248results about "Magnetostrictive device manufacture/assembly" patented technology

An elongate structure having a magnetostrictive material composition is subjected to tensile stress in the longitudinal-axial direction, thereby generally orienting the magnetization of the elongate structure in the longitudinal-axial direction. Electrical current is conducted through the elongate structure and / or through at least one adjacent elongate conductor, thereby generally orienting the magnetization of the elongate structure in the transverse direction, generally in parallel with the transverse direction of the magnetic field concomitant the conduction of current through the elongate structure. The elongate structure magnetostrictively contracts due to the (generally 90°) repositioning of the magnetization of the elongate structure. Examples of inventive configurational variants include: (i) an elongate structure itself conducting current; (ii) a hollow elongate structure accommodating placement therethrough of at least one elongate conductor; (iii) an elongate structure flanked by a pair of elongate conductors conducting current in opposite directions; (iv) plural elongate structures bordering a centralized elongate conductor.

A resonator according to the present invention includes a supporting substrate, a piezoelectric layer, a pair of excitation electrodes, and a bonding layer. The piezoelectric layer is made of a piezoelectric material. The pair of excitation electrodes is formed on the upper surface of the piezoelectric layer so as to excite bulk acoustic waves. The bonding layer has a cavity formed therein so as to face the excitation electrode pair through the piezoelectric layer, and the bonding layer bonds the supporting substrate to the lower surface of the piezoelectric layer.

A method for producing a detection / test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.

An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.