712results about "Electrostatic holding devices" patented technology

To provide an electrostatic chuck capable of suppressing the occurrence of discharge in a gas groove.SOLUTION: An electrostatic chuck 10 includes a first portion 101 including a surface 110 on which a substrate W is placed, a second portion 102 protruding further outward from the outer peripheral edge of the first portion 101 and being thinner than the first portion 101, an internal electrode 140 provided inside the second portion 102, and a gas groove 181 formed on a surface 180 of the second portion 102. In a top view, the gas groove 181 is formed at a position that does not overlap the internal electrode 140.SELECTED DRAWING: Figure 1

Disclosed are an electrical feedthrough connector, a substrate support assembly, and a method for feeding electrical signals to a processing chamber. The electrical feedthrough connector includes a first receptacle including a first electrical socket; an interface body, and a second receptacle including a second electrical socket. The interface body includes a first side, a second side, and a solid part disposed between the first side and the second side. The first side is coupled with the first receptacle, and the second receptacle is coupled with the second side. The solid part includes a conductive path embedded in a plurality of dielectric layers; and the conductive path is configured to provide an electrical connection between the first electrical socket and the second electrical socket. The substrate support assembly includes the electrical feedthrough connector. The method utilizes the electrical feedthrough connector to provide electrical signals to electrodes of an electrostatic chuck.

An adaptive wearable article can include an electroadhesive clutch secured to a textile and extending around at least a portion of an opening. The clutch can include a first conductive member and a first polymeric substrate applied to the first conductive member and having a stiffness greater than a stiffness of the first conductive member, and the clutch can include a second electrode assembly comprising a second conductive member configured to partially overlay the first conductive member. The second electrode assembly can include a second conductive member and a second polymeric substrate applied to the second conductive member, the second polymeric substrate having a stiffness greater than a stiffness of the second conductive member, wherein the first and second conductive members are proximate each other with the first and second polymeric substrates distal with respect to each other.

A power tool includes an electrostatic clutch assembly disposed between a motor and an end effector. A control circuit causes a first voltage to be applied to a first electrode of the electrostatic clutch assembly and a second voltage to be applied to a second electrode of the electrostatic clutch assembly, the first voltage being different from the second voltage, generating a first attractive force between the first and second electrodes, causing a shaft and a clutch housing to be coupled to each other when a torque on one of the shaft or the clutch housing is less than or equal to a first threshold value, and allowing the one of the shaft or the clutch housing to rotationally slip relative to the other of the shaft or the clutch housing when the torque on the one of the shaft or the clutch housing exceeds the first threshold value.

To provide an electrostatic chuck that can prevent a variation in the in-plane temperature distribution of a substrate during processing.SOLUTION: An electrostatic chuck 10 comprises a dielectric substrate 100, an attraction electrode 130 provided inside the dielectric substrate 100, and an RF electrode 140 provided inside the dielectric substrate 100. In a top view, the RF electrode 140 is provided within a range where its outer peripheral side end is located inside an outer peripheral side end of the attraction electrode 130.SELECTED DRAWING: Figure 2

A rotatable drum is provided for supporting a substrate. The rotatable drum includes a curved drum surface for supporting the substrate. The curved drum surface includes a dielectric portion and an electrode coupled to a power source. The electrode is electrically coupled to the curved drum surface and capable of chucking and dechucking the substrate from the curved drum surface at one or more circumferential segments of the curved drum surface.

An electrostatic chuck device is provided with: an electrostatic chuck member containing a ceramic material; a susceptor containing silicon carbide as a material; and a bonding layer comprising a metal material and bonding the electrostatic chuck member and the susceptor, in which the electrostatic chuck member contains 50 vol% or more of alumina when the entire electrostatic chuck member is 100 vol%, and the susceptor contains 75 vol% or more and 100 vol% or less of silicon carbide when the entire susceptor is 100 vol%.

A wafer mounting table 10 comprises: a ceramic plate 20 that has a wafer mounting surface 21 on the upper surface thereof and in which an electrostatic electrode 22 is installed; a cooling plate 30 that is provided on the lower surface of the ceramic plate 20; and a refrigerant flow passage 32 that is provided inside the cooling plate 30. The cooling plate 30 has a plurality of upper and lower cooling plate layers 31U and 31L arranged in the vertical direction. The upper cooling plate layer 31U and the cooling plate layer 31L having a vertical relationship therebetween are bonded by a partition plate 34. Sections of the refrigerant flow passage 32 excluding an inlet 32a and an outlet 32b are divided into two levels in the vertical direction by the partition plate 34.

