751 results about "Soft layer" patented technology

The stamping process and a method of fabrication of nano-stamps with characteristic dimensions below 1 nm and up to 100 nm intended for usage in making patterns of characteristic dimensions the same as those of the nano-stamp on surface of a substrate is provided. In the process a very hard stamp is fabricated by first depositing alternating layers of two materials, one of which has very high hardness, on some sacrificial substrate via PVD, CVD or any other deposition procedure that produces alternating layers of selected thickness, from sub 1 nm to above 100 nm. The layered film is then polished to an atomically smooth finish perpendicular to the plane of the layers and etched to produce dips in the softer layers. These steps produce a grid of parallel elevations and valleys on the etched surface, which now can be used as a stamp to stamp out patterns on a substrate of lower hardness than the hardness of the elevated layers. If the substrate is stamped twice with a turning of the stamp 90 degrees between first and second stampings, a square pattern of elevations or hills and valleys is formed, which can be used for magnetic memory storage by subsequently sputtering magnetic material on the tops of the elevations or hills.

The invention is related to an electronic cigarette, including an outer shell; at least two soft layers are fitted around the outer shell and wrap the outer shell therein; the outer shell therein has a liquid storage component, an atomizer and a power supply; one end of the outer shell is set with a mouthpiece cover; the outer shell therein is further set with an liquid isolation component; the liquid storage component is disposed in a closed space enclosed by the mouthpiece cover, part of the outer shell and the liquid isolation component; inner wall of the liquid storage component is set with a conduit supporting the liquid storage component, the conduit is respectively communicated with the mouthpiece cover and the liquid isolation component; the atomizer is fixedly supported in the conduit. The electronic cigarette offers favorable feeling to touch and mouth, a simple structure, and quick and convenient assembly.

The present invention is a prosthetic for replacement of at least a part of the nucleus of a intravertebral disc. The prosthetic device is composed of at least two essentially parallel soft layers of an elastically deformable hydrogel and at least one rigid layer, the rigid layer having less compressibility than the soft layers, being adjacent to the soft layers, parallel to them, and firmly attached to them. In some embodiments, the soft layers have the same thickness and composition. Typically, the prosthesis has more than one rigid layer and these rigid layers have the same thickness and composition. The number of soft layers is usually one more than the number of rigid layers, with, e.g., at least three soft layers. The invention also includes a method of prosthesis production, which involves prefabricating soft and rigid layers; stacking at least two prefabricated soft and at least one prefabricated rigid layer in a parallel fashion into their final form, and, permitting the layers to firmly connect to one another by mutual interaction. In this method, at least one type of the layers is prefabricated in the dehydrated state, which is done by dehydrating stretched foil in an apparatus preventing its contraction and thereby decreasing its area. There is at least partial dehydration of the prosthesis under pressure applied in a direction tangent to the planes of the layers. In preferred embodiments, while in the state of almost full dehydration, is sterilized using ionizing radiation or a gaseous chemical agent, after which it is partially rehydrated within the sterile wrapper using water vapor.

The invention described in this disclosure is an apparatus and method for clamping semiconductor wafers or other substrates or workpieces during etching, CVD, or surface modification processes. The purpose of the invention is to achieve improved heat transfer during processing between the wafer/substrate and a temperature controlled pedestal used for supporting it in the process chamber. The typical level of process heat put into the wafer during plasma-based etching or deposition processes will be up to about 10 Watts per centimeter squared while the maximum acceptable temperature differential between wafer/substrate and pedestal is less than about 100 Celsius. In such low gas pressure environments typical for plasma-based processes, the heat removal from the wafer/substrate by gaseous conduction may be inadequate to meet requirements. This invention achieves excellent heat transfer to the pedestal from the wafer/substrate when there is a thin, resilient, electrically insulating layer (tape) bonded to the wafer/substrate or the pedestal. Wafer/substrate clamping for improved process heat removal is achieved by a combination of vacuum clamping of the wafer/substrate beginning prior to evacuation of the processing chamber, along with or followed by electrostatic clamping of the wafer/substrate which continues during processing. The invention also permits the wafer/substrate to be rapidly and safely released from the electrostatic clamping when the chamber is returned to atmospheric pressure by a providing a slight pressure increase, above atmospheric pressure, between wafer and pedestal. The pedestal may have some roughening or narrow grooves on the wafer clamping surface, and some small holes from its surface leading to an evacuated plenum or channel within the pedestal. Alternatively, the pedestal may have a layer of a porous metal extending from its surface down to the evacuated channel or plenum which permits gas to be evacuated. These structures allow vacuum pumping of gas that might otherwise be trapped between the insulating layer and the pedestal. When a wafer/substrate is placed on the pedestal by loading at atmospheric pressure, vacuum pumping through the pedestal is commenced. This causes the workpiece to be pressed to the pedestal clamping surface with approximately atmospheric pressure compressing the soft layer against its clamping surface. This provides sufficient contact of the soft layer with the pedestal to greatly improve heat transfer from the wafer/substrate to the pedestal. A voltage is applied to the pedestal, beginning any time after the wafer is on the pedestal, to further clamp the wafer electrostatically. As the processing chamber is then pumped down to operating pressure for processing the electrostatic clamping voltage maintains sufficient pressure of the wafer/substrate against the pedestal to maintain the heat conductive contact between the soft layer and the pedestal. This permits good heat conduction to be maintained during the low pressure plasma-based etching or CVD processing. Following processing when the wafer/substrate is to be removed it may be rapidly de-clamped from the electrostatic clamping by application of a slight over-atmospheric pressure in the reservoir or pumping channels within the pedestal.

