A novel
adhesive tape bonding performance testing device comprises a testing box, an
electric heating plate, a
semiconductor refrigeration mechanism, a tension sensor, a pulling mechanism, a
control circuit and a display circuit. A heating shell is mounted at the lower end of the test box, an
electric heating plate is mounted in the heating shell, and a
semiconductor refrigeration mechanism is mounted at the upper end of the test box; the tension sensor and the pulling mechanism are installed in the test box, and the
control circuit and the display circuit are installed in the element box and electrically connected. Under the combined action of the
electric heating plate or the
semiconductor refrigeration mechanism and the like, the novel
adhesive property of the
adhesive tape can be tested in different low-temperature or high-temperature environments, the pulling mechanism can be controlled to stop working through the
control circuit at the moment that the two sections of adhesive tape are separated, and adhesive force data are synchronously displayed through the
voltage display meter (the displayed data are kept all the time). According to the utility model, convenience is brought to testers, and the true and reliable
test data is correspondingly ensured. In conclusion, the device has a good application prospect.