Middle frame assembly, preparation method of middle frame assembly and electronic equipment

A technology for electronic equipment and frame components, applied in circuits, electrical components, antenna parts and other directions, can solve the problems of affecting the transmission and reception of antenna signals, uneven laser engraving area, and clutter, etc., to improve the reliability of conduction, The effect of ensuring reliability and stability

Active Publication Date: 2020-05-08
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the technical problem of this structure is: after removing the oxide film in the laser engraving area, the oxide film in the laser engraving area will not be removed cleanly, and even the radium engraving area will appear uneven, which will lead to the metal elastic part and the antenna. The contact of the feeding part is unreliable, so as to affect the sending and receiving of antenna signals, such as figure 2 Shown is the harmonic margin on the surface where the metal elastic part and the antenna are in contact with multiple mobile phones with this structure when the current is 200mA, and the curve formed by multiple harmonic margins is curve P12 and straight line P11 is the limit value of the harmonic margin on the surface where the metal elastic member contacts the antenna. It can be seen from the figure that multiple harmonic margins on the surface where the metal elastic member contacts the antenna are dispersed, and there are many The phenomenon of limit value, that is, due to the unreliable contact between the metal elastic part and the feeder part of the antenna, there is a phenomenon of clutter, which will affect the stability of the antenna sending and receiving signals

Method used

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  • Middle frame assembly, preparation method of middle frame assembly and electronic equipment
  • Middle frame assembly, preparation method of middle frame assembly and electronic equipment
  • Middle frame assembly, preparation method of middle frame assembly and electronic equipment

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preparation example Construction

[0057] On the other hand, the embodiment of the present application also provides a method for preparing a middle frame assembly, refer to Picture 10 , The preparation method of the middle frame assembly includes the following steps:

[0058] S01: Lay the antenna covered with oxide film on the middle frame body.

[0059] S02: Remove the oxide film on the feed part of the antenna, so that the oxide film forms a hollow area at the position of the feed part of the antenna.

[0060] The oxide film on the feeder part on the antenna is removed. The advantage achieved by this process is that the oxide film has poor conductivity, and exposing the antenna can improve the conduction performance between the antenna and the metal elastic member.

[0061] S03: Apply a conductive coating so that the conductive coating at least covers the hollow area.

[0062] In the method for preparing the middle frame assembly provided by the embodiment of the present application, in order to expose the feeding p...

Embodiment 1

[0066] S011: Lay the antenna covered with oxide film on the middle frame body.

[0067] S021: The oxide film on the power feeding part of the laser engraving antenna, so that the oxide film forms a hollow area at the position of the power feeding part of the antenna.

[0068] S031: Use alcohol to clean the impurities after laser engraving and dry them.

[0069] S041: Print the conductive coating so that the conductive coating at least covers the hollow area.

[0070] S051: Dry the printed conductive coating.

Embodiment 2

[0072] S012: Lay the antenna covered with oxide film on the middle frame body.

[0073] S022: The oxide film on the power feeding part of the laser carving antenna, so that the oxide film is located at the position of the power feeding part of the antenna to form a hollow area.

[0074] S032: Use alcohol to clean the impurities after laser carving and dry it.

[0075] S042: Three-dimensional printing of the conductive coating so that the conductive coating at least covers the hollow area.

[0076] S052: Dry the conductive coating for 3D printing.

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PUM

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Abstract

The embodiment of the invention provides a middle frame assembly, a preparation method of the middle frame assembly and electronic equipment, and relates to the technical field of communication equipment. The middle frame assembly is used for being arranged on the electronic equipment. The middle frame assembly comprises: a middle frame body; an antenna laid on the middle frame body; an oxide film, wherein the exterior of the antenna is coated with the oxide film, and the position, located at the feed part of the metal sheet, of the oxide film is a hollow area; and a conductive coating at least covering the hollow area. The middle frame assembly, the preparation method of the middle frame assembly and the electronic equipment provided by the embodiment of the invention are used for improving the contact reliability of the metal elastic piece and the metal sheet so as to improve the receiving and transmitting stability of antenna signals.

Description

Technical field [0001] This application relates to the technical field of communication equipment, and in particular to a middle frame assembly, a method for preparing the middle frame assembly, and electronic equipment. Background technique [0002] The antenna in the mobile phone is covered with an oxide film, that is, the antenna is protected by the oxide film to prevent the antenna from being oxidized and affecting the antenna signal transmission. In the prior art, refer to figure 1 , The antenna in the mobile phone (not shown in the figure, the antenna is laid on the middle frame 03 of the mobile phone) is electrically connected to the transceiver module (not shown in the figure) on the circuit board 01 through the metal elastic member 02, and one end of the metal elastic member 02 is connected to The signal line on the circuit board 01 is connected. The signal line is connected to the transceiver module for transmitting and receiving antenna signals. The other end of the me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/24H01Q1/50
CPCH01Q1/244H01Q1/50
Inventor 杨永周霍国亮曹先锁
Owner HUAWEI TECH CO LTD
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