the printing and drying steps. The dried metal paste pillar may be inspected so as to determine a height of the dried metal paste pillar. If the height of the dried metal paste pillar is less than a desired height, additional metal paste may be printed onto to the dried metal paste pillar and dried. If the height of the dried metal paste pillar exceeds the desired height, a portion of the dried metal paste pillar may be ablated. The dried metal paste pillar may be sintered so as to form the conductive pillar. Conductive pillars that are produced according to the methods may be used as part of the formation of a flip-chip assembly.

A system and method for printing or otherwise transferring dot-shaped portions of a material (e.g., a viscous material, such as solder paste) onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-shaped portions of material printed thereon being transferred to a second printing unit, and the dot-shaped portions of material being transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that forms a uniform layer of material on a donor substrate, and at the first printing unit, the material is transferred from the donor substrate to the intermediate substrate in individual dot-shaped portions. Each of the first printing unit and the second printing unit may employ a variety of printing or other transfer techniques. The system may also include a material curing and imaging unit to assist in the overall process.

A deposition apparatus (1) for depositing a material (Ma, Mb,..., Mn) on a target (T) is provided. The apparatus is configured to start spraying a portion of material from a spraying position of the donor plate (2) at a point in time at which a space vector defined between the deposition position (ps) and the spraying position (pe) corresponds to a movement of the donor plate (2) relative to the target (T). A corresponding deposition method is also provided.

A method for manufacturing printed circuit boards for electrical and electronic circuits, comprising an electrically nonconductive substrate (4) and electrically conductive tracks applied thereon, wherein the electrically conductive tracks are imprinted on the substrate (4), according to a desired conductor track layout, under the influence of heat applied to an electrically conductive printing medium (3), wherein the printing medium (3) comprises an electrically conductive metal or metal alloy having a melting temperature, and wherein the metal or metal alloy is configured to be selectively heated by a print head (2) at selected printing spots or pixels, wherein a conductive ingredient of the metal or metal alloy of the printing medium (3) is locally heated at least up to the melting temperature of the metal or the metal alloy, which is the melting point of the metal or metal alloy in the form of a bulk material and is melted thereby, and thereafter solidifys on the substrate (4) in the form of a common matrix, and wherein the printing medium (3) is situated on a side of-a film-like carrier (6), which side of the film-like carrier (6) faces the substrate (4), characterized in that the film-like carrier (6) is a carbon foil or a glass film, and is wound from a supply spool (7), along the substrate (4) to be imprinted, onto a laydown spool (8), and wherein, at least in a section of the carrier film (6) which is actually in the area of the print head (2), the side of the carrier film (6) bearing the printing medium (3) is always oriented parallel to the substrate (4) and rests flatly against the substrate (4), so that the metal or metal alloy is in direct contact with the substrate (4), and, after being melted by the print head (2) into its fluid aggregate state, the metal or metal alloy immediately moistens the substrate (4) and finally solidifies on the substrate (4) as a common matrix.

It is an object of the present invention to provide an improved system for digitally depositing material in a manner that is much faster than the best dispensing systems. In a system for printing viscous materials, the printing and post-processing of the viscous material are performed in an alternating sequence. In a first step, the viscous material is printed on a sample placed on a receiving substrate using a donor module and a laser scanner, and then the donor module is replaced with a post-processing system to perform a post-processing operation (or vice versa). Multiple post-processing operations can be performed and multiple different materials can be printed on the same layer. The system allows for improved speed, resolution and variety of materials printed on the same sample, opening up new design possibilities.

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and / or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.