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2133 results about "Ground line" patented technology

Dipole antenna of RF chip

The invention discloses a dipole antenna of an RF chip, comprising two metal sheets, a feeder line and an earth wire, wherein two tabulate metal sheets are mutually parallel and are both provided with short circuit points which are respectively used for connecting the feeder line and the earth wire. The dipole antenna of the RF chip of the invention integrates novel artificial electromagnetic materials, thus the dipole antenna has abundant chromatic dispersion characteristics so as to form various radioactive modes, which not only can avoid fussy impedance matching network, but also can tune by adjusting a feeder line feeding and coupling mode, an earth wire accessing mode, the topological structure of metal microstructure, the position of metalizing through holes as well as the short circuit point position among the feeder line, the earth wire, an upper layer of sheet metal and a lower layer of sheet metal, thus providing great convenience for multiple frequency point impedance matching; meanwhile, the dipole antenna of the invention adopts a chip mode to fully utilize radiating area to approach to the Chu Limit antenna dimension limit principle, the construction of double chips also brings technical advantages for limiting electromagnetic wave and reducing effect on antenna operation by the outside.
Owner:KUANG CHI INST OF ADVANCED TECH

Process for Making a Multilayer Circuit Device Having Electrically Isolated Tightly Spaced Electrical Current Carrying Traces

A process for making a multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces, comprising of providing an insulative substrate having a first side coated with a layer of conductive metal intended to form a ground plane; providing a plurality of seed layer traces of a predetermined width of approximately 25 microns or less separated from each other by a predetermined distance of approximately 25 microns or less on a second side of the insulative substrate, the narrowness of such separation being essentially limited only by characteristics of the photoresist material to be deposited and developed therebetween and to withstand subsequent processing; developing ribs or barriers of photoresist forming vertical walls rising above the spaces separating the seed layer traces and defining valleys or channels thereover; depositing a desired thickness of conductive material over the seed layer traces and in the valleys or channels between the vertical walls; stripping away the resist ribs or barriers to leave conductive traces to be variously used as ground lines, signal lines and power lines; repeating the previous steps to develop a plurality of circuit boards; stacking the several circuit boards and joining them together with layers of insulative material; identifying particular ones of the traces as signal lines and other traces as power lines and/or ground lines; interconnecting at least some of the ground lines on one board to ground lines and/or ground planes on other boards by conductors extending through vias; interconnecting signal lines to signal input and output terminals; and perhaps to signal lines on other boards through vias; and interconnecting power lines to power input and output terminals, and perhaps to power lines on other boards through vias.
Owner:VERTICALTEST

Structure of multi-tier wire bonding for high frequency integrated circuit

A multi-wire wire-bonding structure suitable for a high frequency signal comprises a first electronic device, a second electronic device, a chip pad and a plurality of metal wires. The first electronic device is attached to the second electronic device with the chip pad. As a result, the first electronic device and the second electronic device form a stair-like structure. A plurality of bonding pads comprises at least one signal bonding pad and grounded bonding pads. The signal bonding surface is surrounded by the ground bonding pads. All the bonding pads are located at the surface of the first electronic device. The chip pad carries the first electronic device and the exceeding part is a ring grounded bonding pad which surrounds the first electronic device. The second electronic device carries the chip pad and a margin of the second electronic device is exceeding the chip pad. There are several leads on the margin of the second electronic device in corresponding to the ground bonding pads and the signal bonding pad. Metal wires comprise a signal wire and grounding wires. The bonding pads of the first electronic device are classified as the first row bonding pads which is close to the ring ground bonding surface and the second row bonding pads which is away from the ring ground bonding surface. The signal wire electrically connects to the signal bonding pads and the corresponding lead. The ground wires electrically connect to the first row bonding pads and the ring ground bonding surface.
Owner:VIA TECH INC

Electrostatic spinning device for preparing directional arrangement nano fiber

The invention relates to an electrostatic spinning device which is used for preparing direction arrangement nanofibers. The device comprises a high voltage source, an injector, an ejector jet pump which pushes the injector and a gathering unit, wherein, the high voltage source which is connected with the position of an injector pinhead is anode; the gathering unit which is ground connection by an earth wire is cathode; the device is characterized in that the gathering unit is an open fiber gathering device which consists of two parts of a performance element and a control unit; wherein, the performance element is an open roller which is formed by a centre pivot and a copper pipe which is parallel to the centre pivot, the two ends of the copper pipes are fixed on the periphery of an aluminum subpanel; the roller has a copper centre pivot; the control unit comprises a driving motor and a rotary speed controller; the motor drives the roller to rotate by a shaft joint; the motor shields the disturbance of electric field by a shield cover; the rotary speed controller controls the rotate speed of the motor, and the rotate speed is 800-1000rpm; the performance element and the control unit are all supported by a PVP plate. The produced nanofibre has the advantages of good order and thick film, and is suitable for biomedicine support materials.
Owner:CHONGQING UNIV
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