156results about How to "Adhesive strength" patented technology

A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 μm, and the glass powder is a Bi₂O₃—SiO₂—B₂O₃ type glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.

An electrostatic chuck of the invention includes a base portion; a heat insulating layer bonded onto the base portion; and a chuck function portion bonded on the heat insulating layer and composed by providing a heater electrode and an electrostatic chuck (ESC) electrode in a ceramic substrate portion. Adhesive layers are respectively provided on the both surface sides of the heat insulating layer. In the case where the base portion and the chuck function portion are bonded together with high adhesion strength, openings are formed in the heat insulating layer and are filled with the adhesive layers.

A light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and reliability is provided. Further, a light-emitting device which is thin and lightweight and has high flexibility, impact resistance, and hermeticity is provided. In the light-emitting device in which a light-emitting region including a transistor and a light-emitting element is sealed between a first flexible substrate and a second flexible substrate, an opening is provided in the second flexible substrate around a region overlapping with the light-emitting region, the opening is filled with frit glass containing low-melting glass and bonding the first flexible substrate and the second flexible substrate, and the frit glass is provided so as to be in contact with an insulating layer provided over the first flexible substrate. The second flexible substrate may include an opening in a region overlapping with the light-emitting region.

In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.

Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½- 3/2 of the second height. The second adhesive layer includes a thermosetting resin, a hardener for hardening the thermosetting resin, and a plurality of conductive particles each having an average particle diameter of ½ or less of the width of gaps between the plurality of electrodes and a first density dispersion, has a second thickness larger than two times the average particle diameter of the conductive particles, and is formed on one surface of the nonconductive first adhesive layer.

A wiring board comprising a copper wiring, and an insulating layer which is a cured product of a resin composition containing a compound having a carbon-carbon unsaturated double bond as a cross-linking component,

• • the wiring board having a surface-treated layer formed on one or both sides of the copper wiring, and
  • the surface-treated layer having a metal layer (A) containing at least one metallic component selected from the group consisting of tin, zinc, nickel, chromium, cobalt and aluminium,
  • an oxide and/or hydroxide layer (B) of the metallic component on the metal layer (A),
  • an amino-silane coupling agent layer (C) having an amino group in its structure on the oxide and/or hydroxide layer (B), and
  • a vinyl-silane coupling agent layer (D) having a carbon-carbon unsaturated double bond on the amino-silane coupling agent layer (C).

Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes providing a base substrate in which a thermoplastic resin layer is formed; forming a circuit pattern on the thermoplastic resin layer by discharging a conductive ink by an inkjet method; curing the circuit pattern through the heating at a temperature that is lower than a melting point of the thermoplastic resin layer; sintering the circuit pattern through the heating; and burying at least a part of the circuit pattern in the thermoplastic resin layer by heating the thermoplastic resin layer and compressing the circuit pattern toward the thermoplastic resin layer, can provide a printed circuit board and a method for manufacturing the same, in which a fine circuit pattern can be formed by an inkjet method and the adhesive force between the circuit pattern and the base substrate can be improved.

A method for manufacturing an IC-embedded substrate comprises a first step for encapsulating at least an IC chip having a pad electrode in an insulating layer, a second step for forming a metal layer having at least a first aperture in a location directly above the pad electrode of the IC chip and a second aperture in a location above an area other than the area in which the IC chip is mounted, and a third step for selectively removing the insulating layer by a blasting treatment in which the metal layer is used as a mask, whereby forming a first via hole that corresponds to the first aperture and a second via hole that corresponds to the second aperture.

There is provided a wiring board for mounting a light emitting element thereon. The wiring board includes: an insulating layer; a wiring pattern on the insulating layer; a reflecting layer on the insulating layer to cover the wiring pattern, wherein the light emitting element is to be mounted on a surface of the reflecting layer; and a silica film on the surface of the reflecting layer.

Disclosed herein is a secondary battery comprising electrode leads mounted in a sealed fashion in a battery case while the electrode leads partially protrude from the battery case and resin films disposed between the battery case and the electrode leads wherein the electrode leads are provided at predetermined areas of the surfaces thereof, to which the resin films are applied, with irregular parts, by which the adhesive strength between the electrode leads and the resin films is increased. The adhesive strength between the electrode leads and the resin films is large, and the movement path of moisture or electrolyte, through which the moisture contained in the air or the electrolyte contained in the secondary battery may move, is extended. Consequently, the present invention has the effect of minimizing the reduction in service life of the secondary battery due to introduction of the moisture into the secondary battery and leakage of the electrolyte from the secondary battery. The secondary battery is very useful as a unit cell for medium- or large-sized battery systems, such as hybrid electric vehicles.

