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Anisotropic conductive adhesive composition and anisotropic conductive film comprising the same

An anisotropic, conductive film technology, applied in the direction of conductive adhesives, elastic polymer dielectrics, adhesives, etc., can solve the problems that free radical curing materials are difficult to meet electronic materials, and it is difficult to ensure high reliability circuit connections.

Active Publication Date: 2009-03-25
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, free radical curing is accompanied by a considerable shrinkage in volume and a decrease in molecular weight after curing, which makes it difficult for free radical curing materials to meet the needs of electronic materials
Therefore, despite the high curing rate, it is difficult for free radical curing materials to ensure high reliability circuit connection in a processing time of less than 10 seconds

Method used

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  • Anisotropic conductive adhesive composition and anisotropic conductive film comprising the same
  • Anisotropic conductive adhesive composition and anisotropic conductive film comprising the same
  • Anisotropic conductive adhesive composition and anisotropic conductive film comprising the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] 55.5 wt% acrylic rubber (SG80H, Nagase Chemtex Corp. (Japan)) dissolved in methyl ethyl ketone (solid content = 20%), 18.5 wt% bisphenol A-type ring dissolved in methyl ethyl ketone (solid content = 60%) Oxygen acrylate resin (weight-average molecular weight=7,500, VR60, Showa Highpolymer Co., LTD. (Japan)), 18.5 wt% bisphenol A type epoxy acrylate resin (weight-average molecular weight=2,500) of general formula 7, 1.1 wt% of 2-methacryloxyethyl acid phosphate, 1.5 wt% of pentaerythritol triacrylate, dissolved in toluene (solid content = 10%) 0.4 wt% of lauroyl peroxide, dissolved in toluene 1.2 wt% benzoyl peroxide in medium (solid content=10%), and 3.3 wt% nickel particles (T110, Inco) were mixed together to prepare an anisotropic conductive adhesive composition.

[0070]

Embodiment 2

[0072] 45.7 wt% of acrylic rubber (SG80H, Nagase Chemtex Corp. (Japan)) dissolved in methyl ethyl ketone (solid content = 20%), 22.9 wt% of bisphenol A-type rubber dissolved in methyl ethyl ketone (solid content = 60%) Epoxy acrylate resin (weight average molecular weight=7,500, VR60, Showa Highpolymer Co., LTD. (Japan)), the bisphenol A type epoxy acrylate resin (weight average molecular weight=2,500) of 22.9wt% general formula 7, 1.4wt% of 2-methacryloyloxyethyl acid phosphate, 1.8wt% of pentaerythritol triacrylate, 0.5wt% of lauroyl peroxide dissolved in toluene (solid content=10%), dissolved in 1.5 wt% benzoyl peroxide in toluene (solid content = 10%), and 3.3 wt% nickel particles (T110, Inco) were mixed together to prepare an anisotropic conductive adhesive composition.

Embodiment 3

[0074] 30.0 wt% acrylic rubber (SG80H, Nagase Chemtex Corp. (Japan)) dissolved in methyl ethyl ketone (solid content = 20%), 30.0 wt% bisphenol A-type ring dissolved in methyl ethyl ketone (solid content = 60%) Oxygen acrylate resin (weight average molecular weight=7,500, VR60, Showa Highpolymer Co., LTD. (Japan)), 30.0 wt% bisphenol A type epoxy acrylate resin (weight average molecular weight=2,500) of general formula 7, 1.8 wt% 2-methacryloyloxyethyl phosphate, 2.4 wt% pentaerythritol triacrylate dissolved in toluene (solids content = 10%) 0.6 wt% lauroyl peroxide dissolved in toluene 1.9 wt% benzoyl peroxide (solid content=10%), and 3.3 wt% nickel particles (T110, Inco) were mixed together to prepare an anisotropic conductive adhesive composition.

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Abstract

The present invention relates to an anisotropic conductive adhesive composition with high reliability and an anisotropic conductive film. The anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.

Description

[0001] Cross-references to related applications [0002] This non-provisional application claims priority under U.S.C. §119 to Korean Patent Application No. 10-2007-0096041 filed September 20, 2007, the entire contents of which are hereby incorporated by reference. technical field [0003] The present disclosure relates to a highly reliable anisotropic conductive adhesive composition comprising acrylic rubber and an anisotropic conductive film comprising the same. More specifically, the anisotropic conductive adhesive composition comprises (A) as an adhesive, an acrylic rubber having a weight average molecular weight of 100,000 to 1,000,000, (B) at least one type having one or two (meth)acrylate groups (C) at least one compound having three or more (meth)acrylate groups, (D) an organic peroxide capable of curing compounds (B) and (C), and (E) a conductive particles. Background technique [0004] Anisotropic conductive film (ACF) generally refers to a film in which conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J9/02C09J7/00H01B1/20
CPCH05K2201/0133C09J4/00H05K3/323C09J133/08C09J133/10C09J109/02C09J9/02
Inventor 朴憬修南宫贤熺申京勋全炳焕尹康培李天石
Owner KUKDO ADVANCED MATERIALS CO LTD
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