1246results about "Substantially flat resonant elements" patented technology

A right-hand circularly-polarized patch antenna comprising a ground plane and a patch connected to each other with one or more wires for which the wire shape and location of the end points are selected such that they do not cause an antenna mismatch, and the electrical current carried in the wires produces an extra electromagnetic field subtracted from the patch field in the nadir direction.

The invention belongs to the technical field of antenna engineering, and particularly relates to an ultra-wide-band low-profile phased-array antenna, which realizes broadband impedance matching characteristics and effectively expands the working bandwidth of the antenna by optimizing a dipole arm structure and introducing a matching branch knot and linear tapered slot composite structure on a radiation unit layer; on the array architecture level, an electromagnetic metasurface technology is adopted, array current distribution is improved through a periodic artificial electromagnetic structure, the active standing-wave ratio is remarkably reduced, the scanning angle of an array is widened, and meanwhile high compression of a system profile is achieved; on the structural design level, a three-dimensional composite structure of a transverse metal floor, a longitudinal radiation layer and a transverse metasurface layer is innovatively constructed, and the overall section height is reduced to 0.137 lambda Low (lambda Low is the lowest working frequency wavelength) through electromagnetic coupling and space folding technologies; in conclusion, the ultra wide band (the relative bandwidth is greater than or equal to 90%) and the low profile (lt; and the method is suitable for a new generation of broadband phased array radar system.

The wireless RF semiconductor system is described for use in wireless communication devices that operate in frequency range from 6 GHz to 100 GHz. The system comprises of at least one RF antenna and at least one active RF component fabricated (or built) on the same semiconductor substrate inside a one single packaged module. The wireless RF semiconductor system is described in a variety of different configurations with its functionality divided up over several single chip circuits. The system simplifies assembly, reduces size and cost, and allows for a quick time to market, while maximizing the RF performance demanded by fixed and mobile 4G, 5G and other wireless standards.

The invention provides a wide-angle scanning dual-circularly-polarized phased-array antenna unit, which belongs to the field of dual-circularly-polarized antennas and comprises a first dielectric layer, a second dielectric layer and a third dielectric layer which are sequentially stacked, the antenna radiator is arranged on the side, away from the second dielectric layer, of the first dielectric layer, the antenna radiator comprises four radiation patches, each radiation patch comprises a metal patch and a loading branch knot, and each metal patch is provided with a slotted structure; the first metal ground layer is clamped between the first dielectric layer and the second dielectric layer, and a cross coupling gap and a first coupling gap and a second coupling gap which are perpendicular to each other are formed in the first metal ground layer; the U-shaped feeder line is clamped between the second dielectric layer and the third dielectric layer, and two ends of the U-shaped feeder line are respectively connected with a coaxial feed column penetrating through the third dielectric layer; the second metal ground layer is arranged on the side, away from the second dielectric layer, of the third dielectric layer; an array is also provided; the problem that a traditional circularly polarized antenna is narrow in impedance bandwidth and limited in polarization is solved.

The invention discloses a compact millimeter wave dual-polarization filtering antenna and array, which comprises 11 layers of structures (a first metal layer to a sixth metal layer, three dielectric layers and two bonding layers) and three types of metalized via holes which are sequentially stacked from top to bottom, the feed through hole penetrates through the first dielectric layer to the third dielectric layer, the short-circuit through hole penetrates through the first dielectric layer to the third dielectric layer, and the shielding hole penetrates through the third dielectric layer. Wherein a cross-shaped radiation patch and a C-shaped parasitic metal strip line are arranged on the first metal layer; an annular driving patch is arranged on the second metal layer; the third metal layer is provided with a feed metal strip line and a parasitic metal strip line. The fourth metal layer is provided with a parasitic open-circuit branch. A first grounding plane is arranged on the fifth metal layer; the sixth metal layer is provided with a second grounding plane and an anti-pad. The working frequency band covers the n258 frequency band and the n257 frequency band of 5G millimeter waves, dual-polarization radiation and effective out-of-band rejection can be achieved, and meanwhile the antenna has the advantages of being compact in structure and light and handy in appearance.

A hybrid antenna substrate of an embodiment comprises: a core part including a core layer and a core wiring layer laminated in the vertical direction; and an antenna part disposed on the core part, wherein: the antenna part comprises a plurality of antenna wiring layers successively laminated on the core part and antenna insulating layers disposed between the plurality of antenna wiring layers; and the core layer has a greater dielectric constant than the antenna insulating layers.

