736results about "Electrically conductive adhesive connections" patented technology

A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.

The invention comprises filling a conductive adhesive on a hole end of a wire connection part in tubular shape of the terminal which has an electric contact part at one side and the wire connection part at the other side, inserting an electric wire from a hole opening of the wire connection part toward the hole end, and reducing evenly a size of a tubular wall of the wire connection part, thereby causing the conductive adhesive to infiltrate into a space of the electric contact part or between wires. The invention also comprises tightening the tubular wall of the wire connection part by a rotary swaging process. Further, the conductive adhesive is a nickel paste which is a mixture of nickel powders in a liquid epoxy resin based binder. In addition, at least one of a core wire portion of the electric wire or the terminal is aluminum or aluminum alloy.

The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from at least one of the peripheral sides. In one embodiment, the flexible circuit connector comprises a plurality of discrete conductors that are adapted to be mounted between the upper side of a first package and the lower side of a second package. The flexible circuit connector also includes distal ends that extend from the conductors. The distal ends are adapted to be electrically connected to external leads from the first and second packages to interconnect with one another predetermined, separate groups of the external leads. In this manner, individual devices within a stack module can be individually accessed from traces on a circuit card. This flexible capability is beneficial in modules such as memory modules with multiple, stacked memory devices.

An electrical connection structure connects a piezoelectric element to a flexure with a conductive adhesive. An electrode surface is formed on the piezoelectric element, and a terminal surface is formed on the wiring member and is smoother than the electrode surface. A the gold plate layer is formed on the terminal surface and is connected to the electrode surface with the conductive adhesive. At least one recess is formed by laser processing on the conductive terminal surface layer. The electrical connection structure substantially equalizes the surface roughness of the terminal surface with the gold plate layer to that of the electrode surface, improves a bonding strength on the terminal surface nearly to that on the electrode surface, enhances the reliability of electrical connection between the electrode surface and the terminal surface, maintains electrical characteristics of the terminal surface, and prevents contamination around the terminal surface.

The present invention provides a flexible printed circuit that is less likely to suffer from erosion (corrosion) of electrode terminals even in severe environments and a display device using the flexible printed circuit. According to the present invention, a flexible printed circuit includes a flexible FPC film, FPC interconnections formed of a given pattern on the FPC film, a solder resist covering the FPC interconnections, and FPC terminals provided at ends of the FPC interconnections to make external connection. According to the invention, the FPC terminals include at least one terminal that has an end located inside of an outline of the FPC film.

The present invention is intended to provide a glass article with a metal member joined thereto in which an electroconductive coating film is formed on at least a part of the surface of the glass article by baking a silver paste that includes Ag particles and a glass frit, a joining plane of the metal member is fixed onto the electroconductive coating film with a lead-free solder alloy containing Sn as a main component, and the lead-free solder alloy contains at least 1.5 mass % of Ag, which prevents the appearance of the electroconductive coating film and the bonding strength from degrading. Furthermore, in the present invention, when using a metal member having at least two joining planes, the total area of the joining planes is set within a range of 37 mm2 to 50 mm2, which allows high bonding strength between the glass article and metal member to be maintained while using the lead-free solder alloy. Moreover, in the present invention, the volume of the lead-free solder alloy to be provided on each joining plane is set to be 1.0 to 2.0 times the product of the area of the joining plane concerned and the thickness of the lead-free solder alloy, which prevents cracks from occurring in the glass article.

A window pane has a substrate formed from glass and includes an electrical device. The electrical device includes an electrical conductor. An electrical connector is operatively connected to and in electrical communication with the conductor for transferring electrical energy to the conductor. The substrate has a first coefficient of expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 5×10−6 / ° C. for minimizing mechanical stress between the connector and the substrate due to thermal expansion of the connector and the substrate resulting from changes in temperature.

A cable with a crimping terminal includes a cable including a conductor and an insulator including a plastic material, and the crimping terminal bonded to the conductor of the cable at a crimping portion by crimping connection. The conductor of the cable is bonded to the crimping terminal by a metallic bonding material at a crimping portion, and the metallic bonding material includes silver as a main component.

An anisotropic conductive adhesive that provides strong adhesion to metals and organic substrates to generate stable and reliable electric interconnects. The adhesive provides the benefits of short thermocompression bond time at low temperatures. The adhesive contains cationic curable resin, latent cationic catalyst that thermally cures the resin at high speeds and low temperatures, conductive filler, optionally a film forming thermoplastic solid resin and optionally nano size filler. The optional nano filler provides the benefit of reducing the coefficient of thermal energy mismatch, improving the adhesion strength and reducing the total heat of reaction for the system.

An anisotropically conductive connector, not causing permanent deformation by contact of target electrodes to be connected with pressure and deformation by abrasion even if the target electrodes are projected, and achieving stable conductivity over a long time period even when pressed repeatedly, a production process thereof, and an inspection circuit board equipped with the connector. The connector includes (1) anisotropically conductive film, with plural conductive path-forming parts each extending in a thickness-wise direction of the film arranged insulated by insulating parts and including at least 2 elastic layers, which are each formed by an insulating elastic polymeric substance, and (2) conductive particles exhibiting magnetism in portions of the respective elastic layers, at which conductive path-forming parts are formed. The connector satisfies H1≧30, and H1 / H2≧1.1, H1, H2 being durometer hardnesses of the elastic polymeric substance of one of elastic layers forming surfaces of the film, and of the elastic polymeric substance of the other, respectively.

