85results about How to "Withstanding stress" patented technology

Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

The gap sub assembly comprises a pair of electrically conductive subs. Each sub has a threaded pin and box. A pin and box are threaded together to form a connection. An electrically insulating, woven fabric overlies and conforms with the threads of the connection pin. An electrically insulating, annular washer separates the seal faces of the connection. The assembly functions to provide an electrical discontinuity when incorporated into a conductive drill string.

The present invention discloses a whipstock assembly (100) for use in forming a lateral borehole from a parent wellbore. The whipstock assembly comprises a body (122) and a deflection member 120) above the body. The deflection member includes a concave portion (111) for deflecting a milling bit during a milling operation. Disposed on a perforation plate (110) portion of the concave portion is a raised surface feature (116). The raised surface supports a milling bit above the perforation plate portion during a milling operation. This, in turn, substantially prevents frictional contact between the milling bits and the perforation plate portion during a milling operation. The present invention also provides a novel method for manufacturing a whipstock in which a cavity portion is formed behind the perforation plate by milling out the backside of the deflection member and then joining a second back cover member to the whipstock body to complete the assembly.

A molded structural bicycle component design, such as wheels and frames, which may incorporate complementary halves and at least one shear bond to allow efficient manufacturing and assembly. The molded design which may be applied in a host of different applications, including a bicycle frame and wheel, where demanding loads exist in normal use. Details of the joint and its design are provided. Integral bearings, foam tire adaptations, symmetrically opposite designs, and compression bonding techniques are described. Various cross sections may be made at different stress areas. A method of inserting a reinforcing tube in various high stress areas is also described. A host of bonding techniques including the use of electromagnetically active material are accommodated by the designs. The design may include the use of spacers in the vicinity where methods of retention of accessories or components require compressing from both sides such as the wheels, head tube, bottom bracket, and suspension attachment. The invention may include semicircular boundaries of a wheel assembly so as to define a valve stem hole after assembly.

A biocompatible surgical silk mesh prosthetic device employs a knit pattern that substantially prevents unraveling and preserves the stability of the mesh device, especially when the mesh device is cut. An example prosthetic device employs a knitted mesh including at least two yarns laid in a knit direction and engaging each other to define a plurality of nodes. The at least two yarns include a first yarn and a second yarn extending between and forming loops about two nodes. The second yarn has a higher tension at the two nodes than the first yarn. the second yarn substantially prevents the first yarn from moving at the two nodes and substantially prevents the knitted mesh from unraveling at the nodes.

An electronic controller (16) controls the operation of an electrochemical oxygen generating system (14) producing a desired gas. The product gas is fed to a storage unit (12) or a regulator (28) and pulsing valve (28) controlling the gas flow to a user. A two-stage system (180) combines a low pressure 100 and a high pressure (150) gas generating subsystems. The low pressure subsystem (100) uses IMAT's (106) to pump oxygen from ambient air to generate a low-pressure. The high pressure subsystem (150) uses IMAT's (160) to pump oxygen to high-pressure oxygen storage devices (194).

An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.

Electrode placement and connection systems are described which allow for the electrical connection and maintenance of one or more electrodes positioned on a substrate which is subjected to a variety of mechanical stresses. Electrodes may also be formed on flexible circuit assemblies integrated within or along the hood. The circuit assemblies may also provide structural support to the hood during delivery and / or deployment. Such a system may include an imaging hood having an aperture through which transparent fluid is flowed and one or more electrodes positioned along or about the hood. As the hood is configured between a low-profile and opened configuration, these electrodes may remain electrically coupled despite the mechanical stresses subjected to the electrodes and the connections thereto.

In a method of connecting chassis parts to produce a chassis assembly, at least one end of a first chassis part is connected with a second chassis part in an overlap zone by a form fit and an interference fit through an internal high pressure joining process. The second chassis part serves hereby a seal of the one end of the first chassis element.

An electronic component capable of withstanding stress from a printed circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed circuit board.

An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.

Semi-conductor wafers with thin and thicker regions at controlled locations may be for Photovoltaics. The interior may be less than 180 microns or thinner, to 50 microns, with a thicker portion, at 180-250 microns. Thin wafers have higher efficiency. A thicker perimeter provides handling strength. Thicker stripes, landings and islands are for metallization coupling. Wafers may be made directly from a melt upon a template with regions of different heat extraction propensity arranged to correspond to locations of relative thicknesses. Interstitial oxygen is less than 6×1017 atoms / cc, preferably less than 2×1017, total oxygen less than 8.75×1017 atoms / cc, preferably less than 5.25×1017. Thicker regions form adjacent template regions having relatively higher heat extraction propensity; thinner regions adjacent regions with lesser extraction propensity. Thicker template regions have higher extraction propensity. Functional materials upon the template also have differing extraction propensities.