41results about "Elastomeric polymer dielectrics" patented technology

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

An electronic circuit on a textile support comprises circuit lines having conductor tracks lying over the surface of the textile support and a contacting module having a socket integrally bonded to the textile support for mechanically detachably receiving an electronic module. The contacting module comprises electrically conductive contact surfaces and is designed to receive an electronic module, which is provided with electrical contacts, at a specified position relative to the socket such that a plurality of the electrical contacts of the electronic module are electrically connected to a plurality of contact surfaces of the contacting module. The socket has an inner socket base portion and the lower side thereof is integrally bonded face-to-face to a socket cover portion of a lower cover (2800), the integrally bonded face-to-face connection containing one or more intermediate layers, each of which is connected, on both sides, to adjacent surfaces face-to-face and in which electrically conductive conductor track portions are located. The conductor track portions are electrically connected to the contact surfaces of the contacting module through the inner socket base portion, or the sides of the conductor track portions facing the specified position serve as contact surfaces of the contacting module through openings in the inner socket base.

The disclosure includes example processes for creating stretchable electronics from multi-layer flex printed circuit boards (flex-PCBs), and example platforms for soft robotic sensor arrays (SRSAs) for electric mapping applications, such as cardiac voltage mapping.

An electronic device includes a substrate, a circuit layer, a first electronic element and a first insulating structure. The substrate includes a first main structure, a second main structure adjacent to the first main structure, a first connecting structure connecting the first main structure and the second main structure, and a first space disposed between the first main structure and the second main structure, wherein a first edge of the first main structure is overlapped with a part of a boundary of the first space. The circuit layer has a first semiconductor. The first electronic element is electrically connected to the first semiconductor. The first insulating structure includes a first groove. In a top view, at least a part of the first groove of the first insulating structure is disposed between the first edge of the first main structure and the first electronic element.

A method for patterning a self-healing elastomer film, and / or for laser sintering and / or for improving electrical conductivity of a self-healing elastomer film, the method comprising: providing a programmable laser processing system; providing a predetermined design model in a program code format for forming one or more patterns to program the laser processing system with the design model; providing a self-healing elastomer film on a substrate; at least partly curing the self-healing elastomer film; providing the at least partly cured film to the laser processing system; treating the at least partly cured film with the laser processing system to partly or completely remove solid elastomeric material from predetermined areas with the laser to form pattern shape(s) defined by the design model to the self-healing elastomer film, and / or to laser sinter and / or to remove oxide layer to improve electrical conductivity of the self-healing elastomer film.

Disclosed are a resin wiring substrate with metal wiring that is less likely to detach from a stretchable resin base, and a stretchable device enclosing the substrate. The resin wiring substrate includes a stretchable resin base (11) and a wiring pattern (21), wherein the wiring pattern (21) includes metal wiring (22) made from a metal film having a particle size of 0.5 to 2.0 µm, and wherein, in a cross-sectional view, at least a portion of the metal wiring (22) is covered by the stretchable resin base (11) and a resin cover layer made from a stretchable resin. The metal wiring (22) can have an embedded part (22a) formed along the inside of a depression (11b) formed in a first surface (11a) of the stretchable resin base (11) and an exposed part (22b) exposed in a cross-sectional view from the first surface (11a).

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.

The invention relates to an article comprising a body (1), wherein: at least one circuit board (3) and conductor tracks (4) connected thereto are present on at least one surface of the body (1); the body (1) is deformable and at least said surface of the body (1) is porous; the conductor tracks (4) are extensible and at least the conductor tracks (4) are covered by an elastomer (2); and the elastomer (2) extends into the pores of the surface of the body (1).

Various embodiments relate to a microserpentine including a plurality of u-bends, each having a degree of completeness (α), in which an α value of 0° corresponds to a semi-circular shape, and in which an α value of +90° corresponds to a complete circle and −90° corresponds to a straight shape. Each of the plurality of u-bends may have an α value of from about −35° to about 45°. The microserpentine may include a core coated with a conductive coating. The core may include a polymeric material. Various embodiments relate to microelectronic devices and methods of producing the same. The microelectronic devices may include but are not limited to a microelectrode array, a microelectronics packaging, an interconnect, a stretchable sensor, a wearable sensor, a wearable actuator, an in vitro sensor, an in vivo sensor, and combinations thereof.

