82results about "Elastomeric polymer dielectrics" patented technology

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

An aspect of the present disclosure relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing resin, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) a photopolymerizable compound, and (E) an elastomer, in which (B) the thermosetting resin includes a bisphenol type epoxy compound having an average molecular weight of 360 or less and (E) the elastomer includes an acrylic elastomer.

One aspect of the present invention provides a stretchable device including a stretchable substrate, a stretchable wiring provided on the stretchable substrate, a conductive member that is in contact with the stretchable wiring, a solder member that is provided on the conductive member and is in contact with the conductive member, an electronic component electrically connected to the conductive member with the solder member interposed therebetween, and a first insulating layer covering at least a part of the stretchable wiring. An outer surface of an end portion, on a side in contact with the conductive member, of the stretchable wiring is in contact with the conductive member and the first insulating layer continuous with the conductive member.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

A polymer composition including particles having a ratio of an average particle diameter D90 to an average particle diameter D50 of 2.3 or less, and a polymer having a dielectric loss tangent of 0.01 or less, and applications thereof.

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

An electronic circuit on a textile support comprises circuit lines having conductor tracks lying over the surface of the textile support and a contacting module having a socket integrally bonded to the textile support for mechanically detachably receiving an electronic module. The contacting module comprises electrically conductive contact surfaces and is designed to receive an electronic module, which is provided with electrical contacts, at a specified position relative to the socket such that a plurality of the electrical contacts of the electronic module are electrically connected to a plurality of contact surfaces of the contacting module. The socket has an inner socket base portion and the lower side thereof is integrally bonded face-to-face to a socket cover portion of a lower cover (2800), the integrally bonded face-to-face connection containing one or more intermediate layers, each of which is connected, on both sides, to adjacent surfaces face-to-face and in which electrically conductive conductor track portions are located. The conductor track portions are electrically connected to the contact surfaces of the contacting module through the inner socket base portion, or the sides of the conductor track portions facing the specified position serve as contact surfaces of the contacting module through openings in the inner socket base.

The disclosure includes example processes for creating stretchable electronics from multi-layer flex printed circuit boards (flex-PCBs), and example platforms for soft robotic sensor arrays (SRSAs) for electric mapping applications, such as cardiac voltage mapping.

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

A method for producing a flexible structure, such as a wireless LC sensor, comprising multiple thin film layers of an elastomeric material and at least one layer of a microcorrugated conductive material, and a sensor device incorporating the flexible structure are described. The method includes steps to create a 2D corrugated metallized polydimethylsiloxane (PDMS) layer that exhibits negligible bending failure for angles up to 180 degrees, thereby achieving substantial flexibility.

The present invention provides an asymmetric metal foil-clad laminate and a printed circuit board including the same. The asymmetric metal foil-clad laminate includes one or at least two laminated low-modulus prepregs and a metal foil coated on one side of the one or at least two laminated low-modulus prepregs, or a metal foil with different thicknesses on both sides. The low-modulus prepreg has an elastic modulus of 22 GPa or less after curing. By using a low-modulus prepreg with an elastic modulus of 22 GPa or less after curing as an insulating material for the asymmetric metal foil-clad laminate, the obtained asymmetric metal foil-clad laminate and the printed circuit board manufactured therefrom have low warpage in state A and warpage after reflow soldering, ensuring the reliability of the printed circuit board.

Contact foil for establishing electrical connections between contacts (11, 39) of a first and a second contact field (6, 10) arranged opposite one another at a short distance, the contact foil (3) having a plurality of contact elements (5) enclosed by a flexible carrier web (26) made of plastic, and each contact element (5) having a contact surface (8, 9) accessible for contacting on each of the two flat sides of the contact foil (3), characterized in that the carrier web (26) is connected to a protective foil (27, 28) on at least one of the two flat sides of the contact foil (3), that the protective foil (27, 28) has a smooth and stable surface, and that the protective foil (27, 28) has holes (29, 30) through which the contact elements (5) with contact surfaces (8, 9) protrude.

The present invention relates to smart wearable clothing including a stretchable circuit electrode and a smart wearable system, and the smart wearable clothing according to an embodiment of the present invention comprises: a fabric; a stretchable circuit electrode formed on the fabric; a stretchable ACF formed on the circuit electrode; and a chipset formed on the stretchable ACF.

