597 results about "Anisotropic conductive adhesive" patented technology

An anisotropic conductive adhesive contains conductive particles dispersed in a resin composition, wherein the resin composition includes a radical polymerization resin (A), an organic peroxide (B), a thermoplastic elastomer (C) and a phosphoric ester (D). The resin composition can further contain an epoxy silane coupling agent (E) represented by formula (2) or (3). The resin composition is mixed with other components after the radical polymerization resin (A), the thermoplastic elastomer (C), the phosphoric ester (D) and the epoxy silane coupling agent (E) are reacted. It is also possible to preliminarily react only the phosphoric ester (D) and the epoxy silane coupling agent (E) and to react the product of the preliminary reaction with the radical polymerization resin (A) and the thermoplastic elastomer (C), and then to add other components. The anisotropic conductive adhesive of the present invention can be used for electrical joining of electronic or electric parts of electrical apparatus.

In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads. In this flex-rigid wiring board, transmission of high-frequency signals can be prevented from being delayed, noises can be suppressed, and an excellent electrical connection and connection reliability be assured.

The present invention provides a wireless chip having high mechanical strength. Moreover, the present invention also provides a wireless chip which can prevent an electric wave from being blocked. In a wireless chip of the present invention, a layer having a thin film transistor formed over an insulating substrate is fixed to an antenna by an anisotropic conductive adhesive, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer; the first conductive layer and the second conductive layer has the dielectric layer therebetween; the first conductive layer serves as a radiating electrode; and the second electrode serves as a ground contact body.

It is an object of the present invention to provide a wireless chip of which mechanical strength can be increased. Moreover, it is an object of the present invention to provide a wireless chip which can prevent an electric wave from being blocked. The invention is a wireless chip in which a layer having a thin film transistor is fixed to an antenna by an anisotropic conductive adhesive or a conductive layer, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer. The dielectric layer is sandwiched between the first conductive layer and the second conductive layer. The first conductive layer serves as a radiating electrode and the second conductive layer serves as a ground contact body.

Further reduction in frame portion is achieved in the case where a driver circuit and a pixel portion are formed on a common substrate. Also, a light emitting device is provided with an advantageous structure for obtaining a large number of panels by use of a large substrate, whereby the number of panels taken out from a substrate can be increased, leading to better productivity. According to the invention, a terminal electrode is provided in the position overlapping a peripheral circuit portion, and the terminal electrode is connected to an FPC with an anisotropic conductive adhesive material. In addition, a covering material is firmly fixed by using a sealant that is in contact with the edge and periphery of a substrate.

Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film.

The invention relates to the field of laminated glass, particularly a laminated glass with high heat reflectivity and electric heating function applicable to the field of vehicles or construction, more particularly an automobile windshield glass installed on a vehicle. The electrically-heatable low-emissivity coated laminated glass comprises two glass substrates, a middle polymer sandwiched between the two glass substrates, low-emissivity film and a bus, wherein the low-emissivity film is arranged on at least one glass substrate surface in contact with the middle polymer; the bus is distributed on the low-emissivity film; and the bus is a pressure-sensitive adhesive or anisotropic conductive adhesive. According to the electrically-heatable low-emissivity coated laminated glass provided by the invention, the ACF (anisotropic conductive film) or PSA (pressure-sensitive adhesive) is used as the bus in combination with the low-emissivity film to heat the laminated glass, thereby removing frost and melting ice; and thus, compared with the adoption of other buses, the invention simplifies the production technique, is convenient to operate, lowers the material cost and enhances the production efficiency and process yield.

Disclosed is an anisotropic conductive adhesive (10) having an adhesive layer (12) and conductive particles (16) individually adhered to the adhesive layer, the conductive particles being arranged in an ordered array. The size of the conductive particles is at least somewhat smaller than the thickness of the adhesive layer. Also disclosed is an anisotropic conductive adhesive having an adhesive layer, conductive particles individually adhered to the adhesive layer, and a release liner (28) having an ordered array of dimples. The conductive particles reside in a single layer in the dimples. The anisotropic conductive adhesive is made by placing the conductive particles in an ordered array of dimples on a low adhesion surface. An adhesive layer is then laminated on top such that the conductive particles individually adhere to the adhesive layer. The anisotropic conductive adhesive may be used to electrically connect fine pitch electrodes on opposing circuit layers.

Disclosed is a package-on-package semiconductor device comprising a bottom package, a top package thereon and a ACA (Anisotropic Conductive Adhesive) layer. A plurality of ball pads are disposed on the peripheries of an upper surface of the substrate of the bottom package. A plurality of solder balls are disposed at the peripheries of the lower surface of the substrate of the top package. The ACA layer having a central opening is interposed between the bottom package and the top package where the ACA layer contains a plurality of conductive particles. Therein, the size of the central opening and the thickness of the ACA layer are selected such that the anisotropic conductive adhesive layer adheres the peripheries of the upper surface of the bottom package to the peripheries of the lower surface of the top package and the solder balls are encapsulated inside the anisotropic conductive adhesive layer. The solder balls encapsulate some of the conductive particles to mechanically joint and electrically connect to the ball pads. Thereby, the bonding strength of the solder balls can be improved and the warpage of the substrate of the bottom package is effectively reduced to avoid failure of electrical connections between both packages caused by the breaking of soldering joints.

