Wireless chip and electronic appliance having the same

Inactive Publication Date: 2006-09-14
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0027] The layer having the thin film transistor formed over the insulating substrate can be formed so as to have almost the same dimension as the antenna. The insulating substrate serves as a protector for the layer having the thin film transistor as well as a protector for the antenna. Therefore, the mechanical strength of the wireless chip increases.
[0028] Since a patch antenna has high mechanical strength, the patch antenna can be used repeatedly. Therefore, a wireless chip having a patch antenna can be provided to a recyclable container such as a returnable container.
[0029] Further, since an integrated circuit is formed using electrically-isolated thin film transistors in a wireless chip of the present invention, an electric wave is more difficult to be blocke

Problems solved by technology

The antenna attached to a flexible material such as paper or plastic has a problem in that the antenna is sensitive to bending or folding, so that a part of the antenna is easily broken.
Moreover, in the case of a wireless chip formed

Method used

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  • Wireless chip and electronic appliance having the same
  • Wireless chip and electronic appliance having the same
  • Wireless chip and electronic appliance having the same

Examples

Experimental program
Comparison scheme
Effect test

embodiment mode 1

[0051] An embodiment mode of a wireless chip of the present invention is shown in FIGS. 1A and 1B. FIGS. 1A and 1B are cross-sectional views of a wireless chip.

[0052] In a wireless chip of this embodiment mode, a layer 102 having a thin film transistor formed over an insulating substrate 101 is fixed to an antenna 103 by an anisotropic conductive adhesive 104. Moreover, a connection terminal 107 of the layer 102 having a thin film transistor and a power feeding layer 113 of the antenna are electrically connected by conductive particles 109 dispersed in the anisotropic conductive adhesive 104. Further, although not shown, a ground wiring of the layer having a thin film transistor is electrically connected to a conductive layer serving as a ground contact body of the antenna.

[0053] As the insulating substrate 101, an inflexible insulating substrate is preferred. A quartz substrate or a glass substrate such as a nonalkali glass substrate is used.

[0054] The layer 102 having a thin fi...

embodiment mode 2

[0117] An embodiment mode of a wireless chip of the present invention is shown in FIG. 2. FIG. 2 is a cross-sectional view of a wireless chip. In this embodiment mode, a structure of a wireless chip which has a patch antenna and plural layers having thin film transistors wherein the layers are fixed to each other by an anisotropic conductive adhesive is described.

[0118] In a wireless chip of this embodiment mode, a first layer 102 having a thin film transistor is formed over an insulating substrate 101 similarly to Embodiment Mode 1. Further, the first layer 102 having a thin film transistor and a second layer 131 having a thin film transistor are fixed to each other by an anisotropic conductive adhesive 133.

[0119] A first connection terminal formed on the surface of the first layer 102 having a thin film transistor is electrically connected to a second connection terminal formed on the surface of the second layer having a thin film transistor through conductive particles disperse...

embodiment mode 3

[0129] An embodiment mode of a wireless chip of the present invention will be described with reference to FIG. 3. FIG. 3 is a cross-sectional view of a wireless chip. This embodiment mode will describe a structure of a wireless chip in which a layer having a thin film transistor and a patch antenna are provided in different regions over an insulating substrate.

[0130] Over the insulating substrate 101, a layer 141 having a thin film transistor is formed in a first region 145. On a surface of the layer 141 having a thin film transistor, a connection terminal 143 is formed. The layer 141 having a thin film transistor can be formed similarly to the first layer 102 having a thin film transistor in Embodiment Mode 1. Further, as shown in FIG. 3, parts of the thin film transistor and the insulating layer formed thereover that are in a second region 146 may be removed.

[0131] The antenna 103 is fixed onto the second region 146 by an anisotropic conductive adhesive 142. The connection termi...

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PUM

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Abstract

The present invention provides a wireless chip having high mechanical strength. Moreover, the present invention also provides a wireless chip which can prevent an electric wave from being blocked. In a wireless chip of the present invention, a layer having a thin film transistor formed over an insulating substrate is fixed to an antenna by an anisotropic conductive adhesive, and the thin film transistor is connected to the antenna. The antenna has a dielectric layer, a first conductive layer, and a second conductive layer; the first conductive layer and the second conductive layer has the dielectric layer therebetween; the first conductive layer serves as a radiating electrode; and the second electrode serves as a ground contact body.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a wireless chip which can send and receive data through wireless communication and an electronic appliance having the wireless chip. [0003] 2. Description of the Related Art [0004] In recent years, development of a wireless chip including a plurality of circuits and an antenna has been advanced. Such a wireless chip is referred to as an ID tag, an IC tag, an IC chip, an RF (Radio Frequency) tag, a wireless tag, an electronic tag, or an RFID (Radio Frequency IDentification) tag, and has been already introduced into some markets. [0005] Many of these wireless chips which are currently in practical use have circuits using semiconductor substrates such as silicon (such circuits are also referred to as IC (Integrated Circuit) chips) and antennas. The antenna is formed by a printing method, a method in which a conductive thin film is etched, a plating method, or the like (see, for example,...

Claims

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Application Information

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IPC IPC(8): H01L27/12
CPCH01L21/84H01L23/49855H01L27/1214H01L27/13H01L29/78621H01L29/78675H01L2223/6677H01L2924/0002H01Q1/22H01Q1/2283H01Q9/0407H01Q9/27H01L2924/00H01L27/1255
Inventor SUZUKI, YUKIEARAI, YASUYUKIYAMAZAKI, SHUNPEI
Owner SEMICON ENERGY LAB CO LTD
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