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98results about How to "Erosion minimization" patented technology

Method and apparatus for treating a subterranean formation

A service/completion liner having a plurality of downhole selectable indicating tools and being used in sand control (gravel pack) placement systems in conjunction with a straddle packer service tools or with conventional crossover type service tools. Each indicating collar has a downhole selectable indicating collar providing a robust, landing profile for precisely locating and maintaining service tool position during well treatment operations. The landing collars accommodate hydraulic and/or thermal effects commonly referred to as tubing move effects which are the principle cause of tool position error and excessive seal wear. The landing collar is downhole convertible between a pass through (Go) and non pass through (No-go) condition by simple upward and downward cycling via the tool running and treatment fluid tubing and a shifting tool, which may also be referred to as a set down collet. The shifting/set down collet is also used to open and close a downhole sliding sleeve valve and may be an integral part of an injection tool or a tool for gravel or fracture packing. A sliding sleeve valve design and a straddle packer configuration that protects the primary PBRs in the gravel pack system and also protects the sliding sleeve while sand is placed in the screen casing annulus.
Owner:SCHLUMBERGER TECH CORP

High temperature composite pipe wrapping system

InactiveUS6276401B1Improve stress resistanceMinimize dimensional changeLayered productsLaminationUnderlaySolvent
A method and apparatus for providing metal or non-metal vessels, including straight and curved pipes and various pipe connections, such as T's, elbows, swages, etc., and pressure containing vessels such as tanks, with an external composite lining of a webbing of biaxial or triaxial weave preferably composed of fiberglass which is pre-impregnated with a high temperature heat curable polymer composition capable of being heat cured at a temperature range of from about 275° F. to about 375° F. The vessel is prepared for bonding by abrasive cleaning and by solvent cleaning. Metal imperfections are then filled with an epoxy. A small amount a quick setting epoxy is employed to attach one end of the web to the external surface of the vessel in oriented position for wrapping of the web in intimate surface-to-surface contact with the vessel. During wrapping only enough tension is applied to the pre-impregnated webbing to eliminate any wrinkles. The number of layers of the impregnated webbing will be determined by the safe pressure containing capability of the pipe or vessel and its composite lining. An external heating element is then placed about the wrapping of pre-impregnated webbing material so as to be in substantially intimate relation therewith and is energized to apply sufficient heat for a sufficient period of time to completely cure the epoxy surface filler and to cure the polymer resin components of the pre-impregnated woven wrappings of webbing.
Owner:WILSON FRED D

Methods of Minimizing Etch Undercut and Providing Clean Metal Liftoff

A method of minimizing etch undercut and providing clean metal liftoff in subsequent metal deposition is provided. In one embodiment a bilayer resist mask is employed and used for etching of underlying substrate material and subsequent metal liftoff. In one embodiment, the top layer resist such as positive photoresist which is sensitive to selected range of energy, such as near UV or violet light, is first patterned by standard photolithography techniques and resist development in a first developer to expose portion of a bottom resist layer which is sensitive to a different selected range of energy, such as deep UV light. The exposed portion of the bottom layer resist is then removed by anisotropic etching such as oxygen reactive ion etching using the top layer resist as the etch mask to expose portion of the underlying substrate. This minimizes the undercut in the bottom resist around the top photoresist opening. The resultant patterned bilayer resist stack is then used as the etch mask for the subsequent etching of the exposed portion of the underlying substrate material. Because there is no undercut in the bottom resist layer, the etch undercut in the substrate material is also minimized relative to the edges of the top photoresist opening.
Owner:TRIQUINT SEMICONDUCTOR

Method and apparatus for improving windshield wiper performance using a vibrating windshield wiper blade

A method is provided for improving the wiping capabilities of a windshield wiper by causing the windshield wiper blade to vibrate or oscillate in a direction parallel to the longitudinal centerline of the blade during a windshield wiper sweep. The vibrating mode causes less wear on the blade due to windshield abrasion since the blade edge does not contact the same eroded point on the windshield all the time. Secondly, any debris that is caught underneath the blade is quickly ejected due to the vibrating action. In one embodiment, an electromechanical vibrating unit is secured at one or more positions to the blade, with the actuator being driven by a 12-volt source and provided with a quickie disconnect at the center of the blade support structure. The vibrating actuator may be an electromechanically drive off-centered weight, a vibrating linear actuator, an ultrasonic vibrator, or a vibrator in the form of a piezoelectric crystal, with the primary mode of oscillation translating the blade along its centerline. The result is that debris underneath the blade is thrown out, including leaf stems, leaves and particulate matter, with the periodic translation of the blade providing more uniform water removal during the wiping operation to provide clearer visibility through the windshield regardless of the amount of water on the windshield, whether it be from a sporadic sprinkle or a torrential downpour. Wiper life is extended since the blade edge's position on the windshield is constantly varied during wiper sweeps.
Owner:ACOM INT

Nitridation of STI fill oxide to prevent the loss of STI fill oxide during manufacturing process

A method and structure for an improved shallow trench isolation (STI) structure for a semiconductor device. The STI structure incorporates an oxynitride top layer of the STI fill. Optionally, the STI structure incorporates an oxynitride margin of the STI fill adjacent the silicon trench walls. A region of the oxynitride margin near the upper edges of the silicon trench walls includes oxynitride corners that are relatively thicker and contain a higher concentration of nitrogen as compared to the other regions of the oxynitride margin. The oxynitride features limit the STI fill height loss and also reduce the formation of divots in the STI fill below the level of the silicon substrate cause by hydrofluoric acid etching and other fabrication processes. Limiting STI fill height loss and the formation of divots improves the functions of the STI structure. The method of forming the STI structure is particularly compatible with standard semiconductor device fabrication processes, including chemical mechanical polishing (CMP), because the method incorporates the use of a pure silicon dioxide STI fill and plasma and thermal nitridation processes to form the oxynitride top layer and oxynitride margin, including the oxynitride corners, of the STI fill.
Owner:IBM CORP
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