The invention relates to an article comprising a body (1), wherein: at least one circuit board (3) and conductor tracks (4) connected thereto are present on at least one surface of the body (1); the body (1) is deformable and at least said surface of the body (1) is porous; the conductor tracks (4) are extensible and at least the conductor tracks (4) are covered by an elastomer (2); and the elastomer (2) extends into the pores of the surface of the body (1).

The invention relates to a contact structure. The contact structure has at least one electrically conductive substrate, in particular a circuit carrier. The contact structure also has a flexible printed circuit board, in particular a flexible printed circuit board, which has at least one - in particular a reversibly bendable - electrically insulating film and at least one or only one conductive layer. The conductive layer of the flexible printed circuit board is conductively connected to the substrate. The contact structure has an electrically conductive connection element, which is arranged on the conductive layer of the flexible printed circuit board, so that the connection element and the substrate sandwich the flexible printed circuit board between them. The connection element is welded to the conductive layer of the flexible printed circuit board and to the substrate in such a way that a welded connection extends from the connection element into the substrate, in particular in a direction transverse to the planar extension of the flexible printed circuit board, through the conductive layer of the flexible printed circuit board.

A stretchable substrate having a first main surface and a second main surface facing opposite of each other, wherein the stretchable substrate satisfies at least one of (1) to (4): (1) at least either the first main surface or the second main surface has an oxygen atomic proportion of 5 at % or more with respect to all atoms as measured by X-ray photoelectron spectroscopy; (2) the first main surface or the second main surface has an arithmetic average surface roughness of 6 μm or more as measured with a laser microscope; (3) at least either the first main surface or the second main surface includes a metal-containing portion containing a metal atom; or (4) a metal-containing region containing a metal atom that is positioned along at least either the first main surface or the second main surface.

To provide a fluorine resin substrate laminate having low hygroscopicity and excellent low dielectric constant and low dielectric loss tangent, and in which transmission loss in a high frequency region can be reduced.SOLUTION: A fluorine resin substrate laminate for a high frequency circuit comprises a fluorine resin substrate and an adhesive layer provided on the fluorine resin substrate, and the adhesive layer comprises a resin composition comprising (A) a maleimide compound having a saturated or unsaturated bivalent hydrocarbon group and (B) an aromatic maleimide compound.SELECTED DRAWING: Figure 1

A method for manufacturing power electronics comprising at least one electrical circuit carrier on which at least one power electronic semiconductor module is arranged, the module being thermally coupled to a heat sink via a main surface of its housing facing away from the circuit carrier, enables a force-free connection of the circuit carrier, already pre-assembled with the semiconductor module, to the heat sink. According to the invention, this is achieved, among other things, by the use of elastomer grommets filled with a curable potting compound.

An electronic circuit on a textile substrate comprises circuit lines with conductive traces lying flat against the textile substrate, and a contact module with a base bonded to the textile substrate for the mechanically detachable mounting of an electronic module. The contact module includes electrically conductive contact surfaces and is designed to hold an electronic module equipped with electrical contacts at a predetermined position relative to the base such that several of its electrical contacts are electrically connected to several contact surfaces of the contact module.The base has an inner base bottom section and is connected on its underside in a planar and material-bonded manner to a base cover section of a lower cover (2800), wherein this planar and material-bonded connection contains one or more intermediate layers, each planarly connected on both sides to adjacent surfaces, in which electrically conductive conductor track sections are located. These are electrically connected through the inner base bottom section to the contact surfaces of the contacting module, or their sides facing the predetermined position serve as contact surfaces of the contacting module through openings in the inner base bottom.

