98results about "Elastomeric polymer dielectrics" patented technology

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

An aspect of the present disclosure relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing resin, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) a photopolymerizable compound, and (E) an elastomer, in which (B) the thermosetting resin includes a bisphenol type epoxy compound having an average molecular weight of 360 or less and (E) the elastomer includes an acrylic elastomer.

The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

One aspect of the present invention provides a stretchable device including a stretchable substrate, a stretchable wiring provided on the stretchable substrate, a conductive member that is in contact with the stretchable wiring, a solder member that is provided on the conductive member and is in contact with the conductive member, an electronic component electrically connected to the conductive member with the solder member interposed therebetween, and a first insulating layer covering at least a part of the stretchable wiring. An outer surface of an end portion, on a side in contact with the conductive member, of the stretchable wiring is in contact with the conductive member and the first insulating layer continuous with the conductive member.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

A polymer composition including particles having a ratio of an average particle diameter D90 to an average particle diameter D50 of 2.3 or less, and a polymer having a dielectric loss tangent of 0.01 or less, and applications thereof.

Methods to mask an RF switch prior to a coating process and RF switches that have been masked according to these methods.

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

An electronic circuit on a textile support comprises circuit lines having conductor tracks lying over the surface of the textile support and a contacting module having a socket integrally bonded to the textile support for mechanically detachably receiving an electronic module. The contacting module comprises electrically conductive contact surfaces and is designed to receive an electronic module, which is provided with electrical contacts, at a specified position relative to the socket such that a plurality of the electrical contacts of the electronic module are electrically connected to a plurality of contact surfaces of the contacting module. The socket has an inner socket base portion and the lower side thereof is integrally bonded face-to-face to a socket cover portion of a lower cover (2800), the integrally bonded face-to-face connection containing one or more intermediate layers, each of which is connected, on both sides, to adjacent surfaces face-to-face and in which electrically conductive conductor track portions are located. The conductor track portions are electrically connected to the contact surfaces of the contacting module through the inner socket base portion, or the sides of the conductor track portions facing the specified position serve as contact surfaces of the contacting module through openings in the inner socket base.

The disclosure includes example processes for creating stretchable electronics from multi-layer flex printed circuit boards (flex-PCBs), and example platforms for soft robotic sensor arrays (SRSAs) for electric mapping applications, such as cardiac voltage mapping.

Title: Guide configured to be fixed on an electronic card The invention relates to a guide (30) configured to be fixed on an electronic card (100), comprising: a body (31) comprising at least one opening for receiving an electrical pin of an electronic component, the body (31) being made of an elastic material, at least one fixing device (35) configured to cooperate with an orifice (102) of the electronic card (100) to fix the guide (30) to the electronic card (100), this fixing device (35) comprising: a base (351) forming part of the body (31) and having at least one bearing surface (352) configured to come to bear on the electronic card (100), at least one elastically deformable tab (357) having a head (354) configured to engage in the orifice (102) of the electronic card (100), this tab (357) projecting from the bearing surface (352) of the base (351),the head (354) being configured to rest on a first face (103) of the electronic card (100) when the elastic tab (357) is engaged in the orifice (102) of the electronic card (100), a slot (355) formed in the base (351). Figure for the abstract: Figure 4,

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

A method for producing a flexible structure, such as a wireless LC sensor, comprising multiple thin film layers of an elastomeric material and at least one layer of a microcorrugated conductive material, and a sensor device incorporating the flexible structure are described. The method includes steps to create a 2D corrugated metallized polydimethylsiloxane (PDMS) layer that exhibits negligible bending failure for angles up to 180 degrees, thereby achieving substantial flexibility.

The present invention provides an asymmetric metal foil-clad laminate and a printed circuit board including the same. The asymmetric metal foil-clad laminate includes one or at least two laminated low-modulus prepregs and a metal foil coated on one side of the one or at least two laminated low-modulus prepregs, or a metal foil with different thicknesses on both sides. The low-modulus prepreg has an elastic modulus of 22 GPa or less after curing. By using a low-modulus prepreg with an elastic modulus of 22 GPa or less after curing as an insulating material for the asymmetric metal foil-clad laminate, the obtained asymmetric metal foil-clad laminate and the printed circuit board manufactured therefrom have low warpage in state A and warpage after reflow soldering, ensuring the reliability of the printed circuit board.