To provide an electrostatic chuck and a substrate fixing device for further suppressing occurrence of abnormal discharge.SOLUTION: A substrate fixing device 1 includes an electrostatic chuck 30 having: a substrate 31 in which one face serves as a mounting surface of an adsorption object; and a gas hole 33 which is a through-holes penetrating the substrate. A porous body 60 containing angular ceramic particles is disposed in the through-hole. The substrate and the angular ceramic particles contain same oxide ceramics. The oxide ceramics is alumina. Furthermore, the substrate and the porous body contain an oxide of at least 2 kinds of same elements, and the composition ratio of the oxide in the substrate is set equal to the composition ratio of the oxide in the porous body.SELECTED DRAWING: Figure 1

To provide a holding device capable of improving a processing speed in an outer peripheral area of a target to be held.SOLUTION: In an electrostatic chuck 1 comprising a tabular member 10, a base member 20 and a junction layer 30 joining the tabular member 10 and the base member 20, the tabular member 10 includes an inside part 10a in a central part in a surface direction and an outside part 10b in an outer peripheral part in the surface direction. The junction layer 30 includes a first junction layer 30a, which is disposed between the inside part 10a of the tabular member 10 and the base member 20, and a second junction layer 30b which is disposed between the outside part 10b of the tabular member 10 and the base member 20. A total value of thermal resistance in the outside part 10b of the tabular member 10 and thermal resistance in the second junction layer 30b is smaller than a total value of thermal resistance in the inside part 10a of the tabular member 10 and thermal resistance in the first junction layer 30a.SELECTED DRAWING: Figure 2

A method for bonding components of an electrostatic chuck includes applying a first melting point depressing layer (MDL) to a bottom surface of a first puck plate. A second MDL is applied to a top surface of a second puck plate. The first puck plate, and the second puck plate are heated to a temperature at or near the eutectic temperature of the first MDL or the second MDL, to thermally bond the first puck plate and the second puck plate.

To provide an electrostatic chuck capable of suppressing variation in in-plane temperature distribution of a substrate during a process.SOLUTION: An electrostatic chuck 10 includes a dielectric substrate 100, an RF electrode 140 provided inside the dielectric substrate 100, a base plate 200 formed of metal and bonded to the dielectric substrate 100, and a plurality of connection members 400 electrically connecting the RF electrode 140 and the base plate 200. The dielectric substrate 100 includes a plurality of gas holes 114 in a top view. The connection members 400 and the gas holes 114 are arranged alternately in a circumferential direction.SELECTED DRAWING: Figure 2

An electrostatic chuck according to the present disclosure includes a plate-shaped body including an adsorption surface for mounting a workpiece, a base, and an electrode film located between the plate-shaped body and the base. The plate-shaped body and the base are made of sapphire. The angle between the adsorption surface and the c-plane of the sapphire is 45° or more.

An electrostatic chuck includes a dielectric substrate, an RF electrode provided inside the dielectric substrate, and a base plate made of metal and joined to the dielectric substrate. The dielectric substrate includes a protrusion section protruding outward beyond a surface of the base plate in top view, and a part of the RF electrode is provided in the protrusion section.

Disclosed are a susceptor for enabling uniform plasma treatment over the entire surface of a wafer, and a manufacturing method therefor. Provided is the susceptor comprising: a dielectric plate having an upper surface on which a wafer is loaded, and a lower surface facing same; and an inner RF electrode and an outer RF electrode that are buried in the dielectric plate, wherein, with respect to the lower surface, the height of a first plane in which the inner RF electrode is buried is less than the height of a second plane in which the outer RF electrode is buried.

