1615 results about "Electric coupling" patented technology

A modular power plant assembly for distributed power generation includes a power generator assembly, to generate electrical power, mounted on a trailer. An AC/DC distribution panel electrically coupled to the power generator assembly is mounted on the power generator assembly. A Medium Voltage module electrically coupled to the power generator assembly is mounted on the trailer. The AC/DC distribution panel and the Medium Voltage module together control and distribute the electrical power generated by the power generator assembly. A plurality of auxiliary components to supply fuel and air to the power generator assembly are mounted adjacent to the power generator assembly on a skid attached to the trailer.

A high performance electrical interconnect adapted to provide an interface between terminals on first and second circuit members. The electrical interconnect includes a first circuitry layer with a first surface and a second surface having a plurality of contact pads adapted to electrically coupled with the terminals on the first circuit member. At least one dielectric layer is printed on the first surface of the first circuitry layer. The dielectric layer includes a plurality recesses. A conductive material is deposited in at least a portion of the recesses to create circuit geometry electrically coupled with the first circuitry layer. A second circuitry layer includes a first surface a plurality of contact pads adapted to electrically couple with the terminals on the second circuit member and a second surface attached to the dielectric layers. The circuit geometry electrically couples the first circuitry layer to the second circuitry layer.

An electrical interconnect for providing a temporary interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the conductive traces into the openings. Conductive structures are electrically coupled to the conductive traces over the openings. The conductive structures are adapted to enhance electrical coupling with the terminals on the IC device. Vias electrically extending through the substrate couple the conductive traces to PCB terminals located proximate a second surface of the substrate.

Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

A preferred embodiment of a cable harness assembly includes a shielded cable comprising a first and a second conductor for conducting a pair of differential signals, and a generally planar board having a first and a second electrically-conductive trace formed thereon and having a first and a second major surface. The first trace is electrically coupled to the first conductor at a first location on the first major surface and extends along the first major surface to a second location on the first major surface. The second trace is electrically coupled to the second conductor at a third location on the first major surface and extends along the first and the second major surfaces to a fourth location on the second major surface.

Provided is a semiconductor device having a pad on a semiconductor chip, a first passivation film formed over the semiconductor chip and having an opening portion on the pad of a probe region and a coupling region, a second passivation film formed over the pad and the first passivation film and having an opening portion on the pad of the coupling region, and a rewiring layer formed over the coupling region and the second passivation film and electrically coupled to the pad. The pad of the probe region placed on the periphery side of the semiconductor chip relative to the coupling region has a probe mark and the rewiring layer extends from the coupling region to the center side of the semiconductor chip. The present invention provides a technology capable of achieving size reduction, particularly pitch narrowing, of a semiconductor device.

Apparatus and methods for performing acoustical measurements are provided having some and preferably all of the following features: (1) the system is operated under near-field conditions; (2) the piezoelement or piezoelements used in the system are (a) mechanically and electrically damped and (b) efficiently electrically coupled to the signal processing components of the system; (3) each piezoelement used in the system includes an acoustical transformer for coupling the element to a gaseous test medium; (4) speed of sound is determined from the time difference between two detections of an acoustical pulse at a receiver; (5) cross-correlation techniques are employed to detect the acoustical pulse at the receiver; (6) fast Fourier transform techniques are used to implement the cross-correlation techniques; and (7) stray path signals through the body of the acoustic sensor are removed from detected signals prior to signal analysis. Techniques are also provided for performing acoustical measurements on gases whose thermodynamic properties have not been measures and on mixtures of compressible gases. Methods and apparatus for performing feedback control of a gas of interest in a mixture of that gas and a carrier gas are provided in which the controlled variable is the flow of the carrier gas.

A presently-preferred embodiment of an electrical-energy meter comprises a base adapted to be mounted on a supporting surface, a current sensor assembly comprising a plurality of contact blades extending through the base and adapted to electrically contact a conductor of electrical energy, and a current transformer mechanically coupled to the base and electrically coupled to the contact blades. The electrical-energy meter further comprises a circuit board assembly comprising a main circuit board electrically coupled to the current transformer and the contact blades. The electrical-energy meter also comprises a circuit-board support member comprising a rim portion fixedly coupled to the base, and a first bracket adjoining the rim portion. The first bracket has a first and a second leg each extending away from the rim portion and the base and each being adapted to securely engage the main circuit board.

An antenna module for a motor vehicle has a first antenna device having at least one antenna 5, 7, 9, 11, 13 for the exterior of the motor vehicle, which antenna is arranged in the external area of the motor vehicle, and a second antenna device having at least one antenna 25, 27, 29, 31 for the interior of the motor vehicle, which antenna is arranged in the interior of the motor vehicle, the first antenna device and second antenna device being electrically coupled to each other for the purpose of supplying electricity to the antenna devices.