Contact foil for establishing electrical connections between contacts (11, 39) of a first and a second contact field (6, 10) arranged opposite one another at a short distance, the contact foil (3) having a plurality of contact elements (5) enclosed by a flexible carrier web (26) made of plastic, and each contact element (5) having a contact surface (8, 9) accessible for contacting on each of the two flat sides of the contact foil (3), characterized in that the carrier web (26) is connected to a protective foil (27, 28) on at least one of the two flat sides of the contact foil (3), that the protective foil (27, 28) has a smooth and stable surface, and that the protective foil (27, 28) has holes (29, 30) through which the contact elements (5) with contact surfaces (8, 9) protrude.

The present invention provides a circuit substrate, a flexible film circuit and a manufacturing method thereof, and relates to the field of microelectronic technology. The circuit substrate provided by the present invention comprises: a first flexible substrate; a second flexible substrate; a liquid metal circuit, wherein the liquid metal circuit is located between the first flexible substrate and the second flexible substrate; wherein the first flexible substrate has a non-viscous state and a viscous state, wherein the first flexible substrate is in a non-viscous state when dry and is in a viscous state after contacting a first liquid. The technical solution of the present invention can simply and conveniently manufacture and use a flexible film circuit.

The present disclosure provides a stretchable circuit substrate comprising: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.

The present invention relates to smart wearable clothing including a stretchable circuit electrode and a smart wearable system, and the smart wearable clothing according to an embodiment of the present invention comprises: a fabric; a stretchable circuit electrode formed on the fabric; a stretchable ACF formed on the circuit electrode; and a chipset formed on the stretchable ACF.

An electronic device includes a substrate, a circuit layer, a first electronic element and a first insulating structure. The substrate includes a first main structure, a second main structure adjacent to the first main structure, a first connecting structure connecting the first main structure and the second main structure, and a first space disposed between the first main structure and the second main structure, wherein a first edge of the first main structure is overlapped with a part of a boundary of the first space. The circuit layer has a first semiconductor. The first electronic element is electrically connected to the first semiconductor. The first insulating structure includes a first groove. In a top view, at least a part of the first groove of the first insulating structure is disposed between the first edge of the first main structure and the first electronic element.

A method for patterning a self-healing elastomer film, and / or for laser sintering and / or for improving electrical conductivity of a self-healing elastomer film, the method comprising: providing a programmable laser processing system; providing a predetermined design model in a program code format for forming one or more patterns to program the laser processing system with the design model; providing a self-healing elastomer film on a substrate; at least partly curing the self-healing elastomer film; providing the at least partly cured film to the laser processing system; treating the at least partly cured film with the laser processing system to partly or completely remove solid elastomeric material from predetermined areas with the laser to form pattern shape(s) defined by the design model to the self-healing elastomer film, and / or to laser sinter and / or to remove oxide layer to improve electrical conductivity of the self-healing elastomer film.

A permeable bioelectronic system includes a stretchable multilayer circuit containing a liquid metal (LM), and an LM interconnect for bonding one or more inorganic electronic circuit elements to the stretchable multilayer circuit.

Disclosed are a resin wiring substrate with metal wiring that is less likely to detach from a stretchable resin base, and a stretchable device enclosing the substrate. The resin wiring substrate includes a stretchable resin base (11) and a wiring pattern (21), wherein the wiring pattern (21) includes metal wiring (22) made from a metal film having a particle size of 0.5 to 2.0 µm, and wherein, in a cross-sectional view, at least a portion of the metal wiring (22) is covered by the stretchable resin base (11) and a resin cover layer made from a stretchable resin. The metal wiring (22) can have an embedded part (22a) formed along the inside of a depression (11b) formed in a first surface (11a) of the stretchable resin base (11) and an exposed part (22b) exposed in a cross-sectional view from the first surface (11a).