The invention relates to a method of assembling a plurality of light-emitting diodes (2) on a printed circuit board (4) in order to form a vehicle light module (6), the light module (6) comprising, in addition to the plurality of light-emitting diodes (2) and the printed circuit board (4), a grid (8) made of flexible material, said grid (8) being perforated in a plurality of openings (10) defining patterns, the set of patterns (10) being intended to define individual light patterns in the form of light pixels.According to the invention, the method comprises a step (20) of pre-positioning the light-emitting diodes (2) with respect to the patterns of the grid (8); a step (22) of positioning the matrix (12) of light-emitting diodes (2) on the printed circuit board (4), each light-emitting diode (2) of the matrix (12) of light-emitting diodes (2) being positioned on the printed circuit board (4) at a predetermined location provided with a means (14) for soldering or reflow soldering; and a reflow step (24). FIG. 1.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

A resin composition which comprises: a modified polyphenylene ether having, at a terminal, a group represented by a formula (1) given below; a radical-polymerizable compound having, only at molecular terminals, two or more bonds or groups of at least one selected from the group consisting of a carbon-carbon unsaturated double bond and a maleimide group; a styrene-based thermoplastic elastomer in which repeating units having a carbon-carbon unsaturated double bond not belonging to an aromatic ring are contained in an amount less than 10 mol % with respect to all the repeating units; and an organic peroxide. In the formula (1), R1 represents a hydrogen atom or an alkyl group.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

To provide a wearable ergonomics improvement system, and a related method.SOLUTION: An ergonomics improvement system of embodiments comprises a membrane which has a first frame comprising a plurality of first notches for defining a first pattern 314. The system also comprises a sensor which includes a second frame comprising a plurality of second notches for defining a second pattern 324 and the sensor is coupled to the membrane. The first pattern supplements the second pattern.SELECTED DRAWING: Figure 3D-3E

A rework patch for an electronic circuit includes a flexible patch body and at least two patch traces. The electronic circuit includes a substrate, at least two board traces formed on the substrate, and at least one defect portion within at least one of the board traces. The patch body is attached to the substrate to partially cover each of the board traces and to cover the defect portion. The patch traces are formed on the patch body. A pattern of the patch traces corresponds to a pattern of a portion of the board traces covered by the patch body.

The invention relates to a conductive structure (1) for transmitting electrical signals or electrical power, comprising a substrate layer (10) made of a polymer material and a two-phase or multi-phase conducting track (11), which is disposed on the substrate layer (10) and contains a first electrically conductive layer (20) and a second electrically conductive layer (30) having an elongation at break that is greater than an elongation at break of the first layer (20).

A stretchable substrate having a first main surface and a second main surface facing each other, the stretchable substrate having one of the following characteristics: (1) the ratio of oxygen atoms in at least one of the first main surface and the second main surface with respect to the total atoms as measured by X-ray photoelectron spectroscopy is 5 at% or more, and (2) the ratio of oxygen atoms in at least one of the first main surface and the second main surface with respect to the total atoms as measured by X-ray photoelectron spectroscopy is 5 at% or more; (2) the arithmetic average surface roughness of the surface measured by a laser microscope on the first main surface or the second main surface is 6 [mu] m or more; (3) at least one of the first main surface and the second main surface has a metal-containing portion; and (4) a metal-containing region is provided along at least one of the first main surface and the second main surface.

The invention relates to a method for producing power electronics comprising at least one electrical circuit carrier (1), on which at least one power-electronics semiconductor module (3) is arranged, which is thermally conductively coupled to a heat sink (4) via a main surface of its housing (2) facing away from the circuit carrier, wherein said method enables a force-free connection between the circuit carrier, which is already fitted with the semiconductor module, and the heat sink. According to the invention, this is achieved, inter alia, by the use of positioning studs (8) on the heat sink and elastomer grommets (6), which are filled with a curable casting compound (10).

A bendable circuit board includes a first structure and a second structure. The first structure includes a first insulation layer, a first insulation extension material, a first conductive layer and a first conductive extension feature. The first insulation extension material surrounds the first insulation layer. The first conductive layer includes a first conductive feature and a second conductive feature. The first conductive extension feature connects the first conductive feature to the second conductive feature. The second structure is bonded to the first structure, and includes a second insulation layer, a second insulation extension material, a second conductive layer and a second conductive extension feature. The second insulation extension material surrounds the second insulation layer. The second conductive layer includes a third conductive feature and a fourth conductive feature. The second conductive extension feature connects the third conductive feature to the fourth conductive feature.

The present invention provides a resin composition which can provide a cured product having excellent stain removability. The present invention is a resin composition comprising (A) hollow organic polymer particles, (B) an epoxy resin, and (C) a curing agent.