Embodiments of this application provide an antenna, and an electronic device. The antenna includes a radiating patch layer, a ring-shaped metal layer, a first metal layer, and a feed element. The radiating patch layer includes four radiating patches that are distributed in a 2×2 array. The ring-shaped metal layer is disposed in correspondence with a peripheral edge part of the radiating patch layer, and is coupled and connected to the radiating patch layer. A plurality of metal columns are disposed on the first metal layer. The plurality of metal columns are electrically connected to the ring-shaped metal layer.

An antenna device includes: a dielectric layer; radiation conductors and a ground conductor disposed at the dielectric layer; and side surface conductors in which a plurality of conductor patterns are laminated, the side surface conductors are disposed on an outer side of the ground conductors in a first direction in plan view seen from a normal direction of the radiation conductors, and the dimensions of the side surface conductors in a second direction perpendicular to the first direction are larger than the dimensions in the second direction of the radiation conductors.

A low-profile ultra-wideband wide-angle scanning phased-array antenna based on a tight coupling structure is composed of a metal floor and a plurality of antenna units, the antenna units extend in the X polarization direction and the Y polarization direction respectively to form a plane of any size, and an antenna array is formed; the antenna unit sequentially comprises an upper substrate, a dipole antenna and a lower substrate from top to bottom, the dipole antenna is vertically and crossly placed and comprises two layers of dielectric substrates and a layer of prepreg between the two layers of dielectric substrates, and a resistor-coated pattern is printed on the upper surface of the lower substrate.

To provide an antenna module incorporating an electronic component such as an RFIC. An antenna module includes a core substrate, an outermost insulating layer, and a resin layer provided between the core substrate and the outermost insulating layer and embedding therein an RFIC. The core substrate has a core layer, insulating layers and sandwiching the core layer, a through hole conductor connecting conductor layers to, an antenna layer, and feeding patterns and, a via conductor connecting the feeding pattern and a feeding pattern, and a via conductor connecting an antenna pattern and the feeding pattern. The resin layer has a conductor layer connected to the RFIC. The conductor layer is larger in thickness than the conductor layer, which makes cracks or disconnection unlikely to occur in the conductor layer while achieving fine pitch of the conductor layer.

The invention discloses a broadband wide-angle scanning array antenna based on a metasurface lens, belongs to the technical field of phased-array antennas, solves the problem of how to improve the scanning range and gain of the phased-array antennae, and is characterized in that the metasurface lens with phase gradient is loaded above the phased-array antenna on the basis of not changing the structure of the original phased-array antenna. The beam scanning range of the phased-array antenna is expanded, and the performance such as gain is improved; according to the invention, an original phased-array antenna does not need to be modified and redesigned, additional active devices do not need to be added, new components do not need to be introduced into an original system, the system cost is effectively reduced, the system size is reduced, and the antenna is suitable for scenes, such as unmanned aerial vehicles and low-altitude aircrafts, which have strict requirements on the size and the weight.

Disclosed is an input sensing part that includes sensing electrodes disposed in an active area, a first ground pattern disposed in an inactive area around the active area, a first ground pad disposed in the inactive area and electrically connected to the first ground pattern, a first antenna pattern insulated from the sensing electrodes and disposed in the active area, a first signal pad that extends from the first antenna pattern and disposed in the inactive area, a 1-1-th ground pad disposed adjacent to the first signal pad and electrically connected to the first ground pattern, and a 1-2-th ground pad disposed adjacent to the first signal pad.

An antenna substrate, electronic package and manufacturing method thereof are provided in which an antenna substrate including a silicon core layer, a circuit structure and conductive pillars, and the circuit structure has a first dielectric layer, a first circuit layer and a first antenna portion. The circuit structure and the conductive pillars are formed on opposite sides of the silicon core layer, and the antenna substrate is stacked and bonded to a circuit board having a second antenna portion through the conductive pillars. Thereby, the present disclosure can thin a thickness of the antenna substrate and the electronic package, or precisely control a distance between the antenna substrate and the circuit board.

