7 results about "Metal microstructure" patented technology

The application relates to the technical field of infrared stealth, precise thermal control and electromagnetic compatibility, and particularly discloses a film system structure with visible ultra-high reflectivity, middle-infrared and far-infrared low emissivity and microwave high permeability; the medium stack layer has high reflectivity to visible light; the metal microstructure layer has low emissivity to middle-infrared and far-infrared light and high permeability to microwaves; the film system structure has visible light reflectivity greater than 60%, middle-infrared and far-infrared light emissivity lower than 30% and microwave permeability higher than 60%. The application realizes perfect compatibility of infrared stealth and microwave absorption, keeps infrared low emissivity (epsilon < 0.1) and realizes high permeability (greater than 95%) to 1-18GHz microwave bands. The application solves the thermal failure problem of the composite stealth structure, realizes average visible light reflectivity (greater than 95%) through the medium stack layer, greatly reduces the solar heat load and improves the overall optical performance.

A method, program, and apparatus for creating a metal material microstructure analysis model capable of automatically calculating the characteristic quantities of particles constituting the structure of a metallic material are provided. [Solution] The method for creating a metal material microstructure analysis model is a method for creating a metal material microstructure analysis model that automatically performs phase classification to analyze the structure of a metal material, and includes: an acquisition step (S1) for acquiring characteristic values ​​and manufacturing conditions of the metal material; a determination step (S2) for determining acquisition conditions for acquiring a microstructure image of the metal material; an adjustment step (S4) for adjusting a microstructure image that satisfies the determined acquisition conditions so that the peak, minimum, and maximum values ​​of the brightness distribution fall within a predetermined grayscale range; and a model creation step (S5) for creating a metal material microstructure analysis model in which the characteristic quantities of particles in the adjusted microstructure image are the objective variables and the acquired characteristic values ​​and manufacturing conditions of the metal material are the explanatory variables.

The application discloses a terahertz super surface device based on a Babinet complementary structure and belongs to the technical field of terahertz functional devices. The terahertz super surface device comprises a dielectric substrate layer, the top of the dielectric substrate layer is provided with a metal microstructure, the metal microstructure comprises a plurality of periodically arranged Babinet complementary resonance units, a single Babinet complementary resonance unit comprises two metal ring resonators with different radii or corresponding complementary hollow ring resonators. Through the regulation of the symmetry breaking degree of the Babinet complementary resonance unit, continuous regulation from ideal continuous domain bound state to quasi-continuous domain bound state is realized, the quality factor can be flexibly adjusted in a wide range according to the breaking parameter, and the device has polarization-dependent complementary electromagnetic response. The application has the advantages of simple structure, easy processing and low insertion loss and can be widely used in the fields of terahertz sensing, filtering, polarization regulation and the like.

This invention relates to the field of electromagnetic wavefront modulation functional devices. It discloses a three-dimensional far-field beamforming encoding and modulation structure for terahertz waves, comprising a composite microstructure arranged in a rectangular pattern on a two-dimensional plane, consisting of a substrate, a metal base plate, a metal microstructure, and a HEMT. The key feature is that the metal microstructure and HEMT are located on the substrate surface. The metal microstructure is a notched ring, and the HEMT is placed at the notch. The HEMT consists of a gate lead, a hetero-doped structure, a source electrode, and a drain electrode. This invention employs a two-dimensional digitally independently encoded and modulated composite microstructure array unit to generate changes in reflection amplitude and phase, ultimately achieving three-dimensional far-field beamforming encoding and modulation. It possesses high beamforming freedom, real-time beamforming capability, and is small in size and thin in thickness.

The application relates to the technical field of non-contact optical precision measurement, and provides a variable annular light field illumination system based on critical illumination to solve the problems of difficult illumination of inner walls and interference of stray light on outer surfaces in non-contact measurement of metal microstructure features. Light emitted by a light source first passes through a collimating lens to form parallel light, then passes through two conical lenses with specific distances to form annular light which is scattered on ground glass, the scattered light passes through a diaphragm for shaping, then passes through a collimating lens to form parallel light again, and finally passes through a reflecting mirror and a beam splitter to be focused on an objective lens and a working plane, i.e. a to-be-measured object. The variable illumination light field can fully illuminate the inner walls of micro-holes, and in addition, by adjusting the conical lenses, the illumination system can adapt to most non-contact measurement scenes of microstructure features, thereby providing technical support for the field of non-contact optical precision measurement.

The cold-rolled steel sheet of the present invention has a specified chemical composition. The microstructure at a position (t / 4 portion) on the thickness direction, at a distance of 1 / 4 of the sheet thickness t from the surface, contains, by volume percentage, 2.0% to 8.0% retained austenite, 80.0% to 98.0% tempered martensite, 0.0% to 15.0% ferrite and bainite combined, and 0.0% to 5.0% martensite. This composition is present at both the central portion and at a distance of 50 mm from the end in the width direction. In which part of the edge, the metal microstructure at a position 20 μm from the surface in the thickness direction of the plate (i.e., the 20 μm portion) contains, by volume percentage, 75.0% or more and 100.0% or less of ferrite and bainite, and 0.0% or more and 25.0% or less of martensite and tempered martensite. Furthermore, the metal microstructure at a position 75 μm from the surface in the thickness direction of the plate (i.e., the 75 μm portion) contains, by volume percentage, 0.0% or more and 15.0% or less of ferrite and bainite.