An electronic device includes a substrate, a circuit layer, a first electronic element and a first insulating structure. The substrate includes a first main structure, a second main structure adjacent to the first main structure, a first connecting structure connecting the first main structure and the second main structure, and a first space disposed between the first main structure and the second main structure, wherein a first edge of the first main structure is overlapped with a part of a boundary of the first space. The circuit layer has a first semiconductor. The first electronic element is electrically connected to the first semiconductor. The first insulating structure includes a first groove. In a top view, at least a part of the first groove of the first insulating structure is disposed between the first edge of the first main structure and the first electronic element.

A method for patterning a self-healing elastomer film, and / or for laser sintering and / or for improving electrical conductivity of a self-healing elastomer film, the method comprising: providing a programmable laser processing system; providing a predetermined design model in a program code format for forming one or more patterns to program the laser processing system with the design model; providing a self-healing elastomer film on a substrate; at least partly curing the self-healing elastomer film; providing the at least partly cured film to the laser processing system; treating the at least partly cured film with the laser processing system to partly or completely remove solid elastomeric material from predetermined areas with the laser to form pattern shape(s) defined by the design model to the self-healing elastomer film, and / or to laser sinter and / or to remove oxide layer to improve electrical conductivity of the self-healing elastomer film.

A permeable bioelectronic system includes a stretchable multilayer circuit containing a liquid metal (LM), and an LM interconnect for bonding one or more inorganic electronic circuit elements to the stretchable multilayer circuit.

Disclosed are a resin wiring substrate with metal wiring that is less likely to detach from a stretchable resin base, and a stretchable device enclosing the substrate. The resin wiring substrate includes a stretchable resin base (11) and a wiring pattern (21), wherein the wiring pattern (21) includes metal wiring (22) made from a metal film having a particle size of 0.5 to 2.0 µm, and wherein, in a cross-sectional view, at least a portion of the metal wiring (22) is covered by the stretchable resin base (11) and a resin cover layer made from a stretchable resin. The metal wiring (22) can have an embedded part (22a) formed along the inside of a depression (11b) formed in a first surface (11a) of the stretchable resin base (11) and an exposed part (22b) exposed in a cross-sectional view from the first surface (11a).

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.

Electronic articles having an electromagnetic interference (EMI) shield and methods are described. The electronic articles comprise an (e.g. insulting) layer comprising a polymeric component. The conductive layer may comprise fibers and conductive particles or the conductive layer may comprise a substrate comprising me (e.g. printed circuit board) comprising adhesive. In one embodiment, the polymeric component comprises a block copolymer comprising hard blocks having cyclic moieties. In another embodiment, the polymeric component has a storage modulus of at least WMPa for a temperature range from 25°C to 50°C and a loss modulus of at least 1 MPa and less than 100 MPa at 100°C.

The invention relates to an article comprising a body (1), wherein: at least one circuit board (3) and conductor tracks (4) connected thereto are present on at least one surface of the body (1); the body (1) is deformable and at least said surface of the body (1) is porous; the conductor tracks (4) are extensible and at least the conductor tracks (4) are covered by an elastomer (2); and the elastomer (2) extends into the pores of the surface of the body (1).

Disclosed in the present invention are a stretchable rigid-flex interconnection member and a manufacturing method therefor. The method comprises: providing a stretchable substrate, and printing silver paste and a liquid metal composite material respectively on a first side of the stretchable substrate to form a non-stretchable circuit layer and a stretchable circuit layer, respectively, to obtain a first rigid-flex composite structure, wherein an overlapping area exists at a junction of the non-stretchable circuit layer and the stretchable circuit layer; providing a sealant, and using the sealant to encapsulate the first rigid-flex composite structure to form a sealing layer, such that the stretchable circuit layer is covered by the sealing layer to obtain a second rigid-flex composite structure; and providing a support layer, and attaching the support layer to a second side of the second rigid-flex composite structure to obtain a target rigid-flex interconnection member. In the present invention, the rigid-flex interconnection member for electronic interconnection between a rigid circuit system and a flexible circuit system can be truly formed, and the entire rigid-flex interconnection member has excellent stretchable performances, and can meet the requirements of rigid-flex interconnection electronic products such as wearable electronic devices at the current stage.

