Integrated wafer level package

Abstract

An integrated wafer level package comprises a first wafer provided with a first surface and a corresponding second surface, and a second wafer provided with a first surface and a corresponding second surface; a distance is kept between the two wafers; the second surface of the first wafer and the first surface of the second wafer are opposite to each other to form a first space; a first bulk acoustic wave filter is arranged on the second surface of the first wafer and a second bulk acoustic wave filter is arranged on the first surface of the second wafer, and the two bulk acoustic wave filters are directly opposite to each other to form a second space; a seal ring arranged between the two wafers circles the two bulk acoustic wave filters to form sealing, and the seal ring and the two bulk acoustic wave filters form a cavity; and at least an external electric connector is arranged and is in electric coupling with at least one of the two bulk acoustic wave filters. The integrated wafer level package has the advantages of lower manufacturing cost and high product quality; and by adopting the integrated wafer level package, two or more filter components can be packed into a wafer level package to prevent the filters from the environment pollution of ambient atmosphere.

Description

Technical field

[0001] The invention relates to a wafer-level package. In particular, it relates to an integrated wafer-level package. Background technique

[0002] Consumer electronic products, such as mobile phones, personal electronic auxiliary equipment, etc., are gradually becoming smaller in size and their prices continue to decrease, but their functions are gradually increasing. As a result, these electronic products impose strict requirements on their internal electronic components (such as integrated circuits (ICs) and microelectromechanical systems (MEMS) devices) in terms of size and cost. Radio frequency (RF) filters, including bulk acoustic wave filters, are ubiquitous components in all radio frequency front-end devices, and radio frequency filters play an important role in the design of celluar handsets. Continuous efforts are needed to provide cheap, small, and frequency-tuned filters or duplexers. A bulk acoustic wave resonator is composed of at least one layer...

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