An electrical connector includes a first terminal group, an insulation body, a conductive glue, and an insulation casing. The first terminal group includes grounding terminals and signal terminals. Each of the terminals in the first terminal group has a main portion. The insulation body is fixed to the main portion of each terminal of the first terminal group. The insulation body has openings exposing corresponding grounding terminals. The conductive glue fills the openings of the insulation body, and the conductive glue electrically connects the grounding terminals. The insulation casing includes a first side wall which includes first terminal slots. The first terminal group is disposed in the first terminal slots of the first side wall, and the conductive glue is sandwiched between the first side wall and the insulation body.

A return pad cable connector, in accordance with the present disclosure, for use with a disposable return pad, includes a cord having a conductive wire disposed therethrough which conductive wire interconnects the return pad cable connector to an electrosurgical energy source. The return pad further includes a connector operatively coupled to the cord, the connector having a conductive surface which is selectively engageable with a corresponding conductive surface disposed on the return pad, the conductive surface of the connector including a conductive adhesive disposed thereon and a non-conductive adhesive disposed above the periphery of the conductive surface of the connector for engagement with a corresponding non-conductive adhesive disposed above the periphery of the conductive surface of the return pad. The connector can include a magnet for magnetically coupling the connector to the conductive surface disposed on the return pad.

An anisotropic electrically conductive film formed by a thermosetting acrylic resin composition is disclosed. The composition contains at least a thermosetting agent (A), a thermo-settable ingredient (B), an acrylic rubber containing hydroxyl groups (C), organic fine particles (D) and electrically conductive particles (E). The thermo-settable ingredient (B) may include a phosphorus-containing acrylic ester (b1). The weight averaged molecular weight of the acrylic rubber containing the hydroxyl groups (C) is not less than 1000000. The organic fine particles (D) include polybutadiene-based fine particles (d1).

The present invention relates to a dumbbell-shaped slot coupling excitation-based wideband low-profile microstrip antenna. The dumbbell-shaped slot coupling excitation-based wideband low-profile microstrip antenna comprises a rectangular radiation patch, a metallized isolation via hole array, an inner-layer metal ground board, a dumbbell-shaped coupling slot, a strip line feeder, a quasi-coaxial vertical interconnection structure, a microstrip feeder, an annular opening pad and an SMP connector for feeding. The antenna is constructed by using a laminated PCB technology; a three-dimensional transmission structure is constructed through a microstrip-quasi-coaxial metallized via hole-strip line structure; and the rectangular radiation patch is excited based on the special dumbbell-shaped coupling slot. The antenna has the advantages of compact structure, small horizontal dimension, low profile, low cost, easiness in processing, easiness in integration and the like, and can meet the use requirements of 12 GHz-to-18 GHz Ku bands and is very suitable for being applied to a Ku- band wideband phased array system.

A medical electrode demonstrates a superior adhesiveness to a patient's skin during medical data acquisition or treatment procedure yet attaining painless electrode removal from the skin when needed. The subject medical electrode is designed with adhesive neutralizer (or remover) solvent fully enveloped in one or several compartments embedded in an adhesive layer of the medical electrode unit. The compartments have a contact with the patient's skin when the electrode is attached thereto. When compressed by a medical personnel, the compartment releases the adhesive remover solvent directly to the skin-adhesive interface, thereby neutralizing (or removing) the adhesive material, thereby easing the electrode removal. The adhesive layer is made from PEO, sodium chloride, and water. The adhesive remover solvent contains isopropyl alcohol. A method of manufacturing the medical electrode is presented.

A moisture-resistant suspended particle device film comprising a cured suspended particle device emulsion having a plurality of uncrosslinked droplets of a liquid light valve suspension distributed throughout the cured emulsion; first and second glass or plastic sheets located outwardly from and sandwiching the cured emulsion, wherein located on an inner aspect of each sheet, adjacent the cured emulsion, is a thin, transparent, electrically conductive coating , the coating serving as an electrode to permit passage of an applied electric field through the cured emulsion; and a moisture-resistant barrier located around an entire outer peripheral edge portion of the film, wherein the barrier is comprised of a barrier material that eliminates or at least reduces passage of moisture from outside the film into the cured emulsion, thus preventing development of a light-frame pattern in the film that would otherwise be caused by the moisture. The disclosure also discloses forming a laminate comprising the above-described film, as well as methods of forming such films and laminates.

A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.

An anisotropic conductive adhesive sheet comprising at least a curing agent, a curable insulating resin and conductive particles, wherein in a region extending from a one-side surface of the anisotropic conductive adhesive sheet along the thickness direction to a position of not greater than 2.0 times the average diameter of the conductive particles, 90% or more of the sum of conductive particles are present, the 90% or more of the sum of conductive particles being present without contact with other conductive particles, and wherein the average diameter of conductive particles is in the range of 1 to 8 μm, the average particle distance between adjacent conductive particles being in the range of 1 to 5 times the average particle diameter and not greater than 20 μm, and wherein the thickness of the anisotropic conductive adhesive sheet is at least 1.5 times the average particle distance but not greater than 40 μm.