An anisotropic conductive adhesive including conductive particles dispersed in an epoxy-based adhesive containing an epoxy compound and a curing agent gives a cured product having the elastic modulus satisfying the expressions (1) to (5), in which EM35, EM55, EM95, and EM150 are values of the elastic modulus of the cured product at 35° C., 55° C., 95° C., and 150° C., respectively, ΔEM55-95 is the rate of change in the elastic modulus between 55° C. and 95° C., and ΔEM95-150 is the rate of change in the elastic modulus between 95° C. and 150° C.,
700 MPa≦EM35≦3000 MPa (1)
EM150<EM95<EM55<EM35 (2)
ΔEM55-95<ΔEM95-150 (3)
20%≦ΔEM55-95 (4)
40%≦ΔEM95-150 (5).