An elementary microstrip antenna includes a stack of layers, stacked in a direction z, the stack comprising: a first conductive radiating element of disc shape having a first centre, an axis in the direction z and passing through the first centre being called the central axis; a coupling assembly configured to couple an exciting device and the first radiating element, the coupling assembly comprising: a first slot comprising a centre called the slot centre located on the central axis; a second slot comprising a centre coincident with the slot centre, and substantially perpendicular to the first slot, the first and second slots each comprising circularly arcuate ends on the same circle centred on the slot centre; the slots and the stacked layers being configured so that a transverse footprint of the elementary antenna is disc-shaped.

Provided herein are various enhancements for radio frequency antennas and antenna assemblies. In one example, an antenna assembly includes a cavity structure comprising an interior volume surrounded by a wall and having an opening at a first longitudinal end and a cap at a second longitudinal end. A conductive material disposed on a portion of the wall of the cavity structure and the cap such that a dielectric gap is established between the conductive material and a planar antenna when the planar antenna is coupled onto the first longitudinal end of the cavity structure.

An antenna arrangement for a watercraft is disclosed. In an embodiment, the antenna arrangement comprises a first antenna configured to wirelessly communicate with a wireless user device, the first antenna for securement to a top-side of a watercraft; a second antenna configured to wirelessly communicate with a wireless control unit, the second antenna for securement to an underside of the watercraft to place the second antenna in juxtaposed relationship with a third antenna of a wireless control unit; and a radio frequency (RF) transmission line conductively coupling the first antenna and the second antenna.

An antenna unit includes: a radiation assembly including at least one parasitic patch and at least one radiation patch; a dielectric layer including a layer of dielectric substrate; a floor layer; and at least one feed structure, wherein the radiation assembly is located on a top surface of the dielectric layer; the floor layer is located on a bottom surface of the dielectric layer; and the least one feed structure passes through the floor layer and the dielectric layer sequentially and is electrically connected to the at least one parasitic patch, and the at least one parasitic patch is coupled to the at least one radiation patch.

The disclosure provides an antenna structure and electronic apparatus using the same. The antenna structure is disposed on a dielectric substrate having a first surface and a second surface opposite to the first surface, wherein a grounding metal sub-structure is disposed on the first surface, and an electromagnetic wave transmitting sub-structure, an electromagnetic wave receiving sub-structure and an isolating metal sub-structure is disposed on the second surface. The electromagnetic wave transmitting sub-structure and the electromagnetic wave receiving sub-structure extends along a first direction, and the isolating metal sub-structure is disposed between the electromagnetic wave transmitting sub-structure and the electromagnetic wave receiving sub-structure and comprises a cross-type metal block and a plurality of straight-line-type metal block separated from each other and extends along the first direction.

To provide a kick sensor capable of preventing erroneous detection.SOLUTION: A kick sensor 1, which is designed to detect a movement of a human leg serving as a trigger of controlling a vehicle door when installed in a vehicle, includes a first antenna 10 that receives radio waves from at least the side of the vehicle door, and a second antenna 20 that receives radio waves from at least the bottom of the vehicle door.SELECTED DRAWING: Figure 2

A mobile device having array antenna can be used to communicate with Earth orbiting satellites and base stations on the ground. The display screen of the mobile device has an array antenna capable of transmitting and receiving radio frequency (RF) signals in the range of 0.6 GigaHertz (GHz) to 100 GHz. The configuration of the array antenna, including the number of arrays and the dimension of the arrays, is software programmable by activating and deactivating antenna elements for multiple beams and their beam characteristics.

The invention discloses a miniaturized circular patch antenna loaded with four symmetrical L-shaped grooves, and relates to the technical field of wireless communication. The antenna comprises a circular patch, a dielectric substrate, a metal grounding plate and a coaxial line. The circular patch clings to the upper surface of the dielectric substrate, and the metal grounding plate is arranged on the lower surface of the dielectric substrate; four L-shaped grooves are formed in the circular patch, the geometric dimensions of the four L-shaped grooves are the same, and the four L-shaped grooves are symmetrically distributed around the circle center; the circular patch adopts a coaxial line for feeding, the inner conductor is connected to the circular patch, and the outer conductor is connected with the metal grounding plate. The symmetrical L-shaped grooves are etched in the circular patch, so that the resonant frequency of the antenna is effectively reduced, and the electrical size of the antenna is reduced; the antenna keeps relatively high gain and radiation efficiency, and has the advantages of simple structure and excellent performance.

