Flexible circuit structure with stretchability and method of manufacturing the same

Abstract

A manufacturing method of a flexible circuit structure with stretchability includes the following steps. A plurality of compressible flexible bumps is formed on a flexible substrate; next, a metal circuit is formed on the flexible substrate and each of the compressible flexible bumps. When an external tensile force is applied on the flexible substrate, the capability of the metal circuit in withstanding the external tensile force is improved due to flexibility of the compressible flexible bumps, and thus, the stretchability of the flexible circuit is improved.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 096113690 filed in Taiwan, R.O.C. on Apr. 18, 2007, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a flexible circuit structure and a method of manufacturing the same, and more particularly to a flexible circuit structure with stretchability and a method of manufacturing the same.[0004]2. Related Art[0005]Due to the developing trend of the electronics to become light, thin, short, and small and flexible, printed circuit boards (PCBs) that cannot be bent have gradually been replaced by highly-plastic flexible printed circuits (FPCs) boards, e.g., E-papers or flexible displays. In the applications of the FPC boards, the circuits must have specially-designed structures or made of special materials to withstand an external tens...

AI Technical Summary

Benefits of technology

[0010]Accordingly, the present invention is mainly directed to a flexible circuit structure with stretchability and a method of manufacturing the same. By supporting a circuit with island-shaped flexible bumps, when a flexible substrate is deformed under an external force, the circuit has better stretchability due to the supporting of the island structure together with a curved structure of the circuit, and thus, the stretchability of the flexible circuit is improved. Moreover, through using a method of circuit implantation, the flexible circuit can be manufactured more conveniently.

[0013]Through the flexible circuit structure with stretchability and the method of manufacturing the same, when the flexible substrate bears an external tensile force and is deformed, the flexible bumps on the flexible substrate are meanwhile compressed in a vertical direction, so that the flexible substrate is deformed in a horizontal direction. Therefore, the circuit above the flexible bumps only changes from a 3D circuit into the one in the same plane, but the break circuit will not occur though there is an external stretch. Thus, the flexible circuit has better stretchability, and the flexible circuit can be manufactured more conveniently through circuit implantation.

Problems solved by technology

However, the external stresses are mainly withstood by the circuit structure directly, so that the stretchability of the circuit structure is limited.

Moreover, as an etching process is applied in most circuit process, if the width of the circuit is too small, the etching process becomes quite difficult to be achieved.

Images