A variable-stiffness module includes a rigid structure having a first stiffness, an intermediate substrate having a second stiffness less than the first stiffness, and a flexible substrate having a third stiffness less than the second stiffness. The rigid structure is disposed on the intermediate substrate and the intermediate substrate is disposed on the flexible substrate. A conductor is disposed partially on the intermediate substrate and partially on the flexible substrate and is connected to the rigid structure. The conductor extends from the rigid structure to the intermediate substrate to the flexible substrate. In some embodiments, a variable-stiffness module includes any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor can be an optical conductor or an electrical conductor and can be disposed over the rigid structure or between the rigid structure and the intermediate substrate.

Various embodiments relate to a microserpentine including a plurality of u-bends, each having a degree of completeness (α), in which an α value of 0° corresponds to a semi-circular shape, and in which an α value of +90° corresponds to a complete circle and −90° corresponds to a straight shape. Each of the plurality of u-bends may have an α value of from about −35° to about 45°. The microserpentine may include a core coated with a conductive coating. The core may include a polymeric material. Various embodiments relate to microelectronic devices and methods of producing the same. The microelectronic devices may include but are not limited to a microelectrode array, a microelectronics packaging, an interconnect, a stretchable sensor, a wearable sensor, a wearable actuator, an in vitro sensor, an in vivo sensor, and combinations thereof.

A stretchable device that includes: a stretchable substrate; and a stretchable wiring on the stretchable substrate, in which a loss elastic modulus E″ (S) of the stretchable substrate is smaller than a loss elastic modulus E″ (W) of the stretchable wiring.

The invention relates to an article comprising a body (1), wherein: at least one circuit board (3) and conductor tracks (4) connected thereto are present on at least one surface of the body (1); the body (1) is deformable and at least said surface of the body (1) is porous; the conductor tracks (4) are extensible and at least the conductor tracks (4) are covered by an elastomer (2); and the elastomer (2) extends into the pores of the surface of the body (1).

The invention relates to a contact structure. The contact structure has at least one electrically conductive substrate, in particular a circuit carrier. The contact structure also has a flexible printed circuit board, in particular a flexible printed circuit board, which has at least one - in particular a reversibly bendable - electrically insulating film and at least one or only one conductive layer. The conductive layer of the flexible printed circuit board is conductively connected to the substrate. The contact structure has an electrically conductive connection element, which is arranged on the conductive layer of the flexible printed circuit board, so that the connection element and the substrate sandwich the flexible printed circuit board between them. The connection element is welded to the conductive layer of the flexible printed circuit board and to the substrate in such a way that a welded connection extends from the connection element into the substrate, in particular in a direction transverse to the planar extension of the flexible printed circuit board, through the conductive layer of the flexible printed circuit board.

The present invention relates to a hollow body (1), preferably a cylindrical hollow body (1), particularly preferably a tube (1), with at least one first layer (11) which encloses an interior space (10), preferably for guiding a fluid. The hollow body (1) is characterized by at least one printed electronic component (13) which is arranged externally on the first layer (11) by printing.

A stretchable sensing structure (100) and a manufacturing method thereof, wherein the stretchable sensing structure (100) comprises: a stretchable sensing array (110), wherein the stretchable sensing array (100) comprises: at least two first sensing electrodes (10) arranged in an array; the first sensing electrodes (10) are used to sense different physiological signals; each first sensing electrode (10) comprises a first stretchable substrate layer, a pre-stretched pattern layer formed on the first stretchable substrate layer, and an electrode sheet formed on the first stretchable substrate layer and electrically contacting the pre-stretched pattern layer, wherein the electrode sheet is made of carbon paste; a plurality of signal transmission lines (20), wherein two adjacent first sensing electrodes (10) are electrically connected via the signal transmission lines (20); and a signal processing element (130); wherein the first sensing electrodes (10) are electrically connected to the signal processing element (130) via the signal transmission lines (20). The stretchable sensing structure (100) has good stretchability, diverse sensing functions, and variable resistance.