Template transfer technology for preparing double-side multilayer printed circuit

A printed circuit and template technology, which is applied in multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve problems such as the inability to use double-sided printed circuits, and the inability to achieve through-hole metal deposition by printing conductive inks, so as to reduce the Pollution and cost, the effect of less cost and less waste

Active Publication Date: 2017-08-29
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Both printed conductive inks and printed catalytic inks cannot achieve metal deposition in vias and cannot be used to prepare double-sided printed circuits

Method used

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  • Template transfer technology for preparing double-side multilayer printed circuit
  • Template transfer technology for preparing double-side multilayer printed circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Template preparation:

[0039] (1) Commercially available 50-micron calendered copper foil is used as the carrier foil, and a 50-micron thick PET film is bonded to one side of the copper foil, and the adhesive is thermoplastic EVA film;

[0040] (2) Degreasing. A 2 g / L sodium dodecylsulfonate solution was prepared, and the pH was adjusted to 9-10 with sodium hydroxide to obtain a degreasing solution. Immerse the carrier copper foil in the degreasing solution at 50°C for 5 minutes, and wash it with water after taking it out;

[0041] (3) In addition to the oxide layer. Immerse the degreased carrier copper foil in 50g / L sulfuric acid solution, remove the surface oxide layer at 50°C for 5min, take it out, wash it with deionized water, and dry it;

[0042] (4) Prepare the mask. Using a commercially available 35 micron thick photosensitive dry film as a mask, the photosensitive dry film is closely attached to the surface of the copper foil, selectively exposed under the ...

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PUM

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Abstract

The invention relates to an additional preparation technology of a double-side multilayer printed circuit. An electroplating template is prepared, a single-side circuit board is prepared, holes are drilled in the single-side circuit board, another electroplating template is adhered, the holes are metalized by chemical coppering, the holes are thickened by electro-coppering, the other electroplating template is peeled to obtain the needed double-side printed circuit board, and the multi-layer printed circuit is obtained by repeating the above steps. The electroplating template for preparing conductive lines can be reused via post processing, repeated mask layer preparation in traditional circuit board preparation is avoided, and development of the mask layer and pollution of a waste liquid are both reduced. According to a template transfer technology, as the additional preparation technology, etching of metal foils is not needed, there is no waste of metal, and the cost of handling waste liquid pollution and treating waste water caused by metal etching is reduced. Thus, compared with a traditional reduction type corrosion method for preparing the double-side multilayer printed circuit, the technology has the advantages of being waste-free and low in pollution and reducing the cost, and is worthy of application.

Description

technical field [0001] The invention belongs to the field of printed circuit manufacturing, in particular to a template transfer process for preparing double-sided and multilayer printed circuits. Background technique [0002] Printed circuit is one of the most important components in the electronics industry as a carrier for chip secondary packaging. Traditionally, the preparation process of printed circuits is based on the subtractive process of photolithography and metal corrosion. For the non-circuit pattern part, etch the non-circuit part, remove the metal of the non-circuit part, and finally remove the photosensitive mask on the circuit part to obtain the required printed circuit. Since a large amount of waste liquid and waste will be generated during the process of photolithography mask and metal corrosion, which will cause environmental pollution, the use of subtractive process requires a lot of cost for wastewater treatment. With the improvement of environmental p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/20H05K3/46
CPCH05K3/20H05K3/4658H05K2203/0528
Inventor 常煜杨振国
Owner FUDAN UNIV
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