Electrostatic chuck device

a technology of electrostatic chuck and chuck body, which is applied in the direction of electrostatic holding device, metal-working machine components, manufacturing tools, etc., can solve the problems of affecting the performance of the electrostatic chuck device, and achieve the effect of prolonging the li
US20180254211A1Active Publication Date: 2018-09-06SUMITOMO OSAKA CEMENT CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
SUMITOMO OSAKA CEMENT CO LTD
Publication Date
2018-09-06

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Abstract

An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.
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Description

TECHNICAL FIELD

[0001] The present invention relates to an electrostatic chuck device.

[0002] This application claims the right of priority based on Japanese Patent Application No. 2015-168230 filed on Aug. 27, 2015, the entire content of which is incorporated herein by reference.BACKGROUND ART

[0003] In a semiconductor manufacturing apparatus, in the past, as a device for simply mounting and fixing a plate-shaped sample such as a wafer or a glass substrate to a sample stage, an electrostatic chuck device using an electrostatic attraction mechanism has been used. As the configuration of the electrostatic chuck device of the related art, there is known a configuration having an attraction plate having a structure in which an electrode is buried in a dielectric body, and a support body for supporting the attraction plate through an adhesive. In such an electrostatic chuck device, the adhesive is etched by plasma or the like which is used in a semiconductor manufacturing process, and thus th...

Claims

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