To provide an electrostatic chuck capable of suppressing variation in in-plane temperature distribution of a substrate during processing.SOLUTION: An electrostatic chuck 10 includes a dielectric substrate 100 and a base plate 200 that supports the dielectric substrate 100. The base plate 200 is formed with a coolant flow path 260 through which a coolant passes, and a through hole 230. In top view, the coolant flow path 260 includes a branching portion 263 where the flow path branches into a first flow path 261 and a second flow path 262, and a merging portion 264 where the first flow path 261 and the second flow path 262 merge again. The through hole 230 is formed so as to penetrate a portion of the base plate 200 located between the first flow path 261 and the second flow path 262.SELECTED DRAWING: Figure 3

The present invention provides an electrostatic chuck that can be easily manufactured, while having a configuration in which the internal electrodes of a dielectric substrate and the base plate are electrically connected by a conductive material. [Solution] The electrostatic chuck 10 comprises a dielectric substrate 100, an RF electrode 140 provided inside the dielectric substrate 100, a base plate 200 made of metal and bonded to the dielectric substrate 100, and a conductive member 400 that electrically connects the RF electrode 140 and the base plate 200. A first recess 160 is formed on the surface 120 of the dielectric substrate 100 facing the base plate 200, which accommodates a part of the conductive member 400. A second recess 260 is formed on the surface 210 of the base plate 200 facing the dielectric substrate 100, which accommodates a part of the conductive member 400. In a top view, one of the first recess 160 and the second recess 260 is larger than the other.

A wafer mounting stand 10 comprises: a ceramic plate 20 which includes a wafer mounting surface 21 on the upper surface thereof; a gas passage 52 through which gas can pass in the vertical direction of the ceramic plate 20; a conductive base plate 30 which is joined to the lower surface of the ceramic plate 20 and is utilized as a plasma generation electrode; and a gas supply path 34 which is provided inside of the base plate 30 and communicates with the gas passage 52. The wafer mounting stand 10 also comprises an electric field adjusting conductor 60. The electric field adjusting conductor 60 is provided so as to extend, from the lower surface of the ceramic plate 20 or a position below the lower surface to an area in front of the wafer mounting surface 21 in the vertical direction in the vicinity of the gas passage 52, and is electrically connected to the base plate 30.

To provide a susceptor that controls the temperature of a substrate in a processing chamber to avoid defects.SOLUTION: A substrate support assembly 100 includes a metal matrix composite (MMC) susceptor body 110 that supports a substrate in a processing chamber. The MMC susceptor body forms one or more channels 112 that receive a heat transfer fluid. The heat transfer fluid heats the substrate during idle conditions of the processing chamber and cools the substrate during active conditions of the processing chamber.SELECTED DRAWING: Figure 1

Provided is an electrostatic chuck capable of performing precise temperature adjustment by a heater. An electrostatic chuck 10 comprises a dielectric substrate 100 and a heater unit 300 that heats the dielectric substrate 100. In a top view, the heater unit 300 has heating parts 331 that are respective conductors routed individually and linearly in a plurality of regions HA divided so as not to overlap each other. The plurality of regions HA include a first region HA1 disposed at a position on the outermost peripheral side, and a second region HA2 disposed at a position on the inner peripheral side of the first region HA1. The line width of the heating part 331 routed in the first region HA1 is smaller than the line width of the heating part 331 routed in the second region HA2.

A sample holder according to one embodiment comprises a ceramic body, a base member, a bonding material, and a first conductive film. The ceramic body has a first surface, which is a sample holding surface, and a second surface that is positioned on the reverse side of the first surface. In addition, the ceramic body has an internal electrode. The base member is conductive. The bonding material is positioned between the ceramic body and the base member. The first conductive film has a lower volume resistivity than the ceramic body, and is positioned so as to extend from at least a part of the outer surface of the ceramic body to at least a part of the outer surface of the base member.

A method and system for managing adhesion between a sheet of material and an electrostatic pad. The method includes applying a voltage across the electrostatic pad to establish a baseline voltage level thereacross and to generate an electrostatic potential across the electrostatic pad, bringing the electrostatic pad near or into contact with the sheet so that the sheet electrostatically adheres to the electrostatic pad, and monitoring a capacitance between the sheet and the electrostatic pad. If a drop in the capacitance occurs that is below a predetermined capacitance limit, then the voltage is increased to an elevated voltage level so as to increase the electrostatic adhesion between the electrostatic pad and the sheet. The system includes a voltage module, a monitoring module and a control module.

The purpose of the present invention is to provide a technique capable of grasping the surface state of a sample stage and diagnosing the occurrence of an abnormality.　In order to provide the technique, the diagnostic device according to the present invention which diagnoses the presence or absence of an abnormality of a sample stage on which a sample is placed is characterized in that: the presence or absence of the abnormality of the sample stage is determined on the basis of a time constant in a transient change in the current when static elimination processing is performed; the static elimination processing is processing for detaching, from the sample stage, the sample electrostatically adsorbed on the sample stage; and the current is a current flowing through the sample stage when a voltage for electrostatically adsorbing the sample onto the sample stage is applied to the sample stage.

