13 results about "Mechanical bond" patented technology

The invention belongs to the technical field of liquid metal corrosion numerical simulation, and particularly relates to a liquid metal corrosion simulation method based on a near-field dynamic reaction diffusion equation. By adopting a near-field dynamics method, the problems of heterogeneity, damage and the like can be naturally simulated; the corrosion process is regarded as a chemical reaction process, the relation between a reaction term and the current density and the overpotential can be directly obtained through formula derivation, the influence of the concentration gradient on the corrosion process is relieved, and the reversible reaction can be simulated; a phase change mechanism of autonomous evolution of the interface is combined, an autonomous moving solid-liquid interface is obtained, a random mechanism of mechanical key formation and fracture is introduced into a phase change model, and random characteristics in the random mechanism are described. According to the method, the influence of some parameters or conditions on the liquid metal corrosion process can be researched while the liquid metal corrosion process can be visually and physically described, and favorable help is provided for research in the field of liquid metal corrosion.

A multiple layer material (11) comprising an extruded profile (27) and at least one lamination material (28, 29) adhered to at least one surface (32, 33) of the extruded profile (27) to form the multiple layer material (11). The lamination material (28, 29) is formed with a structure with indentations (48), and the multiple layer material (11) comprises a melt bond and a mechanical bond (41) between the extruded profile (27) and the lamination material (28, 29), wherein said melt bond is formed by at least partially melting the material of the surface (32, 33) of the extruded profile (27) and at least partially melting only a part of the thickness of the lamination material (28, 29), wherein said mechanical bond (41) is formed by that the material at the at least partially melted surface (32, 33) of the extruded profile (27) is brought into the indentations of the lamination material (28, 29), and wherein the lamination material, at least before it is adhered to the extruded profile, is permeable to air. Disclosed is also a process for producing the multiple layer material.

A stretch laminate for an absorbent article includes a nonwoven substrate and an elastomeric film joined to the nonwoven substrate by a plurality of bonds. These bonds can be ultrasonic bonds or any combination of mechanical bonds including ultrasonic bonds. The plurality of bonds form a bond pattern including a first bond having a longest bond dimension (D) and a second bond adjacent to the first bond. When the bond separation angle between the first bond and the second bond is between 0° and 35° or less, the bond separation distance between the first bond and the second bond is at least 2.1D and less than 4.1D. Furthermore, when the bond separation angle between the first bond and the second bond is greater than 35° and less than 90°, the bond separation distance between the first bond and the second bond is at least 1.3D and less than 2.1D.

The present disclosure relates to methods and apparatuses for stretching, transferring, and bonding elastic parts under tension to an advancing carrier substrate during the assembly of absorbent articles. A continuous carrier substrate may be advanced in a machine direction at a first speed, and a discrete elastic part may be cut from a continuous elastic substrate having a direction of stretch in a cross direction. The speed of the discrete elastic part is changed from a second speed to the first speed, and the central region of the discrete elastic part is stretched in the cross direction. The discrete elastic part is bonded with the continuous carrier substrate such that the stretched central region extends in the cross direction between the first and second longitudinal edges of the continuous carrier substrate. The discrete elastic part may also be bonded with the carrier substrate with adhesive and / or mechanical bonds.

A die attach system includes a substrate that has scored grooves or into which stud bumps on a die are then inserted. The additional surface area and flow of the stud bumps into the trenches creates a strong mechanical bond that may withstand repeated thermal cycling. In a further exemplary aspect, the substrate may be covered in a first material, the stud bumps may be made from the same first material, a die attachment material may be made from the same first material, and a bottom layer of the die may be made from the same material. This material homogeneity allows for more uniform expansion and contraction during thermal cycling, preventing failure of the mechanical bond.

An electrical interconnect structure and its formation method, as well as a panel-level packaging structure, are disclosed. The electrical interconnect structure includes: several conductive structures, the surfaces of which have been roughened to form micro-pit structures; and a molding compound layer covering the sidewalls of the conductive structures. The roughened sidewalls of the conductive structures form micro-pit morphologies. This three-dimensional porous structure significantly increases the actual contact area between the conductive structures and the molding compound layer, enabling a tight mechanical bond at the interface of the two dissimilar materials. After the molding compound layer completely covers the roughened sidewalls of the conductive structures, the molding compound material is embedded within the micro-pit structures, generating a significant anchoring effect and effectively suppressing interface delamination. When the packaging structure experiences temperature changes or is subjected to external mechanical loads, the increased interfacial adhesion can uniformly disperse stress, preventing excessive stress concentration at the interface between the conductive structures and the molding compound layer, thereby preventing the generation and propagation of cracks and significantly improving the long-term reliability and failure resistance of the packaging structure.

