Template transfer technology for preparing double-side multilayer printed circuit

Abstract

The invention relates to an additional preparation technology of a double-side multilayer printed circuit. An electroplating template is prepared, a single-side circuit board is prepared, holes are drilled in the single-side circuit board, another electroplating template is adhered, the holes are metalized by chemical coppering, the holes are thickened by electro-coppering, the other electroplating template is peeled to obtain the needed double-side printed circuit board, and the multi-layer printed circuit is obtained by repeating the above steps. The electroplating template for preparing conductive lines can be reused via post processing, repeated mask layer preparation in traditional circuit board preparation is avoided, and development of the mask layer and pollution of a waste liquid are both reduced. According to a template transfer technology, as the additional preparation technology, etching of metal foils is not needed, there is no waste of metal, and the cost of handling waste liquid pollution and treating waste water caused by metal etching is reduced. Thus, compared with a traditional reduction type corrosion method for preparing the double-side multilayer printed circuit, the technology has the advantages of being waste-free and low in pollution and reducing the cost, and is worthy of application.

Description

technical field [0001] The invention belongs to the field of printed circuit manufacturing, in particular to a template transfer process for preparing double-sided and multilayer printed circuits. Background technique [0002] Printed circuit is one of the most important components in the electronics industry as a carrier for chip secondary packaging. Traditionally, the preparation process of printed circuits is based on the subtractive process of photolithography and metal corrosion. For the non-circuit pattern part, etch the non-circuit part, remove the metal of the non-circuit part, and finally remove the photosensitive mask on the circuit part to obtain the required printed circuit. Since a large amount of waste liquid and waste will be generated during the process of photolithography mask and metal corrosion, which will cause environmental pollution, the use of subtractive process requires a lot of cost for wastewater treatment. With the improvement of environmental p...

AI Technical Summary

Problems solved by technology

Both printed conductive inks and printed catalytic inks cannot achieve metal deposition in vias and cannot be used to prepare double-sided printed circuits

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