A composition comprising a silicone oil or fluorosilicone fluid infused in a cross-linked silicone resin matrix. The silicone oil or fluorosilicone fluid may comprise a linear or branched polymeric siloxane that may be functionalized with one or more of: alkyl, fluoroalkyl, aryl, benzyl, halo, hydride, hydroxyl, -alkyl-OH, -alkyl-SH, halo, -aryl-halogen, -alkyl-COOH, -alkyl(COOH)-alkyl-COO-alkyl, alkenyl, vinyl, -alkyl-acryloyl, -alkylamino, -alkyl-NH-alkyl-NH2, -alkyl-OOC—NH-alkyl-NCO, -alkyl-O-oxiranyl, monofluoromethyl, difluoromethyl, trifluoromethyl, or alkeneoxide co-polymer.

A capacitive element includes a base member 10, an underlying insulating film 11 formed on the base member 10, a capacitor Q constructed by forming a lower electrode 13, a capacitor dielectric film 14, and an upper electrode 15 sequentially on the underlying insulating film 11, a lower protection insulating film 16a formed on the upper electrode 15 to cover at least a part of the capacitor Q, and an upper protection insulating film 16b formed on the lower protection insulating film 16a and having a wider energy band gap than the lower protection insulating film 16a.

A color wheel, for use in a Digital Light Processing (DLP), capable of preventing a color filter from escaping away is disclosed. The color wheel includes a motor having a spindle to which a rotating disc is mounted, and a filter element mounted to the rotating disc. The filter element includes a filter ring comprising a plurality of sectors having radially extending edges jointed to each other and forming a joint line between jointed edges, and a positioning ring coaxially mounted to the filter ring to hold the sectors together, the positioning ring being positioned on and fixed to the rotating disc and interposed between the filter ring and the rotating disc to fix the filter ring to the rotating disc.

The present invention aims to provide a resin composition superior in all of resistance to moisture permeability, adhesive strength and transparency. This object is achieved by a resin composition containing 3-38 parts by mass of (B) calcined hydrotalcite, 1-16 parts by mass of (C) talc, and 1-16 parts by mass of (D) silica based on 80 parts by mass of (A) an epoxy resin.

An interconnector is discussed, which includes a conductive metal of a band shape including a first surface and a second surface opposite the first surface; and a solder coated on the first surface, wherein the first surface of the conductive metal includes at least a flattened peak extending in a length direction of the conductive metal, the flattened peak including an inclined portion and a flat portion extending in a width direction of the conductive metal, and wherein a length of the inclined portion is less than a length of the flat portion in the width direction of the conductive metal.

A drill head manufacturing method calls for a cutting tip to be CVD coated, brazed to a distal end of a drill head, polished and then PVD coated. The process effectively utilizes features of a CVD coating, which renders a tool service life longer and enables a drill head more suitable for high-speed cutting to be manufactured. A cutting tip having been CVD coated with a hard material is brazed at a brazing temperature to a predetermined portion at a distal end side of a head main body. An outer diameter portion OD of the brazed tip about a rotation axis of the head main body is polished. Then, the cutting tip and the head main body are PVD coated with a hard material at a second temperature lower than the brazing temperature.

A display device includes an array substrate, a driving film and an adhesive member. The array substrate includes a first base substrate, a plurality of first signal pads formed on the first base substrate and a first dummy pad formed adjacent to the first signal pads. The driving film includes a base film, a plurality of output terminals formed on the base film and a first alignment mark formed adjacent to the output terminals. The adhesive member adheres the first signal pads to the output terminals, and adheres the first dummy pad to the first alignment mark.

A silicone pressure-sensitive adhesive composition exhibiting powerful adhesive strength to silicone rubbers. The composition includes (A) a polydiorganosiloxane composed of components (A1) and (A2) described below and having a mass ratio of (A1)/(A2) within a range from 100/0 to 10/90,

• • (A1) a linear polydiorganosiloxane having two or more alkenyl groups within each molecule,
  • (A2) a linear polydiorganosiloxane having SiOH groups at the terminals and having no alkenyl groups,
  • (B) a polyorganosiloxane containing R³₃SiO_0.5 units, SiO₂ units and silanol groups and having a molar ratio of R³₃SiO_0.5 units/SiO₂ units within a range from 0.5 to 0.9,
  • (C) a polyorganohydrogensiloxane containing three or more SiH groups,
  • (D) a reaction retarder,
  • (E) a platinum group metal-based catalyst, and
  • (F) at least one metal compound having a formula MY_x wherein M represents a metal element having an atomic valence of 3 or 4 such as aluminum, x represents a number equal to the atomic valence of M, and Y represents a ligand.

The composition is useful for producing a pressure-sensitive adhesive tape.

A resin composition is provided. The resin composition comprises:

• (A) a polyphenylene ether resin which has an unsaturated functional group; and
• (B) a first cross-linking agent represented by the following formula (I):

The present invention is a process of producing a plating resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat of the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat of the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heavy metal as the pre-treatment of the metal plating step is included. The present invention provides further the plating resin molded article obtained by the above-mentioned step. Although an etching treatment by chromic acid is not carried out, the plating resin molded article having a high adhering strength of a plating layer is provided.