Integrated wafer level package

A package and wafer technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems of increasing process complexity, manufacturing cost, and infeasibility

Inactive Publication Date: 2011-06-29
张浩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned in the US patent (U.SPat.6,518,860), piezoelectric films of different thicknesses must be deposited separately, but this will greatly increase the complexity of the process and the manufacturing cost
Similar to the problem mentioned earlier, it is not feasible to adjust the frequency of filters placed side by side but in different frequency bands one by one

Method used

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Examples

Experimental program
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example 1

[0108] Such as figure 1 As shown, the integrated wafer level package 100 is an example obtained according to the present invention. As a typical specific example, the integrated wafer-level package 100 includes a first wafer 110, a second wafer 120, a first bulk acoustic wave filter 112, a second bulk acoustic wave filter 124, and a sealing ring 130. The first wafer 110 has a first surface 102 and a corresponding second surface 111. The second wafer 120 has a first surface 122 and a corresponding second surface 104. The first wafer 110 and the second wafer 120 are separated by a certain distance. The second surface 111 of the first wafer 110 and the first surface 122 of the second wafer 120 face each other, thereby forming a gap between the two surfaces. First distance. The first integrated acoustic wave filter 112 is fabricated on the second surface 111 of the first wafer 110, and the second bulk acoustic wave filter 124 is fabricated on the first surface 122 of the second w...

example 2

[0122] In another example, as described in Example 1, a large number of integrated wafer-level packages are stacked vertically, and each wafer-level package is connected to the adjacent wafer-level package through a second sealing ring. The packages are glued together. This can reduce more plane area.

[0123] Figure 8 It is a vertically integrated dual-band duplexer in a wafer-level package. The integrated wafer-level package 800 includes a first wafer 802, a second wafer 808, a first bulk acoustic wave filter 828, and a second bulk acoustic wave filter 830. The first wafer 802 has a first surface 804 and a corresponding second surface 806. The second wafer 808 has a first surface 810 and a corresponding second surface 812. The first wafer 802 and the second wafer 808 are separated by a certain distance, and the second surface 806 of the first wafer 802 faces the first surface 810 of the second wafer 808, thus forming between the two surfaces The first gap. The first integ...

example 3

[0129] Picture 9 It is a specific example of an integrated wafer-level package of the present invention. The integrated wafer-level package 900 includes a first wafer 910, a second wafer 920, a first micro device 912, a second micro device 924 and a sealing ring 930. The first wafer 910 has a first surface 902 and a corresponding second surface 911. The second wafer 920 has a first surface 922 and a corresponding second surface 904. The first wafer 910 and the second wafer 920 are separated by a distance, and the second surface 911 of the first wafer 910 and the first surface 922 of the second wafer 920 face each other, so that the two surfaces form First distance. The first micro device 912 is fabricated on the second surface 911 of the first wafer 910, and the second micro device 924 is fabricated on the first surface 922 of the second wafer 920. The first micro-device 912 and the second micro-device 924 directly face each other, thereby forming a second distance between...

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Abstract

An integrated wafer level package comprises a first wafer provided with a first surface and a corresponding second surface, and a second wafer provided with a first surface and a corresponding second surface; a distance is kept between the two wafers; the second surface of the first wafer and the first surface of the second wafer are opposite to each other to form a first space; a first bulk acoustic wave filter is arranged on the second surface of the first wafer and a second bulk acoustic wave filter is arranged on the first surface of the second wafer, and the two bulk acoustic wave filters are directly opposite to each other to form a second space; a seal ring arranged between the two wafers circles the two bulk acoustic wave filters to form sealing, and the seal ring and the two bulk acoustic wave filters form a cavity; and at least an external electric connector is arranged and is in electric coupling with at least one of the two bulk acoustic wave filters. The integrated wafer level package has the advantages of lower manufacturing cost and high product quality; and by adopting the integrated wafer level package, two or more filter components can be packed into a wafer level package to prevent the filters from the environment pollution of ambient atmosphere.

Description

Technical field [0001] The invention relates to a wafer-level package. In particular, it relates to an integrated wafer-level package. Background technique [0002] Consumer electronic products, such as mobile phones, personal electronic auxiliary equipment, etc., are gradually becoming smaller in size and their prices continue to decrease, but their functions are gradually increasing. As a result, these electronic products impose strict requirements on their internal electronic components (such as integrated circuits (ICs) and microelectromechanical systems (MEMS) devices) in terms of size and cost. Radio frequency (RF) filters, including bulk acoustic wave filters, are ubiquitous components in all radio frequency front-end devices, and radio frequency filters play an important role in the design of celluar handsets. Continuous efforts are needed to provide cheap, small, and frequency-tuned filters or duplexers. A bulk acoustic wave resonator is composed of at least one layer...

Claims

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Application Information

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IPC IPC(8): H03H3/02
Inventor 张浩庞慰
Owner 张浩
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