A magnetic tunnel junction (MTJ) device is configured to store at least two bits of data in a single cell utilizing the variable resistance characteristic of a MTJ. The MTJ includes a soft and two fixed magnetic layers with fixed field directions oriented in perpendicular directions. The soft magnetic layer is separated from the fixed layers by insulating layers preferably with different thicknesses, or with different material compositions. The resulting junction resistance can exhibit at least four distinct resistance values dependent on the magnetic orientation of the free magnetic layer. The cell is configured using a pattern with four lobes to store two bits, and eight lobes to store three bits. The resulting cell can be used to provide a fast, non-volatile magnetic random access memory (MRAM) with high density and no need to rewrite stored data after they are read, or as a fast galvanic isolator.

The invention discloses a biomimetic mechanical jellyfish that is driven by shape memory alloy wires, relates to a biomimetic mechanical jellyfish and aims at solving the problems that the existing biomimetic mechanical jellyfishes only simulate jellyfish actions, do not cover devices such as a drive device and the like, and have complex structure and the biomimetic effect that is totally different with the action principle of real jellyfishes. The biomimetic mechanical jellyfish has following structure: an action unit (10) consists of the shape memory alloy wires (12), an elastic body (13), a coating skin (15) and a substrate (16), the substrate (16) and the shape memory alloy wires (12) are fixedly arranged on the elastic body (13), the action unit (10) is coated inside an umbrella-like soft layer (11), the coating skin (15) covers outside the shape memory alloy wires (12), the substrate (16) and a sealing cover (3) are fixedly connected with a supporting body (2), a power source (7), a control device (5), a communication device (6) and a sinking and floating control device (9) are fixedly arranged on the supporting body (2), and the power source (7) provides electricity respectively to the control device (5), the communication device (6) and the shape memory alloy wires (12). The biomimetic mechanical jellyfish has simple structure, lightness, low production cost, large action range and good biomimetic effect.

A housing for electronic device, comprising: a metal substrate, the substrate having a bonding surface, a peripheral edge, and a ridge protruding from the peripheral edge and surrounding the bonding surface; a soft layer soft to the touch, the soft layer having an edge; and an adhesive layer located between the bonding surface of the substrate and the soft layer, thereby bonding the soft layer to the substrate, the ridge of the substrate blocking the edge of the soft layer. A method for making the present housing is also provided.

The invention discloses a curing forming method and a forming die used for a non-slab composite material part. The method comprises the steps as follows: composite material part blank is arranged on a rigid die body which has the same shape with the processing shape and gluing and layer-paving are carried out according to the required dimension; after the layer-paving is finished, the composite material part blank is arranged on the rigid die body; furthermore, surfaces with plane are provided with elastic soft layers; corner pure rubber layers which are connected with elastic soft layer joint seams are arranged at corner profile so as to form a soft die surface; subsequently, vacuum bag auxiliary material is arranged on the soft die surface so as to prepare the vacuum bag curing forming composite material part. By the flexible soft die consisting of rubber-fabrics, the method arranges the composite material part blank on the surface of the soft die after the layer-paving is finished; the method for preparing the vacuum bag curing forming part solves the surface quality problems in the prior art that the non-die surface of the bag-pressing forming composite material part is crapy, accidented and has no gloss and the like, and improves the working efficiency.

The invention discloses an underwater drag-reduction surface simulating scarfskin morphology of a puffer and a preparation method. The underwater drag-reduction surface simulating the scarfskin morphology of the puffer comprises a basement, hard drag reduction elements, and soft cover layers, wherein a plurality of hard drag reduction elements are distributed on the basement, the soft cover layers are filled among the hard drag reduction elements, and the hard drag reduction elements are tightly attached to the joint surface of the basement and the hard drag reduction elements. By adoption of the tapered or columnar hard drag reduction elements, the underwater drag-reduction surface simulating the scarfskin morphology of the puffer is different from the existing rib-shaped groove structure; and the soft layers are covered on the basement and form the rigid-flexible drag reduction surface which can form adaptive variations with differences of water velocity on the surface and fit with the scarfskin properties of the puffer better.

The invention discloses a soft rock strata grouting elevating method compensating for building settlement caused by subway tunnel under crossing, and aims at the treating the earth surface building settlement disease caused by subway tunnel construction. The method comprises the steps that firstly, elevating grouting soft layer selection is conducted; secondly, soft layer pre-strengthening is conducted; thirdly, soft layer escape stop curtain construction is conducted; and fourthly, soft layer grouting elevating is conducted, and it is ensured that the building settlement value and the settlement difference do not exceed the allowed value. Through the technology that ring-direction grouting is conducted on the periphery of a soft layer to construct a stratum escape stop curtain, damage tothe native foundation due to the grouting elevating construction is avoided, and the requirement for elevating grouting equipment is effectively lowered; and the grouted soft layer is prevented from sliding and escaping towards the periphery under the load action of an overlying strata and the earth surface building, and the construction technology compensating for subway tunnel under crossing building settlement based on soft layer grouting elevating is developed.

