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Electronic component connecting method and joined body

A technology of electronic components and connection methods, applied in the direction of electrical component connection, conductive connection, conductive adhesive connection, etc., can solve problems such as poor conduction, damage to insulating coating, and low connection strength of electronic components, and achieve reliable conduction high performance and low on-resistance

Active Publication Date: 2010-03-24
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Particles coated with an insulating film have the following problem: When aggregation occurs, only external stress that destroys the insulating film is applied, causing a short circuit
[0016] When voids occur, the connection strength of the electronic parts decreases, and when left for a long time, the electronic parts float (detach) from the anisotropic conductive adhesive, resulting in poor conduction

Method used

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  • Electronic component connecting method and joined body
  • Electronic component connecting method and joined body
  • Electronic component connecting method and joined body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0155] In Example 2 and Example 4, the types of insulating particles are different, but the results of "on-resistance", "short-circuit occurrence rate", and "catch number judgment" do not change regardless of each. Therefore, as long as the particle size of the deformed conductive particles is equal to or greater than the particle size of the insulating particles, a bonded body with high conduction reliability can be obtained regardless of the type of insulating particles.

Embodiment 1

[0156] Compared with Comparative Example 1, Example 1 has a lower incidence of short circuits, but the incidence of short circuits is higher than that of other examples. In Example 1, the content (total volume) of insulating particles is very small, only 0.05 times the content (total volume) of conductive particles. Therefore, in order to more reliably prevent short circuits, it is necessary to increase the content of insulating particles More than 0.05 times (volume ratio) of conductive particles.

[0157] In addition, Example 3 obtained excellent results both in terms of the short-circuit occurrence rate and the number of catches, but the on-resistance was higher than the other examples.

Embodiment 3

[0158] In Example 3, the content (total volume) of the insulating particles was too large and was 2.5 times the content (total volume) of the conductive particles. Therefore, the removal of the adhesive 11 from between the aluminum terminal and the copper terminal was poor. The on-resistance increases, resulting in poor continuity. Therefore, in order to prevent poor conduction, it is necessary to control the insulating particles to less than 2.5 times (volume ratio) of the conductive particles.

[0159] In the foregoing, although only the case where the electronic component 30 is temporarily fixed after temporarily pasting the anisotropic conductive adhesive 10 on the substrate 20 has been described, the present invention is not limited to this, and anisotropic conductive The adhesive 10 is temporarily attached to the electronic component 30, and may also be temporarily attached to the electronic component 30 and the substrate 20 at the same time. In addition, the same crimping...

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Abstract

A method for electrically connecting an electronic component with high reliability of electrical connection after the electrical connection, enabling correct counting of captured conductive particlesand a joined body are provided. The electronic component connecting method includes a mixing step of mixing a dispersing solvent, an adhesive resin dissolvable into the dispersing solvent, conductiveparticles, and insulating particles whose size is smaller than that of the conductive particles thereby to prepare an anisotropic conductive adhesive and a heating / pressing step of opposing a substrate terminal of a substrate and a component terminal of an electronic component with the anisotropic conductive adhesive interposed therebetween, applying heat and pressing-force to the substrate and the electronic component, holding the conductive particles between the substrate terminal and the component terminal, and thereby deforming the conductive particles. The pressing-force at the heating / pressing step is weaker than both the breakage pressing-force by which the conductive particles are broken and the deformation pressing-force by which the particle size of the conductive particles becomes equal to that of the insulating particles.

Description

Technical field [0001] The present invention relates to a method of connecting electronic components, and more particularly to a method of connecting electronic components using an anisotropic conductive adhesive and a joint body. Background technique [0002] Conventionally, in the connection of electronic components, an anisotropic conductive adhesive in which conductive particles are dispersed in the adhesive has been used. [0003] However, in recent years, as the pitch of the terminals of electronic products has become narrower, when connecting electronic components, conductive particles aggregate between adjacent terminals, causing short circuits between the terminals. [0004] In particular, when a device with a semiconductor chip connected to a carrier tape (TAB: Tape AutomatedBonding) or a device with a semiconductor chip connected to a film carrier (COF: Chip OnFilm) is connected to the terminal on the edge of the LCD panel (liquid crystal panel), When the crimping tool is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60C09J9/02C09J11/04C09J201/00H01B5/16H01R11/01H01R43/00H05K3/32
CPCH01L2924/09701H01L24/83H01L2224/2929H05K2201/0233H01L2224/83101H01L2224/29455H01L2224/29444H01R4/04H01L2224/29499H05K2201/0209H05K3/323H01R13/2414H01L2924/3011H01L2924/01079H01L2224/83851H01L2224/29388H01L2224/2939H01L2924/07811H01L2224/294H05K3/361C09J9/02C08K7/00H01R12/52H01L2924/01019C09J11/00H05K2201/0212H01L2224/83191H01L2924/12044Y10T156/10Y10T428/31504H01L2924/00014H01L2924/0665H01L2924/00
Inventor 石松朋之佐藤大祐大关裕树
Owner DEXERIALS CORP
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