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Adhesive film, connecting method and connected body

一种粘合薄膜、连接方法的技术，应用在连接、导电连接、电部件连接等方向，能够解决导通可靠性变低、导电性粒子数变少、短路等问题，达到高导通可靠性的效果

Active Publication Date: 2010-09-01
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the adhesive is extruded, a part of the conductive particles will also be extruded together with the adhesive, and the extruded conductive particles will flow into between adjacent terminals on the substrate, or into the terminals of the electronic component. Between adjacent terminals, a short circuit occurs between adjacent terminals due to conductive particles (Short)
[0005] At the same time, as the conductive particles are squeezed out from between the substrate terminal and the electronic component terminal, the number of conductive particles held between the substrate terminal and the electronic component terminal decreases, and the conduction reliability also decreases accordingly.

Method used

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  • Adhesive film, connecting method and connected body
  • Adhesive film, connecting method and connected body
  • Adhesive film, connecting method and connected body

Examples

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Embodiment Construction

[0039] (adhesive film)

[0040] The adhesive film of the present invention has at least a first adhesive layer and a second adhesive layer adhered to each other, and further includes other layers appropriately selected as required.

[0041]

[0042] The above-mentioned first pressure-sensitive adhesive layer includes at least conductive particles, sub-resin components, and a first main resin component, and further includes other components appropriately selected as necessary.

[0043] -Conductive particles-

[0044] The said electroconductive particle will not be specifically limited if it is dispersed in the said 1st pressure-sensitive adhesive layer, It can select suitably according to the objective.

[0045] Specifically, there are metal particles mainly composed of metals such as nickel, copper, and cobalt, or particles with gold plating on the surface of the above metal particles, or particles with nickel, copper, gold, and solder plating on the surface of organic fine...

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PUM

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Abstract

Provided are an adhesive film which can connect an electronic component to a substrate without causing short-circuiting, a connecting method and a connected body. The adhesive film is provided with a first adhesive layer wherein conductive particles are dispersed, and a second adhesive layer adhered on the first adhesive layer. The first and the second adhesive layers are adhesive films containing a sub resin composition. The first adhesive layer contains a first main resin composition having a glass transition temperature higher than that of the sub resin composition. The second adhesive layer contains a second main resin composition, which has a glass transition temperature higher than that of the sub resin composition but lower than that of the first main resin composition. The reaction peak temperature of the first and the second adhesive layers is lower than the glass transition temperature of the first main resin composition but higher than that of the second main resin composition.

Description

technical field [0001] The present invention relates to an adhesive film for connecting electronic components, a connecting method, and a bonded body. Background technique [0002] Traditionally, anisotropic conductive adhesives have been used to attach electronic components or circuit boards to substrates. The anisotropic conductive adhesive contains a binder and conductive particles dispersed in the binder. [0003] An anisotropic conductive adhesive is arranged between the surface of the substrate on which the terminals are arranged and the surface on which the terminals of the electronic component are arranged. The conductive particles are squeezed out between the terminals of the substrate and the terminals of the electronic components, thereby electrically connecting the substrate and the electronic components. [0004] However, when the adhesive is extruded, a part of the conductive particles will also be extruded together with the adhesive, and the extruded conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J9/02C09J11/02C09J201/00H01B5/16H01L21/60C09J7/10
CPCH01L2924/01027H05K2203/1189H01L24/83H01L2924/0781H01L24/29H01L2224/32225H01L2224/293H01L2924/01015H01L2224/16H05K3/323H01L2224/2989H01L2224/16225C09J2201/36H01L2924/01078H01L2924/01006C09J11/04H01L24/16H01L2924/01073H01L2924/01079H01L2924/14H01L2224/83192H01L2924/01005H01L2924/01057H01L2924/01082H01L2224/73204H01L2224/2919H01L24/31H01L2924/01013H01L2924/014H01L2224/2939H01L2224/29101H01L2924/07811C09J7/00H01L2224/294H01L2924/01029C09J9/02H01L2224/838H01L2924/01019H01L2924/01033H01L2924/0665H01L24/75H01L2924/01075H01L2224/83851H01L2224/29082H01L2224/2929H01L2224/81193H01L2924/15788H01L2924/00014C09J7/10H01L2924/00011Y10T428/2826Y10T428/25Y10T428/24959Y10T428/2852C09J2301/208H01L2924/00H01L2224/0401C09J201/00H01B5/16H01R11/00
Inventor 石松朋之大关裕树
Owner DEXERIALS CORP
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