A microstrip antenna which includes a substrate, a ground on a second side of the substrate, a first patch on a first side of the substrate, and a second patch on the first side of the substrate. The first patch is connected to a first port. The second patch is separated from the first patch and connected to a second port. Each of the first and second patches is further formed with a plurality of shorting vias connected to the ground. The radiation patterns of each element also feature the RPD characteristic, which is promising for large-scale MIMO or array antennas.

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

An electronic device according to various embodiments may comprise: a housing; an antenna structure comprising a substrate, which comprises a first substrate surface facing a first direction and a second substrate surface facing a second direction opposite from the first substrate surface, and at least one antenna element disposed on the substrate so as to form a beam pattern in the first direction; a first support part disposed so as to at least partially correspond to the second substrate surface; a conductive bracket comprising at least one conductive extension part disposed higher than the second substrate surface with respect to the first support part; and a wireless communication circuit configured to transmit and / or receive a wireless signal in a designated frequency band by means of the at least one antenna element.

A circular polarized penta-band antenna device and a method for fabricating the antenna device are provided. The antenna device includes: a substrate; a primary L-band antenna formed on the substrate; and a plurality of secondary antennas formed on a top surface of the L-band antenna. The plurality of secondary antennas includes: an X-band antenna; a K-band1 antenna; a K-band2 antenna; and a Ka-band antenna. Each of the X-band, K-band1, K-band2, and Ka-band antennas has a corner-truncated patch structure configured to generate left-hand circular polarization (LHCP). Each of the antennas operates simultaneously to enable multi-band communication and a shared aperture is formed across all antennas.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

The invention relates to an anti-interference high-selectivity omnidirectional planar filtering antenna, a filtering processing method and application, and the planar filtering antenna comprises a metal radiation layer, a first dielectric substrate, a first coupling layer, a second dielectric substrate and a second coupling layer which are sequentially stacked. The second dielectric substrate is provided with a plurality of metalized through holes which are distributed in an annular array mode and define a substrate integrated cavity with the first coupling layer and the second coupling layer, the metalized through holes divide the second coupling layer into an inner side patch and an outer side ring piece, and the inner side patch is evenly provided with a plurality of resonance grooves; and a feed probe penetrating and extending to the second dielectric substrate is arranged at the center of the bottom of the metal radiation layer. According to the invention, the substrate integrated waveguide technology is adopted, the substrate integrated cavity is formed, and a high-selectivity filtering effect is realized by utilizing the characteristic of high Q value, so that the interference of out-of-band signals is effectively inhibited, and the advantages of the patch antenna and the substrate integrated cavity are effectively combined.

A wearable device is provided. The wearable device includes a housing, an input member disposed on a lateral surface of the housing and including an outer lateral surface including a conductive portion and a non-conductive portion, a metal member disposed inside the housing and in contact with the conductive portion of the outer lateral surface, a printed circuit board (PCB) disposed on the metal member, a patch antenna including a conductive patch disposed on a surface of the PCB facing the input member at a location corresponding to the non-conductive portion, a wireless communication circuit electrically connected to the PCB and the patch antenna, and a processor connected to the metal member. The wireless communication circuit transmits a signal by feeding power to the patch antenna, and the processor acquires user biometric information through the metal member and the conductive portion of the input member.

An electronic device includes a multilevel package substrate, a semiconductor die, and a package structure, the multilevel package substrate has first, second, and third levels including respective dielectric layers and conductive features, the first level including a first trace layer with an antenna and a first via layer with a portion of a ground wall laterally spaced outward from and surrounding the antenna, and the second level including a second trace layer having a ground plane connected to the ground wall, the semiconductor die attached to the first level of the multilevel package substrate, and the package structure including a molding compound enclosing the semiconductor die and extending on a side of the antenna, where the package structure mold compound maters and thickness can be tuned for improved performance.

The present disclosure relates to an antenna apparatus, and especially comprises: a main body module in which a main board is mounted; an RF module which is fixed to the front so that an intermediate outside air layer is formed between the RF module and the main body module, and in which an RF filter unit and an antenna element unit are mounted; and an amplification unit module which is disposed so as to be exposed in the intermediate outside air layer between the main body module and the RF module, and comprises an amplification unit substrate having analog amplification elements mounted thereon, wherein heat generated from heating elements mounted on the main board is dissipated through at least any one of the front and back of the main body module, and heat generated from the amplification unit module is directly dissipated through the intermediate outside air layer, and thus the advantage of enabling maximum heat dissipation performance is provided.