59results about "Electrostatic holding devices" patented technology

A rotatable drum is provided for supporting a substrate. The rotatable drum includes a curved drum surface for supporting the substrate. The curved drum surface includes a dielectric portion and an electrode coupled to a power source. The electrode is electrically coupled to the curved drum surface and capable of chucking and dechucking the substrate from the curved drum surface at one or more circumferential segments of the curved drum surface.

In a ceramic substrate having a ceramic base made of aluminum oxide and a conductive layer embedded in the base, the objective is to achieve both improved adhesion between the base and the conductive layer and a reduction in the resistivity of the conductive layer. [Solution] The ceramic substrate comprises a base body which is a ceramic made of aluminum oxide, and a conductive layer in contact with the base body, wherein the conductive layer includes a first layer which is a fired body mainly composed of metal and containing aluminum oxide, a second layer which is laminated on the first layer and is a fired body mainly composed of metal and not containing aluminum oxide, and a third layer which is laminated on the second layer and is a fired body mainly composed of metal and containing aluminum oxide.

The present invention provides an actuator that can easily adjust the electrostatic stress acting between electrodes. [Solution] The actuator comprises an insulating flexible bag that forms a housing, a liquid dielectric filled inside the flexible bag, a plurality of electrodes arranged on the inner circumferential surface of the flexible bag whose separation distance changes according to the applied voltage, an expansion section in which the liquid dielectric present between the electrodes flows in and expands in volume when the separation distance between the electrodes decreases, and a separator inserted between the electrodes. The separator is in the form of a film with its front and back surfaces facing the electrodes and has through holes that penetrate in the thickness direction. As a result, the applied voltage is directly applied to the capacitor portion where only liquid dielectric is filled between the electrodes, and by adjusting the relative permittivity of the liquid dielectric, the amount of charge induced between the electrodes can be adjusted accordingly.

A method, apparatus, and system for storing a carbon fiber ply. The carbon fiber ply is moved to an electrostatic storage panel. The carbon fiber ply is attached to the electrostatic storage panel using an electrostatic charge generated by the electrostatic storage panel.

The present invention provides an electrostatic chuck having satisfactory electrical characteristics (discharge suppression, electrostatic characteristics, etc.). This electrostatic chuck (10) has a recess (12) in a placement surface (11), and is provided with: one or a plurality of electrodes (13) disposed along the placement surface (11); a base (14); and a dielectric layer (15) in which the electrodes (13) are stacked between the base (14) and the placement surface (11). The electrostatic chuck has a region in which the recess (12) and the electrodes (13) overlap in a plan view as seen from a direction perpendicular to the placement surface (11).

Provided is a substrate support comprising an electrostatic chuck for supporting a substrate and an edge ring, and a base that supports the electrostatic chuck, the electrostatic chuck including: a first region that has a first upper surface and is configured to support a substrate that is placed on the first upper surface; a second region that has a second upper surface, is provided around the first region, and is configured to support an edge ring that is placed on the second upper surface; a first electrode that is provided in the first region and to which a direct-current voltage is applied; a second electrode that is provided under the first electrode and to which a first bias power is supplied; a third electrode that is provided under the second electrode and to which the first bias power is supplied; and a first gas supply path disposed between the second electrode and the third electrode. The substrate support further includes a first power supply path that is in electrical contact with the second electrode and the third electrode to supply the first bias power.

This invention provides a vibration power generation device that can maximize output by automatically adjusting the resonant frequency of the vibration power generation element to follow changes in the frequency of environmental vibrations. [Solution] A vibration power generation device (100) comprising a vibration power generation element (10) having a fixed electrode (12) which is a first electrode, a movable electrode (11) which is a second electrode facing the fixed electrode (12), and an elastic support part (14) which elastically supports the movable electrode (11) with respect to the fixed electrode (12) so that it can move relative to it, and a frequency tracking means that makes the resonance frequency of the vibration power generation element (10) follow the environmental vibration frequency (fe).

The present application provides a kind of to improve the maintenance of support station and substrate processing device.Support station includes: dielectric plate, through hole is formed in outer peripheral portion, the dielectric plate has for supporting substrate substrate support part;Supporting member;1st heat insulating member, it is configured between the dielectric plate and the supporting member;1st force applying member, it is configured between the 1st heat insulating member and the supporting member;And fastening member, it is through the through hole of the dielectric plate, the 1st heat insulating member, the 1st force applying member, while the dielectric plate is detachably fixed to the supporting member.

This invention provides an electrostatic attractor with excellent durability and the ability to reliably attract and hold objects using electrostatic force. An electrostatic attractor and a robotic arm equipped with the attractor are also provided. The electrostatic attractor comprises a laminate containing at least a first soft polymer organic material, an electrode, and a second soft polymer organic material stacked sequentially, and a power supply device for applying voltage to the electrodes. The electrostatic force generated by applying voltage to the electrodes allows the soft polymer organic material to act as a contact surface for attracting and holding the object. The tensile elastic modulus of the first and / or second soft polymer organic materials is 1 MPa or more but less than 100 MPa, and the volume resistivity is 1 × 10⁻⁶. 8 Ω·cm~1×10 13 Ω·cm, the electrode is a conductive fiber structure.

A substrate processing apparatus includes a base plate, an upper plate on the base plate, a DC power supply configured to supply power to the upper plate, and a controller interconnecting the upper plate and the DC power supply. The upper plate includes a first electrode, and a second electrode spaced apart from the first electrode. The controller includes a first controller interconnecting the first electrode and the DC power supply, and a second controller interconnecting the second electrode and the DC power supply. The DC power supply is configured to apply a first voltage to the first electrode via the first controller, and configured to apply a second voltage to the second electrode via the second controller. The first voltage and the second voltage are different.

Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.

To miniaturize a substrate processing apparatus.SOLUTION: A substrate processing apparatus processing a substrate by using plasma, comprises: a chamber in which the substrate is housed; and a mounting table which is arranged in the chamber, and on which the substrate is mounted. The mounting table includes: a base; a substrate holding part; a plurality of heaters; a heater control part; and an RF filter. The base is formed of a conductor, through which as RF power flows. The substrate holding part is provided on the base, and holds the substrate. The plurality of heaters are provided at the substrate holding part. The heater control part is provided inside the base, and controls a power supplied to each of the plurality of heaters. The RF filter is provided at an outer part of the base, and is connected to wiring for supplying the power to each of the heaters. Further, one RF filter is provided for the plurality of heaters in common.SELECTED DRAWING: Figure 3

A substrate processing apparatus includes a lower plate in a chamber, an electrostatic chuck on the lower plate, the electrostatic chuck including a first step surface, an intermediate ring disposed on the first step surface of the electrostatic chuck, a lower ring surrounding a portion of the intermediate ring and an outer sidewall of the electrostatic chuck on the lower plate, an upper ring covering an upper portion of the intermediate ring, a screw extending through the electrostatic chuck into the lower plate, and a socket connected to each of the screw and the intermediate ring. Each of the screw, the socket and the intermediate ring includes a conductor.

An electrostatic chuck is provided. The electrostatic chuck includes a top surface, a side surface, and a bottom surface. The top surface includes multiple regions for discharging one or more cooling gases. At least one of the multiple regions includes a recessed arrangement. The recessed arrangement includes at least a first set of recesses and a second set of recesses. The first and second sets of recesses are concentrically arranged on the top surface. The second set of recesses forms a second annular pattern with a diameter smaller than the diameter of a first annular pattern formed by the first set of recesses. One or more recesses in the first set of recesses partially overlap with two recesses in the second set of recesses radially along the top surface.

Examples of substrate supports are provided herein. In some examples, the substrate support has a ceramic electrostatic chuck having a body. The body has a first side configured to support a substrate and a second side opposite to the first side. The body has a chuck electrode, an active edge electrode positioned adjacent to the chuck electrode, a floating mesh positioned below the chuck electrode, a heater positioned below the floating mesh, and a grounding mesh positioned below the heater, the grounding mesh being adjacent to the second side.

[Problem] To provide a heating device having an electrostatic chucking function, capable of enhancing temperature uniformity of a wafer to be heated. [Solution] A heating device 1 having an electrostatic chucking function includes at least a support base material 2, an electrostatic chucking electrode 4 and a heat generation layer 5 formed on the support base material, and an insulator layer 3 formed on the electrostatic chucking electrode and the heat generation layer. In the heating device, a hole 9 extending from an upper surface of the insulator layer on one side on which a wafer is placed to a lower surface of the insulator layer on the other side is appropriately provided, and the electrostatic chucking electrode extends from a substantially flat portion in a cross-sectional side view on the support base material along a direction toward an inside of the hole or a direction toward a lower side of an outer peripheral side surface of the heating device.

An exemplary semiconductor processing chamber may include a chamber body. The chamber may include a spray head disposed on top of the body. The chamber may include an electrostatic chuck assembly disposed within the body. The assembly may include a disk, the disk may include a first plate comprising an electrically insulating material and defining a substrate support surface. The disk may include a multi-zone heating assembly thermally coupled to the first plate. The disk may include bipolar electrodes. The disk may include a second plate defining a cooling channel. The assembly may include an insulator located below the second plate. The assembly may include a base plate located below the insulator. The assembly may include a shaft, the shaft may include a heater rod coupled to the heating assembly. The shaft may include a cooling fluid cavity fluidly coupled to the cooling channel. The shaft may include a power rod electrically coupled to the bipolar electrodes.

A method of preparing an electrostatic platen is disclosed. At high temperatures, some low friction coatings, such as diamond like carbon (DLC), become conductive. The methods described allow the deposition of a limited amount of DLC to those regions of the electrostatic platen that contact the workpiece. By limiting the amount of DLC applied to the electrostatic platen, the clamping force experienced by the workpiece is minimally affected by the increased conductivity of the DLC at elevated temperatures. The DLC is applied to embossments that extend upward from the flat surface of the electrostatic platen.

A substrate support according to the present invention includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is disposed in a manner surrounding the first region and is configured to hold a edge ring placed thereon. The first electrode is disposed within the first region and is configured to receive a first electrical bias. The second electrode is disposed at least within the second region and is configured to receive a second electrical bias. The second electrode extends below the first electrode in a manner opposing the first electrode within the first region.

This invention provides a technology for continuously performing stable plasma treatment on a substrate being held in a holding device. [Solution] The holding device comprises a substrate base formed in the shape of a plate from ceramics and having a mounting surface on which a substrate is placed; a focus ring base formed in the shape of a ring from ceramics and positioned on the outer circumference of the substrate base; a base having a first joining surface to which the substrate base is joined, a second joining surface to which the focus ring base is joined, and an intermediate portion located between the first joining surface and the second joining surface; and an insulating portion formed from ceramics and positioned in the gap formed between the substrate base and the focus ring base to cover the intermediate portion.

A wafer placement table includes: a ceramic substrate that has a wafer placement surface at an upper surface of the ceramic substrate; an electrode that is incorporated in the ceramic substrate; and an electrically conductive electrode extraction portion that is incorporated in the ceramic substrate and is electrically connected to the electrode. A volume content percentage of a ceramic material that is identical to a main component of the ceramic substrate is high in the electrode extraction portion compared with the electrode.