142results about "Elastomeric polymer dielectrics" patented technology

Devices, systems, and methods include a substrate layer, a metal layer coupled to the substrate layer, an encapsulant coupled to the substrate layer and the metal layer, and a stencil-in-place structure. The encapsulant is configured to electrically isolate the metal layer from environmental conditions. The stencil-in-place structure includes a stencil substrate and conductive gel secured within a channel and a via formed by the stencil substrate, the conductive gel electrically coupled to the metal layer.

There is described a method of producing a flexible structure and sensor devices incorporating the former, such as wireless LC sensors, that comprises a plurality of thin-film layers of elastomeric material and at least one layer of micro-wrinkled electrically conductive material. The method includes steps leading to 2D wrinkled metallised polydimethylsiloxane (PDMS) layers enabling considerable flexibility with negligible bending failure for angles up to 180 degrees.

The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

An aspect of the present disclosure relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing resin, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) a photopolymerizable compound, and (E) an elastomer, in which (B) the thermosetting resin includes a bisphenol type epoxy compound having an average molecular weight of 360 or less and (E) the elastomer includes an acrylic elastomer.

The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

One aspect of the present invention provides a stretchable device including a stretchable substrate, a stretchable wiring provided on the stretchable substrate, a conductive member that is in contact with the stretchable wiring, a solder member that is provided on the conductive member and is in contact with the conductive member, an electronic component electrically connected to the conductive member with the solder member interposed therebetween, and a first insulating layer covering at least a part of the stretchable wiring. An outer surface of an end portion, on a side in contact with the conductive member, of the stretchable wiring is in contact with the conductive member and the first insulating layer continuous with the conductive member.

The invention relates to a contact assembly. The contact arrangement has at least one electrically conductive substrate, in particular a circuit carrier. The contact arrangement also has an in particular flexible circuit board, the flexible circuit board having at least one, in particular reversibly flexible, electrically insulating film and at least one or only one electrically conductive layer. The conductive layer of the flexible circuit board is connected with the substrate in a conductive mode. The contact assembly has an electrically conductive connecting element which is arranged on an electrically conductive layer of the flexible circuit board such that the connecting element and the substrate enclose the flexible circuit board between the connecting element and the substrate. The connecting element is soldered to the electrically conductive layer of the flexible circuit board and to the substrate in such a way that a soldered connection extends from the connecting element, in particular in such a way as to extend transversely to the plane of the flexible circuit board, through the electrically conductive layer of the flexible circuit board until into the substrate.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

A polymer composition including particles having a ratio of an average particle diameter D90 to an average particle diameter D50 of 2.3 or less, and a polymer having a dielectric loss tangent of 0.01 or less, and applications thereof.

Methods to mask an RF switch prior to a coating process and RF switches that have been masked according to these methods.

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

An electronic circuit on a textile support comprises circuit lines having conductor tracks lying over the surface of the textile support and a contacting module having a socket integrally bonded to the textile support for mechanically detachably receiving an electronic module. The contacting module comprises electrically conductive contact surfaces and is designed to receive an electronic module, which is provided with electrical contacts, at a specified position relative to the socket such that a plurality of the electrical contacts of the electronic module are electrically connected to a plurality of contact surfaces of the contacting module. The socket has an inner socket base portion and the lower side thereof is integrally bonded face-to-face to a socket cover portion of a lower cover (2800), the integrally bonded face-to-face connection containing one or more intermediate layers, each of which is connected, on both sides, to adjacent surfaces face-to-face and in which electrically conductive conductor track portions are located. The conductor track portions are electrically connected to the contact surfaces of the contacting module through the inner socket base portion, or the sides of the conductor track portions facing the specified position serve as contact surfaces of the contacting module through openings in the inner socket base.

A durable, mechanically shock resistant electronic module for a medical device is provided. [Solution] An electronic module for a medical device such as an inhaler 100 is disclosed, the electronic module comprising a printed circuit board 118, a battery 230 connected to the electronic module, and a damper 101 configured to damp energy transfer to and / or from the battery when the electronic module is subjected to mechanical shock.

An electronic component (102), system. and method includes a substrate portion (106) forming a channel (104) and conductive gel (108) positioned within the channel. The conductive gel is arranged to create an electronic effect of the electronic component. The conductive gel forms a first elongate conductive trace (124) and a second elongate conductive trace (126). the first elongate conductive trace (124) forming a pattern of the electronic component that is mimicked by the second elongate conductive trace (126). The first and second elongate conductive traces have a common two-dimensional projection along a major axis (116) of the electronic component.

The disclosure includes example processes for creating stretchable electronics from multi-layer flex printed circuit boards (flex-PCBs), and example platforms for soft robotic sensor arrays (SRSAs) for electric mapping applications, such as cardiac voltage mapping.

