65results about How to "Improve conduction reliability" patented technology

There is provided a liquid jetting apparatus, including: a channel structure in which a liquid channel including a nozzle and a pressure chamber communicating with the nozzle is formed; a piezoelectric element including a piezoelectric body and an electrode; a driving device; and a cover member joined to the surface of the channel structure. A first wiring section connected to the electrode is formed on the surface of the channel structure, and the cover member includes a cover body section and a wiring connection section. A second wiring section is formed in the cover member. The wiring connection section is joined to the surface of the channel structure in a state that the second wiring section is electrically conductive with the first wiring section. A thickness, of the wiring connection section is thinner than a thickness of the cover body section.

The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 mum and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90 mum and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through holes electrically conductive, coating the substrate with a photosensitive dry film, and developing and hardening the photosensitive dry film as a plating resist; and copper-plating the inside of the through holes and the opening periphery thereof. The manufacturing method further comprises the steps of coating the copper-plated area with a metal protective film, eliminating the photosensitive dry film; forming a circuit pattern; and conducting an overlaying treatment as a post-processing step.

Provided are an adhesive film which can connect an electronic component to a substrate without causing short-circuiting, a connecting method and a connected body. The adhesive film is provided with a first adhesive layer wherein conductive particles are dispersed, and a second adhesive layer adhered on the first adhesive layer. The first and the second adhesive layers are adhesive films containing a sub resin composition. The first adhesive layer contains a first main resin composition having a glass transition temperature higher than that of the sub resin composition. The second adhesive layer contains a second main resin composition, which has a glass transition temperature higher than that of the sub resin composition but lower than that of the first main resin composition. The reaction peak temperature of the first and the second adhesive layers is lower than the glass transition temperature of the first main resin composition but higher than that of the second main resin composition.

A movable connector with which an insertion force of a connection object that places a load on a solder portion can be reduced, that has a floating function, and that can be reduced in size is provided. As a result of a pushing operation in which an operation housing is pushed into a fixed housing, a relay terminal is conductively connected to a substrate connection terminal, which is in conductive contact with a substrate, and a pin terminal, which is disposed in a movable housing and serves as the connection object, in the movable housing. Accordingly, the overall size of the movable connector can be reduced. In addition, the insertion force applied to the pin terminal is not applied to the solder portion by which the movable connector is fixed to the substrate, so that conduction failure does not occur.

A conductive filled polymer contact which is molded at an aperture through a carrier sheet includes an elongated conductive frame introduced prior to the molding process as an insert which is held captive in the molded contact and which extends from at or near the upper contact surface, through the aperture and terminates at the opposite end at or near the lower contact surface to provide a continuous conductive path through the length of the contact, whereby the sequence of particle to particle interfaces within the molded polymer contact is reduced in number to increase reliability.