Device and method for measuring three-dimensional distribution of residual stress in metal microstructure

Abstract

The invention discloses a device for measuring three-dimensional distribution of residual stress in a metal microstructure, which comprises an X-ray generating system, a microdiffraction and light path guide system, a work system, a detection system, a computer and a control system; the X-ray generating system generates X-rays with short wavelengths; the X-rays irradiate on points to be measured on a metal microstructural sample to be measured in the work system through the microdiffraction and light path guide system; then the X-rays enter the detection system through the microdiffraction and light path guide system after being subjected to diffraction by the sample; the detection system receives the X-rays entering the detection system for detection and sends obtained detection data to the computer; the computer takes analysis process on the received detection data to obtain residual strain and residual stress data of the point to be measured of the metal microstructral sample and take error analysis and parameter amendment; and after the test for the current point is finished, the computer sends a command to the control system for changing the detection point of the sample. According to the invention, the three-dimensional distribution of the residual strain and the residual stress in the penetrating range of the X-ray in a metal microstructure can be measured automatically and factually in a lossless way; therefore, the device provided by the invention is efficient and lossless and is convenient to operate.

Description

technical field [0001] The invention relates to the field of micro-electromechanical system strengthening treatment and laser technology application, in particular to a method and device for controlling the residual stress level on the surface of metal micro-structures. Background technique [0002] With the deepening of the research and application of microelectromechanical systems (MEMS), the failure and reliability issues related to it have attracted more and more attention. In MEMS, key microstructures such as micro-beams, micro-electric combs, micro-gears, micro-switches, micro-channels and micro-nozzles are often included. It can easily lead to its deformation, fracture, wear and pitting, and cause the failure of the microstructure, which will lead to the failure of the entire system, greatly reducing the life and reliability of MEMS devices. How to improve the fatigue life, wear resistance and corrosion resistance of these metal micro-components, and then improve the...

AI Technical Summary

Problems solved by technology

Delamination will cause the release of residual stress. For workpieces with simple shapes such as cylinders and cylinders, the residual stress delamination correction can be performed according to a certain formula, but this correction cannot be performed for workpieces with complex shapes.

Delamination measurement, not only heavy workload, poor measurement accuracy, but also a destructive measurement method

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