The invention provides a liquid crystal display panel binding method and structure. The liquid crystal display panel binding method is that fusion metal material or conductive glue material is applied to the side surface and the upper surface of a TFT substrate to form a conductive pattern connected with a lead wire; and then conductive pattern and a flip-chip thin film can be bond when anisotropic conductive adhesive film is arranged on the side surface of the TFT substrate. The process is simple; a binding area is arranged on the side surface of the TFT substrate, so compared with a binding method of arranging the binding area on the upper surface of the TFT substrate, liquid crystal display panel narrow frame display and narrow frame tiled display can be achieved; and unfavorable effects due to the bend of the flip-chip thin film can be effectively avoided. The liquid crystal display panel binding structure can be achieved by the use of the above binding method; the binding area is arranged on the side surface of the TFT substrate, so liquid crystal display panel narrow frame display and narrow frame tiled display can be facilitated.

A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The light-reflective insulating particles are at least one of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide, or resin-coated metal particles formed by coating the surface of scale-like or spherical metal particles with an insulating resin.

An anisotropic conductive adhesive that provides strong adhesion to metals and organic substrates to generate stable and reliable electric interconnects. The adhesive provides the benefits of short thermocompression bond time at low temperatures. The adhesive contains cationic curable resin, latent cationic catalyst that thermally cures the resin at high speeds and low temperatures, conductive filler, optionally a film forming thermoplastic solid resin and optionally nano size filler. The optional nano filler provides the benefit of reducing the coefficient of thermal energy mismatch, improving the adhesion strength and reducing the total heat of reaction for the system.

An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.

an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal alloy including silver, gold and hafnium formed on the surface of a resin particle as a core by sputtering method. The light reflective metal layer is preferably formed having a composition ratio of a silver of at least 50% by weight to at most 80% by weight: a gold of at least 10% by weight to at most 45%: a hafnium of at least 10% by weight to at most 40% by weight, and a total ratio does not exceed 100% by weight.

The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.

An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM³⁵, EM⁵⁵, EM⁹⁵, and EM¹⁵⁰, respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM^55-95 and ΔEM^95-150, respectively, the following expressions (1) to (5) are satisfied.

700Mpa≦EM³⁵≦3000MPa  (1)

EM¹⁵⁰<EM⁹⁵<EM⁵⁵<EM³⁵  (2)

ΔEM^55-95<ΔEM^95-150  (3)

20% ≦ΔEM^55-95  (4)

40% ≦ΔEM^95-150  (5)

Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½- 3/2 of the second height. The second adhesive layer includes a thermosetting resin, a hardener for hardening the thermosetting resin, and a plurality of conductive particles each having an average particle diameter of ½ or less of the width of gaps between the plurality of electrodes and a first density dispersion, has a second thickness larger than two times the average particle diameter of the conductive particles, and is formed on one surface of the nonconductive first adhesive layer.

A method of manufacturing an LED includes the following steps: preparing an LED wafer including a substrate and an epitaxial layer formed on the substrate; cutting the epitaxial layer of the LED wafer into a plurality of LED dies with a gap defined between every two neighboring dies; filling an electrically insulating material in each gap between neighboring LED dies such that the neighboring LED dies are separated from each other by the insulating material; providing a circuit board having a layer of anisotropic conductive adhesive coated thereon; pressing the LED dies against the adhesive to bring the top surfaces of the LED dies into contact with the adhesive such that the LED dies each are electrically connected to the circuit board via the adhesive; and encapsulating the LED dies with a light penetrable material.

A method of manufacturing a wafer-level flip chip package is capable of being used to produce a flip chip package by directly coating a flip chip package using anisotropic conductive adhesives (ACA) and non conductive adhesives (NCA) in a solution state as a double layer on a wafer. The method can be used to manufacture a non-conductive mixed solution and a conductive mixed solution and directly coat them on a substrate, such that it is possible to: increase productivity; simplify a manufacturing process; suppress a shadow effect; easily perform thickness control that is difficult with the anisotropic conductive adhesive paste or the non-conductive adhesive paste; and obtain the non-conductive layer and the anisotropic conductive layer in an initial state of a B-stage with a level not losing latent of hardening through a simple drying process to volatilize an organic solvent. Above all, the non-conductive layer and the anisotropic conductive layer is sequentially stacked on the substrate formed with the non-solder bump, making it possible to make the selectivity of electrical conduction and the stability of a connection process excellent, shorten process time and costs, and dramatically reduce consumption of the conductive particles which account for a large portion of total production costs.

An anisotropic conductive adhesive sheet comprising at least a curing agent, a curable insulating resin and conductive particles, wherein in a region extending from a one-side surface of the anisotropic conductive adhesive sheet along the thickness direction to a position of not greater than 2.0 times the average diameter of the conductive particles, 90% or more of the sum of conductive particles are present, the 90% or more of the sum of conductive particles being present without contact with other conductive particles, and wherein the average diameter of conductive particles is in the range of 1 to 8 μm, the average particle distance between adjacent conductive particles being in the range of 1 to 5 times the average particle diameter and not greater than 20 μm, and wherein the thickness of the anisotropic conductive adhesive sheet is at least 1.5 times the average particle distance but not greater than 40 μm.