1. An electroless plating composition comprising: 9 to 29 weight percent, 9.7 to 29 weight percent, or 10 to 29 weight percent of a first graft rubber copolymer comprising at least one conjugated diene monomer and at least one monovinyl aromatic monomer in polymerized form; 70 to 90 weight percent, preferably 70 to 89.7 weight percent, more preferably 70 to 85 weight percent of an ungrafted styrene polymer; 0.1 to 10 weight percent of a core / shell diene-based rubber having a particle size of 100 to 500 nanometers (nm); one or more stabilizers and / or antioxidants in a total amount of 0.1 to 5 weight percent; a fatty acid or a fatty acid salt in an amount of 0.1 to 2 weight percent; 0 to 5 weight percent of a mold release agent; 0 to 1 weight percent of a metal oxide; 0 to 3 weight percent of a lubricant; and 0 to 20 weight percent of a polycarbonate, wherein the weight percents and ppm are based on the total weight of the composition. The composition can be formed into an article having an electrolessly plated metal coating thereon.

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.

Electronic articles having an electromagnetic interference (EMI) shield and methods are described. The electronic articles comprise an (e.g. insulting) layer comprising a polymeric component. The conductive layer may comprise fibers and conductive particles or the conductive layer may comprise a substrate comprising me (e.g. printed circuit board) comprising adhesive. In one embodiment, the polymeric component comprises a block copolymer comprising hard blocks having cyclic moieties. In another embodiment, the polymeric component has a storage modulus of at least WMPa for a temperature range from 25°C to 50°C and a loss modulus of at least 1 MPa and less than 100 MPa at 100°C.

The invention relates to an electrical assembly (1) which has at least one electronic switching element (5) which is electrically contacted on its underside and on its upper side, which is opposite the underside. The electrical assembly (1) has, in addition, two wiring supports (2, 3, 4) which are situated opposite each other on the electrical contacts (7, 8). These wiring supports (2, 3, 4) are each at least in part (6) made of a permanently elastic, electrically insulating, thermally conductive material (6). The invention also relates to a method for producing such an electrical assembly (1) in which, as a result of a compressive force (9) without the need for integrally bonded connections, thermal and / or electrical contact structures of the at least one switching element (5) are produced.

The invention relates to an article comprising a body (1), wherein: at least one circuit board (3) and conductor tracks (4) connected thereto are present on at least one surface of the body (1); the body (1) is deformable and at least said surface of the body (1) is porous; the conductor tracks (4) are extensible and at least the conductor tracks (4) are covered by an elastomer (2); and the elastomer (2) extends into the pores of the surface of the body (1).

Disclosed in the present invention are a stretchable rigid-flex interconnection member and a manufacturing method therefor. The method comprises: providing a stretchable substrate, and printing silver paste and a liquid metal composite material respectively on a first side of the stretchable substrate to form a non-stretchable circuit layer and a stretchable circuit layer, respectively, to obtain a first rigid-flex composite structure, wherein an overlapping area exists at a junction of the non-stretchable circuit layer and the stretchable circuit layer; providing a sealant, and using the sealant to encapsulate the first rigid-flex composite structure to form a sealing layer, such that the stretchable circuit layer is covered by the sealing layer to obtain a second rigid-flex composite structure; and providing a support layer, and attaching the support layer to a second side of the second rigid-flex composite structure to obtain a target rigid-flex interconnection member. In the present invention, the rigid-flex interconnection member for electronic interconnection between a rigid circuit system and a flexible circuit system can be truly formed, and the entire rigid-flex interconnection member has excellent stretchable performances, and can meet the requirements of rigid-flex interconnection electronic products such as wearable electronic devices at the current stage.

A variable-stiffness module includes a rigid structure having a first stiffness, an intermediate substrate having a second stiffness less than the first stiffness, and a flexible substrate having a third stiffness less than the second stiffness. The rigid structure is disposed on the intermediate substrate and the intermediate substrate is disposed on the flexible substrate. A conductor is disposed partially on the intermediate substrate and partially on the flexible substrate and is connected to the rigid structure. The conductor extends from the rigid structure to the intermediate substrate to the flexible substrate. In some embodiments, a variable-stiffness module includes any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor can be an optical conductor or an electrical conductor and can be disposed over the rigid structure or between the rigid structure and the intermediate substrate.