This invention relates to the field of fabric production equipment technology, specifically to equipment for producing multi-layer nano-thermal radiation fabric. The equipment includes a mounting frame on which a feeding roller, a gluing device, a pressing roller, and a take-up roller are sequentially mounted. The feeding rollers are arranged in several groups, arranged vertically. The number of feeding rollers, fabric, and gluing devices is matched. A guide roller is also mounted on the mounting frame. Several groups of fabric, guided by the guide roller, pass through their corresponding gluing devices, converge, pass through the pressing roller, and finally connect to the take-up roller. The gluing device includes two sets of gluing mechanisms, with the fabric passing between these two sets. This invention, through the gluing mechanism, applies glue to the fabric surface using injection pressure, allowing the composite agent to penetrate the fabric's interior and form a stronger mechanical bond with the fabric fibers. This enhances the adhesion between the layers of fabric and improves the overall strength of the multi-layer fabric.

The present disclosure relates to methods and apparatuses for stretching, transferring, and bonding elastic parts under tension to an advancing carrier substrate during the assembly of absorbent articles. A continuous carrier substrate may be advanced in a machine direction at a first speed, and a discrete elastic part may be cut from a continuous elastic substrate having a direction of stretch in a cross direction. The speed of the discrete elastic part is changed from a second speed to the first speed, and the central region of the discrete elastic part is stretched in the cross direction. The discrete elastic part is bonded with the continuous carrier substrate such that the stretched central region extends in the cross direction between the first and second longitudinal edges of the continuous carrier substrate. The discrete elastic part may also be bonded with the carrier substrate with adhesive and / or mechanical bonds.

The invention relates to the technical field of wood protection, in particular to a natural environment-friendly sterilization mildew-proof spray for wood. The core of the spray is a multi-stage composite carrier system, mesoporous silica is adopted to load a natural bactericidal mildew preventive, sodium alginate is hydroformylated through sodium periodate and reacts with dopamine hydrochloride Schiff base to construct an adhesion layer on the surface of the mesoporous silica, and dodecanedioic acid and calcium chloride are further crosslinked to form a conchiolin-like strong adhesion structure. The structure effectively anchors the active components on the wood surface, greatly improves the environmental stability, slow release performance and mechanical binding force of the bactericidal mildew inhibitor, and inhibits the loss of active substances. The prepared composite material can still keep a protection effect in extreme environments such as high humidity and high temperature, can be widely applied to the field of green protection of high-grade wood furniture and handicrafts, and has excellent safety, environmental protection property and industrialization prospect.

Disclosed is a composite panel, and a system and method utilizing the composite panel. The composite panel is a fiber-reinforced plastic panel, wherein a first side of the composite panel fluid is impermeable and non-porous and faces the interior of an existing concrete vault. The second side of the composite panel has a mechanical bonding agent embedded in a polyester resin. When a hardening fill is poured between the second side of the composite panel and the wall of the existing vault, a mechanical bond is formed between the hardening fill and the embedded mechanical bonding agent. A plurality of spacer boards are affixed to the second side and extend toward the wall of the existing vault. A plurality of conduits are formed through the composite panel and the spacer boards, and a plurality of fasteners extend through respective conduits to attach to the wall of the existing vault.

A stretch laminate for an absorbent article includes a nonwoven substrate and an elastomeric film joined to the nonwoven substrate by a plurality of bonds. These bonds can be ultrasonic bonds or any combination of mechanical bonds including ultrasonic bonds. The plurality of bonds form a bond pattern having a relative standard deviation percent of greater than about 30% according to a bond-to-bond measurement test.

A prefabricated rail ensemble, a method for forming an embedded rail system and a method for manufacturing a prefabricated rail ensemble. The prefabricated rail ensemble has a rail and an anchoring sheet delimiting at least a portion of each of opposed longitudinal sides, and a polymer compound between the rail and inner faces of the anchoring sheet. The cured polymer compound bonds to the rail and forms a mechanical interlock with the inner face of the anchoring sheet and provides continuous elastic support to the rail. The outer faces of the anchoring sheet are adapted to establish a mechanical bond via the anchoring formations with a binder.

The present disclosure relates to methods and apparatuses for stretching, transferring, and bonding elastic parts under tension to an advancing carrier substrate during the assembly of absorbent articles. A continuous carrier substrate may be advanced in a machine direction at a first speed, and a discrete elastic part may be cut from a continuous elastic substrate having a direction of stretch in a cross direction. The speed of the discrete elastic part is changed from a second speed to the first speed, and the central region of the discrete elastic part is stretched in the cross direction. The discrete elastic part is bonded with the continuous carrier substrate such that the stretched central region extends in the cross direction between the first and second longitudinal edges of the continuous carrier substrate. The discrete elastic part may also be bonded with the carrier substrate with adhesive and / or mechanical bonds.