Display panel, display apparatus and display panel manufacturing method

A technology for display panels and manufacturing methods, which is applied in the fields of printed circuit manufacturing, electrical component assembly of printed circuits, semiconductor/solid-state device components, etc., to achieve the effect of narrow borders

Inactive Publication Date: 2017-07-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a display panel, a display device, and a method for manufacturing a display panel, which are used to solve the problem in the prior art of how to obtain a display product with a narrow frame under the condition of omitting the connecting terminal bending process

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  • Display panel, display apparatus and display panel manufacturing method
  • Display panel, display apparatus and display panel manufacturing method
  • Display panel, display apparatus and display panel manufacturing method

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Embodiment Construction

[0043] A display panel, a display device, and a method for manufacturing a display panel provided by embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0044] The thickness, shape and size of each film layer in the drawings do not reflect the true proportion of the display panel, but are only intended to schematically illustrate the content of the present invention.

[0045] A display panel provided by an embodiment of the present invention, such as Figure 2a to Figure 2f As shown, it includes: a display substrate 201, a chip-on-chip film 202 arranged on the side away from the display surface of the display substrate 201, an anisotropic conductive adhesive 203 arranged between the display substrate 201 and the chip-on-chip film 202, and fixed on the cover The crystal film 202 is away from the integrated circuit chip 204 on the side of the display substrate 201; wherein,

[0046] The COF 202 is fixed on the si...

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PUM

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Abstract

The invention discloses a display panel, a display apparatus and a display panel manufacturing method. The display panel comprises a display substrate, a flip chip thin film, an anisotropic conductive adhesive arranged between the display substrate and the flip chip thin film and an integrated circuit chip, wherein the flip chip thin film is arranged on a side, facing away from a display surface, of the display substrate; the integrated circuit chip is fixed on a side, facing away from the display substrate, of the flip chip thin film; the flip chip thin film is fixed on the side, facing away from the display surface, of the display substrate via the anisotropic conductive adhesive; a circumference of the display surface of the display substrate is provided with at least a plurality of connection holes that run through the display substrate and electric conduction material which all the connection holes are filled with, and signal wires positioned on the circumference of the display surface of the display substrate are connected with connection terminals arranged on the flip chip thin film via the electric conduction material. Thus, connection terminal bending technologies are not needed, a circumference of the display panel can be prevented from connection terminal bending areas, and narrowness of a frame of the display panel can be improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel, a display device and a method for manufacturing the display panel. Background technique [0002] With the continuous advancement of display technology, display panels are more and more widely used in display products. Display products with narrow bezels (Narrow Bezel) have attracted a large number of consumers because they can enable users to obtain a better viewing experience. [0003] Currently, pad bending is the only solution to realize a display product with a narrow bezel. However, there are many problems with the yield rate of display products made by connecting terminal bending technology, for example, if figure 1 As shown, cracks occur in the inorganic insulating layer connecting the bending region P of the terminal, which will lead to display failure. In the prior art, a mask (Mask) process is added to remove the inorganic insulating layer i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/32
CPCH05K3/323H05K2201/10128G02F1/13452H01L23/4985H05K1/113H05K1/118H05K1/189
Inventor 董向丹高永益胡明刘庭良
Owner BOE TECH GRP CO LTD
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