Title: Guide configured to be fixed on an electronic card The invention relates to a guide (30) configured to be fixed on an electronic card (100), comprising: a body (31) comprising at least one opening for receiving an electrical pin of an electronic component, the body (31) being made of an elastic material, at least one fixing device (35) configured to cooperate with an orifice (102) of the electronic card (100) to fix the guide (30) to the electronic card (100), this fixing device (35) comprising: a base (351) forming part of the body (31) and having at least one bearing surface (352) configured to come to bear on the electronic card (100), at least one elastically deformable tab (357) having a head (354) configured to engage in the orifice (102) of the electronic card (100), this tab (357) projecting from the bearing surface (352) of the base (351),the head (354) being configured to rest on a first face (103) of the electronic card (100) when the elastic tab (357) is engaged in the orifice (102) of the electronic card (100), a slot (355) formed in the base (351). Figure for the abstract: Figure 4,

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

A method for producing a flexible structure, such as a wireless LC sensor, comprising multiple thin film layers of an elastomeric material and at least one layer of a microcorrugated conductive material, and a sensor device incorporating the flexible structure are described. The method includes steps to create a 2D corrugated metallized polydimethylsiloxane (PDMS) layer that exhibits negligible bending failure for angles up to 180 degrees, thereby achieving substantial flexibility.

The present invention provides an asymmetric metal foil-clad laminate and a printed circuit board including the same. The asymmetric metal foil-clad laminate includes one or at least two laminated low-modulus prepregs and a metal foil coated on one side of the one or at least two laminated low-modulus prepregs, or a metal foil with different thicknesses on both sides. The low-modulus prepreg has an elastic modulus of 22 GPa or less after curing. By using a low-modulus prepreg with an elastic modulus of 22 GPa or less after curing as an insulating material for the asymmetric metal foil-clad laminate, the obtained asymmetric metal foil-clad laminate and the printed circuit board manufactured therefrom have low warpage in state A and warpage after reflow soldering, ensuring the reliability of the printed circuit board.

Vibration isolation can be provided for a vibration sensitive component to be bonded to electronic circuit boards or other surfaces by an assembly that includes two substrates with rigid portions that are electrically coupled to each other via a flexible interconnect. The rigid portions of the two substrates are bonded together via an elastic structure in a stacked arrangement with the first substrate above the second substrate. The flexible interconnect electrically couples the first substrate to the second substrate and the second substrate is configured to be bonded and electrically coupled to an electronic circuit board or other larger substrate via contacts on a surface of the rigid portion of the second substrate. The vibration sensitive component can be bonded to the rigid portion of the first substrate and couped to the flexible interconnect via the first substrate, thereby coupling it to the second substrate and the larger substrate.

The invention relates to a conductive structure (1) for transmitting electrical signals or electrical power with a substrate layer (10) made of a polymeric material and a two- or multi-phase conductor track (11) arranged on the substrate layer (10) comprising a first electrically conductive layer (20) and a second electrically conductive layer (30) with an elongation at break that is greater than an elongation at break of the first layer (20).

The invention relates to a conductive structure (1) for transmitting electrical signals or electrical power, comprising a substrate layer (10) made of a polymer material and a two-phase or multi-phase conducting track (11), which is disposed on the substrate layer (10) and contains a first electrically conductive layer (20) and a second electrically conductive layer (30) having an elongation at break that is greater than an elongation at break of the first layer (20).

Contact foil for establishing electrical connections between contacts (11, 39) of a first and a second contact field (6, 10) arranged opposite one another at a short distance, the contact foil (3) having a plurality of contact elements (5) enclosed by a flexible carrier web (26) made of plastic, and each contact element (5) having a contact surface (8, 9) accessible for contacting on each of the two flat sides of the contact foil (3), characterized in that the carrier web (26) is connected to a protective foil (27, 28) on at least one of the two flat sides of the contact foil (3), that the protective foil (27, 28) has a smooth and stable surface, and that the protective foil (27, 28) has holes (29, 30) through which the contact elements (5) with contact surfaces (8, 9) protrude.

A stretchable substrate includes a first elastomer, a plurality of unit devices on the stretchable substrate, a connecting wire configured to electrically connect adjacent unit devices, and a plurality of auxiliary structures each including a second elastomer and each at least partially overlapping with at least one unit device or the connecting wire, wherein the first elastomer and the second elastomer are separate, respective polymers that commonly include at least one structural unit.

The invention provides a flexible transparent wiring substrate and a method for manufacturing the flexible transparent wiring substrate. The flexible transparent wiring substrate is provided with a base substrate and wiring, the base substrate is transparent and has flexibility and insulating properties, a groove is formed in the upper surface of the base substrate, the wiring is formed by a wiring constituent material filled in the groove, and the groove is formed in a V-shape with a width narrowing toward the depth direction.

The present invention provides a circuit substrate, a flexible film circuit and a manufacturing method thereof, and relates to the field of microelectronic technology. The circuit substrate provided by the present invention comprises: a first flexible substrate; a second flexible substrate; a liquid metal circuit, wherein the liquid metal circuit is located between the first flexible substrate and the second flexible substrate; wherein the first flexible substrate has a non-viscous state and a viscous state, wherein the first flexible substrate is in a non-viscous state when dry and is in a viscous state after contacting a first liquid. The technical solution of the present invention can simply and conveniently manufacture and use a flexible film circuit.

The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible / stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.