The present invention provides a polarizing plate comprising a substrate, a polarizing coating layer formed on one side of the substrate, a first adhesive layer formed on the polarizing coating layer, a first retardation coating layer formed on the first adhesive layer, a second adhesive layer formed on the first retardation coating layer, a second retardation coating layer formed on the second adhesive layer, and a soft layer formed on the second retardation coating layer, wherein, the soft layer has an amended toughness of 1,000 to 40,000 MPa·%. The polarizing plate according to the present invention has excellent bending resistance and thus can be effectively used for a flexible display.

A fabrication method of a chip scale package includes: disposing a chip on a carrier board and embedding the chip into a composite board having a hard layer and a soft layer; and removing the carrier board so as to perform a redistribution layer (RDL) process, thereby solving the conventional problems caused by directly attaching the chip on an adhesive film, such as film-softening caused by heat, encapsulant overflow, chip deviation and contamination, etc., all of which may result in poor electrical connection between the wiring layer and the chip electrode pads in the subsequent RDL process and even waste products as a result.

The stamping process and a method of fabrication of nano-stamps with characteristic dimensions below 1 nm and up to 0.1 micron intended for usage in making patterns of characteristic dimensions same as those of the nano-stamp on surface of a substrate is provided. In the process a very hard stamp is fabricated by first depositing alternating layers of two materials, one of which has very high hardness, on some sacrificial substrate via PVD, CVD or any other deposition procedure that produces alternating layers of selected thickness, from sub 1 nm to above 100 nm. The layered film is then polished to atomically smooth finish perpendicular to the plane of the layers and etched to produce dips in the softer layers These steps produce a grid of parallel elevations and valleys on the etched surface, which now can be used as a mold to stamp out patterns on a substrate of lower hardness than the hardness of the elevated layers. If the substrate is stamped twice with turning of the stamp 90 degrees between first and second stampings, a square pattern of hills and valleys is formed, which can be used for magnetic memory storage by subsequently sputtering magnetic material on the tops of the elevations or hills.

Provided is a galvanized steel sheet having a tensile strength of 770 MPa or more including a steel sheet portion, and a plated layer formed on the surface of the steel sheet portion, in which the plated layer is a galvanized plated layer or an galvannealed plated layer, the steel sheet portion has a soft layer that directly adjoins the interface with the plated layer and an inside layer that is other than the soft layer, the thickness D of soft layer is 0.001% to 5% of thickness t of the steel sheet portion, and, when the hardness of the soft layer measured by nano-indentation method is indicated by H1, and the representative hardness of the steel sheet portion measured by the nano-indentation method is indicated by Ha in cross section that goes along the thickness direction of the steel sheet portion, H1 is 5% to 75% of Ha.

A polymer interlayer having improved sound insulation is disclosed. The polymer interlayer comprises at least one soft layer wherein the soft layer comprises: a first poly(vinyl butyral) resin having a first residual hydroxyl content and a first glass transition temperature (T_g); a second poly(vinyl butyral) resin having a second residual hydroxyl content and a second glass transition temperature (T_g), wherein the difference between the first residual hydroxyl content and the second residual hydroxyl content is at least 1.0 weight percent; wherein the difference between the first glass transition temperature (T_g) the second glass transition temperature (T_g) is at least 1.5° C.; and a plasticizer; at least one stiffer layer comprising a third poly(vinyl butyral resin) having a third residual hydroxyl content; and a plasticizer, wherein the polymer interlayer has a damping loss factor (q) (as measured by Mechanical Impedance Measurement according to ISO 16940) of at least about 0.16 measured at two or more different temperatures selected from 10° C., 20° C. and 30° C.

The invention belongs to the field of geotechnical test and deformation simulation, and particularly relates to an overlaying-ring ring shear apparatus and an overlaying ring shear test for continuouslarge-displacement shear deformation characteristic research of soil and complicated structural soil deformation simulation. The overlaying-ring ring shear apparatus comprises a vertical pressurizingmechanism, a twisting mechanism, a vertical assisting pressure applying mechanism and an overlaying ring shear box mechanism; the overlaying ring shear box mechanism is arranged on the twisting mechanism and can be driven by the twisting mechanism to rotate; the vertical pressurizing mechanism can apply vertical pressure to the overlaying ring shear box mechanism by virtue of the vertical assisting pressure applying mechanism; the limitless deformation ring-shaped shear of different geotechnical test samples of different heights can be performed, and the test sample is enabled to have certainfreedom and continuity in the deformation process; and the overlaying-ring ring shear apparatus can also be used for researching a deformation law of different material contact surfaces, simulating long-distance deformation of the complicated structural soil landslide as well as searching soft layers.