A cable connector includes a circuit board, having a predetermined width in a manner passable through an elongated tube of an endoscope apparatus, disposed to extend in an axial direction. A terminal group is formed on the circuit board, for electrically contacting a socket connector. First and second land patterns are formed on the circuit board, arranged in the axial direction so that the terminal group is disposed therebetween, wherein a front end of a first electric line group having lines among electric lines of a cable structure is electrically coupled to the first land pattern, and a front end of a second electric line group having lines among the electric lines is coupled to the second land pattern. A wiring pattern is formed on the circuit board, for electrically coupling the first land pattern to the terminal group and coupling the second land pattern to the terminal group.

An electrical connector includes a housing and a plurality of contacts within the housing that are configured to engage with mating contacts of a mating connector. The contacts form at least a first differential pair and a second differential pair. The electrical connector also includes a circuit board housed within the housing. The circuit board has a substrate body formed from a dielectric material and includes a first trace electrically coupled to a contact of the first differential pair and a second trace electrically coupled to a contact of the second differential pair. At least one of the first and second traces is an open-ended trace. The circuit board also has a non-ohmic plate that is positioned adjacent to the traces. The plate is positioned to electromagnetically couple the first and second traces to each other and the non-ohmic plate and traces are configured for a desired electrical performance.

A configurable rack for supporting components of an uninterruptible power supply includes a frame assembly having a front and a rear. At least one of the front and the rear is configured to receive electronic modules in stacked relation along a height of the frame assembly. The configurable rack further includes a busbar backplane disposed between the front and the rear. The busbar backplane extends vertically within the frame assembly and is configured to be electrically coupled to the at least one electronic module received within the front and/or the rear of the frame assembly.

The present invention relates to a method of determining a representation of a fingerprint pattern. The method comprises the steps of acquiring a reference signal indicative of an electric coupling between a hand surface having friction ridges and a reference sensing structure extending across a plurality of the friction ridges; and determining the representation of the fingerprint pattern based on the reference signal and a capacitive coupling between the finger and each of a plurality of sensing elements. The acquired reference signal can, for example, be used for controlling the sensing elements so that the sensing performed by the sensing elements is carried out using favorable timing, when the signal quality is good. Alternatively, or in combination, the acquired reference signal may be used for post-processing, whereby the signals/signal values obtained by the sensing elements are modified depending on the corresponding values of the reference signal.

In one embodiment, the invention is an apparatus (e.g., an Ethernet switch) having an isolated side and a line side. A line-side connector is connectable to a cable. An isolated-side physical-layer module (1) is electrically coupled to the connector via a signal-isolation transformer and (2) processes signals transmitted over the cable. A line-side power conditioning module (1) is electrically coupled to an isolated-side power switcher via a power-isolation transformer that converts an AC power signal received from the power switcher into a transformed AC power signal and (2) converts the transformed AC power signal into a cable power signal to be supplied via the connector to the cable in order to power a cable-powered device connected to the cable. An isolated-side control module performs a detection function in which the control module determines whether or not a cable-powered device is connected to the cable.

A direct connect oxygen sensor assembly is provided for measuring the proportion of oxygen in a fluid stream, and transmit signals indicative thereof to a controller. The assembly includes an oxygen sensor with a housing having an oxygen-sensing element protruding from one end thereof, and a first electrical terminal positioned at an opposing end of the sensor housing. An electrical conductor electrically couples the oxygen-sensing element to the first electrical terminal. The oxygen sensor assembly also includes a connector assembly with a housing having one or more lead wires, which are directly connected to the controller, projecting therefrom. A second electrical terminal is mounted to the connector housing, and electrically connected to the lead wires. The second electrical terminal is designed to mate with and electrically connect to the first electrical terminal. The connector housing is fabricated from a material with a working temperature of at least 200 degrees Celsius.

A semiconductor die package. The semiconductor die package comprises a semiconductor die and a molded clip structure comprising a clip structure and a first molding material covering at least a portion of the clip structure. The first molding material exposes an outer surface of the clip structure. The clip structure is electrically coupled to the semiconductor die. The semiconductor die package further comprises a leadframe structure comprising a die attach pad and a plurality of leads extending from the die attach pad. The semiconductor die is on the die attach pad of the leadframe structure. A second molding material covers at least a portion of the semiconductor die and the leadframe structure. The semiconductor die package also includes a heat slug and a thermally conductive material coupling the heat slug to the exposed surface of the clip structure.

The invention provides a fingerprint sensing device and electronic equipment. The fingerprint sensing device comprises a panel assembly and a fingerprint identification module arranged below the panel assembly, wherein the fingerprint identification module comprises a flexible element and a fingerprint identification circuit arranged above the flexible element; a switch module is embedded into the flexible element and comprises a supporting piece which is in contact with the upper top of the flexible element and a non-conductive elastic element positioned below the supporting piece; conductive bosses are formed in the supporting piece and the non-conductive elastic element and are in contact with a welding disk circuit at the lower bottom of the flexible element when the fingerprint sensing device is pressed; by starting of the switch module, the flexible element is conducted, and electric coupling is formed between the flexible element and the fingerprint identification circuit. According to the fingerprint sensing device disclosed by the embodiment of the invention, the problem of higher abrasion to the fingerprint sensing device due to deformation caused by pressing in the prior art when the fingerprint sensing device generates an electric signal due to pressing of a finger of a user is solved.