To provide an electrostatic chuck that can suppress variations in the in-plane temperature distribution of a substrate during processing.SOLUTION: An electrostatic chuck 10 includes a dielectric substrate 100 and a base plate 200 joined to the dielectric substrate 100. The base plate 200 has a coolant channel 250 through which a coolant flows, and a lift pin hole 260 formed therein. A protrusion 270 for generating turbulent flow in the coolant flow is provided in the portion of the coolant channel 250 near the lift pin hole 260.SELECTED DRAWING: Figure 4

A plasma processing apparatus includes a plasma processing chamber; an electrostatic chuck disposed in the plasma processing chamber, the electrostatic chuck including a dielectric member including a substrate support surface and a ring support surface, and chuck electrodes disposed under the substrate support surface and the ring support surface in the dielectric member; and an alternating current voltage generator that applies AC voltages to the chuck electrodes disposed under the ring support surface, the AC voltages being phase-shifted relative to each other. The chuck electrodes disposed under the ring support surface include one chuck electrode and another chuck electrode that include arc portions. The arc portions of the one chuck electrode and the another chuck electrode are arranged alternately in a radial direction. The chuck electrodes disposed under the substrate support surface have a spiral shape and the chuck electrodes disposed under the ring support surface have a nested structure.

To provide a technique for mitigating the influence of a phase difference between the electric bias for a substrate and the electric bias for an edge ring on plasma processing.SOLUTION: A board support according to an embodiment includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold the substrate mounted on the first region. The second region is provided so as to surround the first region and is configured to hold an edge ring mounted on the second region. The first electrode is provided in the first region to receive first electrical bias. The second electrode is provided at least in the second region to receive second electrical bias. The second electrode extends below the first electrode so as to face the first electrode in the first region.SELECTED DRAWING: Figure 1

The wafer mounting table 10 includes a ceramic plate 20 having a plug 50 through which gas can pass in the vertical direction, a conductive plate 30 incorporating a gas inlet channel 34, and a resin layer 40 bonding the two together. A resin layer through-hole 42 is provided in the resin layer 40 at a position facing the plug 50 and is larger than the plug 50 in a plan view. The gas inlet channel 34 communicates with the plug 50 via the resin layer through-hole 42. A conductive film 60 is provided on the underside of the ceramic plate 20 at a position facing the resin layer through-hole 42 and is larger than the resin layer through-hole 42 in a plan view, allowing gas to flow from the gas inlet channel 34 to the plug 50. A contact member 70 is provided in the gas inlet channel 34, electrically connecting the conductive film 60 and the conductive plate 30 and allowing gas to flow from the gas inlet channel 34 to the plug 50.

To provide an electrostatic chuck capable of easily realizing electrical connection between an internal electrode and a power supply terminal.SOLUTION: The electrostatic chuck 10 includes a dielectric substrate 100, an RF electrode 140 provided inside the dielectric substrate 100, a power supply terminal 170 disposed inside a recessed part 160 formed on a surface 120 opposite to a mounting surface of the dielectric substrate 100, and a connection part 190 electrically connecting the RF electrode 140 and the power supply terminal 170. The connecting portion 190 extends from the bottom surface 161 of the recessed portion 160 toward the placement surface side, and extends to a position closer to the placement surface side than the RF electrode 140.SELECTED DRAWING: Figure 1

To provide a retainer capable of improving the uniformity in in-plane temperature of an object being retained.SOLUTION: An electrostatic chuck 1 which has a plate-like member 10 having a retention surface 11 where a plurality of projection parts 16, 17 and 30a are formed and a reverse surface 12 provided on the opposite side from the retention surface 11, and retains a semiconductor wafer W on the retention surface 11 of the plate-like member 10 has, on bottom surfaces 18a of the recessed pars 18 other than the projection parts 16, 17 and 30a on the retention surface 11, first regions 181 at distances larger than a predetermined distance A from bottom part side faces BS of the projection parts 16, 17 and 30a and second regions 182 at distances equal to or less than the predetermined distance A from the bottom part side faces BS of the projection parts 16, 17 and 30a, the first regions 181 being larger in surface roughness than the second regions 182.SELECTED DRAWING: Figure 4