885results about "Electrostatic holding devices" patented technology

Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.

In a torque-limiting device, a first end engages a fastener, a second end receives an applied torque, and a magnetic torque limiter transmits the applied torque from the second end to the first end to rotate the first end in conjunction with the second end when the applied torque is less than a predetermined limit.

Electrostatic chucks (ESCs) with RF and temperature uniformity are described. For example, an ESC includes a top dielectric layer. An upper metal portion is disposed below the top dielectric layer. A second dielectric layer is disposed above a plurality of pixilated resistive heaters and surrounded in part by the upper metal portion. A third dielectric layer is disposed below the second dielectric layer, with a boundary between the third dielectric layer and the second dielectric layer. A plurality of vias is disposed in the third dielectric layer. A bus power bar distribution layer is disposed below and coupled to the plurality of vias. A fourth dielectric layer is disposed below the bus bar power distribution layer, with a boundary between the fourth dielectric layer and the third dielectric layer. A metal base is disposed below the fourth dielectric layer. The metal base includes a plurality of high power heater elements housed therein.

In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising an electrode, and a surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface layer includes a plurality of protrusions extending to a height above portions of the surface layer surrounding the protrusions to support the substrate upon the protrusions during electrostatic clamping of the substrate. The protrusions are substantially equally spaced across the surface layer as measured by a center to center distance between pairs of neighboring protrusions.

Embodiments of the present invention provide chamber components having a protective element for shielding bonding material from processing environments in a processing environment. The protective element may include protective seals, protective structures, erosion resistive fillers, or combinations thereof. Embodiments of the present invention reduce erosion of bonding material used in a processing chamber, thus, improving processing quality and reducing maintenance costs.

An electrostatic interaction system includes a first structure having a first fixed electrostatic charge and a second structure having a second fixed electrostatic charge. The polarity of the first and second fixed electrostatic charges determines a positional relationship of the first structure to the second structure.

Described herein is electroadhesion technology that permits controllable adherence between two objects. Electroadhesion uses electrostatic forces of attraction produced by an electrostatic adhesion voltage, which is applied using electrodes in an electroadhesive device. The electrostatic adhesion voltage produces an electric field and electrostatic adherence forces. When the electroadhesive device and electrodes are positioned near a surface of an object such as a vertical wall, the electrostatic adherence forces hold the electroadhesive device in position relative to the surface and object. This can be used to increase traction or maintain the position of the electroadhesive device relative to a surface. Electric control of the electrostatic adhesion voltage permits the adhesion to be controllably and readily turned on and off.

An electrostatic chuck comprises a dielectric ceramic layer made of an alumina sintered body having a volume resistivity equal to or greater than about 1×10¹⁷Ω·cm at room temperature and a volume resistivity equal to or greater than about 1×10¹⁴Ω·cm at 300° C., and an electrode formed on one surface of the dielectric ceramic layer.

An electrostatic chuck according to the present invention exhibits a greater attractive force by virtue of the Johnson-Rahbeck effect, while ensuring satisfactory insulation in a ceramic portion present below an electrostatic attraction electrode thereof in a temperature range of 250 to 450° C. The electrostatic chuck is produced by superposing green sheets printed with a conductive paste and green sheets not printed with the conductive paste in a predetermined order with a binding liquid applied on the respective green sheets, heat- and press-bonding the superposed green sheets and firing the heat- and press-bonded green sheets. During the production, a conductive component of the electrostatic attraction electrode is diffused into the ceramic portion present between the electrode and an attractive surface of the chuck.

An electrostatic chuck for attracting an insulative substrate, used under a vacuum atmosphere, comprises: a dielectric layer having a first surface which attracts an insulative substrate, and a second surface on which are provided a plurality of electrodes; an insulative support base plate fixing the dielectric layer thereon; a plurality of electrically conductive terminals provided on the insulative support base plate; and an electrical connection between the electrodes and the electrically conductive terminals.

A method for refurbishing at least a portion of an electrostatic chuck. The method comprises removing a first dielectric component from a fluid distribution element of the electrostatic chuck and replacing the first dielectric component with a second dielectric component.

A mechanical drive system operating by magnetic force, to be fitted on a pump, comprises a basic structure on which a drive shaft, which extends along a longitudinal axis, is supported rotatably. A driving element operatively connected to the drive shaft is provided with driving magnets arranged in a ring. A driven element provided with driven magnets arranged in a ring is also mounted on the basic structure. A bell is inserted between the driving element and the driven element and isolates the environment containing the driven element. The driving element and the driven element comprise respective cages each having seats for housing the respective driving magnets or driven magnets.

An electrostatic chuck for holding a wafer includes a ceramic plate of which one main surface is formed to work as a mounting surface for mounting the wafer, and electrostatic attraction electrodes formed on a lower surface of the ceramic plate or in the ceramic plate. A recess portion having a depth in a range of from 3 to 10 mum is formed on one main surface of the ceramic plate excluding an outer peripheral portion thereof. The waviness of a top face of the outer peripheral portion is set to 1 to 3 mum, a gas groove is provided to a peripheral portion of a bottom surface of the recess-portion bottom surface, and electrostatic attraction electrodes are disposed in the ceramic plate disposed below the bottom surface of the convex portion. In the electrostatic chuck thus constructed, even a wafer having a deformation such as a warped portion can be firmly attracted, a uniform temperature distribution over a wafer surface can be implemented, leakage of a heat-conductive gas can be suppressed, and moreover, high wafer-dechucking sensitivity can be exhibited.

A bipolar electrostatic chuck which has excellent dielectric breakdown strength and provides excellent attracting performance. The bipolar electrostatic chuck eliminates difficulty in dismounting a sample from a sample attracting plane as much as possible after application of a voltage to electrodes is finished. The bipolar electrostatic chuck is provided with a first electrode and a second electrode in an insulator and permits a surface of the insulator to be the sample attracting plane. The insulator has the first electrode, an interelectrode insulating layer and the second electrode in this order from the sample attracting plane in the depth direction. The second electrode has a region not overlapping with the first electrode in a normal line direction of the sample attracting plane.

The present invention generally relates to a refurbished electrostatic chuck and a method of refurbishing a used electrostatic chuck. Initially, a predetermined amount of dielectric material is removed from the used electrostatic chuck to leave a base surface. Then, the base surface is roughened to enhance the adherence of new dielectric material thereto. The new dielectric material is then sprayed onto the roughened surface. A mask is then placed over the new dielectric material to aid in the formation of mesas upon which a substrate will sit during processing. A portion of the new dielectric layer is then removed to form new mesas. After removing the mask, edges of the mesas may be smoothed and the refurbished electrostatic chuck is ready to return to service after cleaning.

An electrostatic chuck device includes a surface to support a substrate, an electrode to generate electrostatic force for the substrate, and a plurality of heaters to heat different regions of the surface. The plurality of heaters include a first heater to heat a first region to a first temperature, a second heater to heat a second region to a second temperature, and a third heater to heat a third region to a third temperature between the first and second temperatures. The second region is closer to a peripheral area of the surface than the first region, and the third region between the first and second regions.