Preparation method of printed circuit board with metal micro heat sink

A technology for printed circuit boards and heat sinks, which is applied in the field of preparation of printed circuit boards, and can solve problems such as limited heat transfer capacity and low heat transfer capacity

Active Publication Date: 2011-12-21
RAYBEN TECH ZHUHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]The traditional printed circuit board adopts hole metallization structure, the insulating material between layers is FR4 material, its thermal conductivity is 0.4W / mk, and the transmission Low thermal capacity; metal-based circuit boards developed in recent years, the thermal conductivity of insulating materials between layers is 1.3-2.2W / mk, and the heat transfer capacity is still limited

Method used

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  • Preparation method of printed circuit board with metal micro heat sink
  • Preparation method of printed circuit board with metal micro heat sink

Examples

Experimental program
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Effect test

Embodiment approach

[0036] figure 1 A kind of preferred embodiment of the preparation method of shown printed circuit board with metal micro radiator comprises the following steps:

[0037] S1, prepare an integrally formed metal layer, the metal layer includes a metal bottom layer 10 and one or more protrusions of columnar structures located on one surface of the metal bottom layer, the metal bottom layer is the metal bottom layer 10 of the printed circuit board, The one or more protruding parts are metal micro radiators 40;

[0038] S2. Provide a single-sided or double-sided copper-clad insulating board, which is cut into a printed circuit board according to the predetermined size, and adopts the method of hole metallization and pattern transfer of the traditional printed circuit board on the first layer of the copper-clad insulating board. Metallized holes (not shown in the figure) and copper layer lines 30 of conventional printed circuit boards are made on the copper surface, that is, insulat...

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PUM

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Abstract

The invention provides a manufacturing method of a PCB (Printed Circuit Board) with a metal micro-radiator. The manufacturing method comprises the following steps of: manufacturing a conventional PCB, manufacturing a metal bottom layer and a metal micro-radiator which are connected into a whole, and integrating the conventional PCB with the metal bottom layer and the metal micro-radiator. According to the manufacturing method disclosed by the invention, the metal micro-radiator with high heat conductivity is integrated with the conventional PCB, and heating elements, such as LEDs (Light Emitting Diode) and the like, can be arranged on the surface of the metal micro-radiator, thus the heat radiated from the heating elements during operation can be conducted to the metal bottom layer through the metal micro-radiator, and then is conducted to the outside of the PCB through the metal bottom layer; therefore, the problem of heat conduction between the heating elements and a metal board is effectively solved through the metal micro-radiator. The PCB (Printed Circuit Board) with the metal micro-radiator is an ideal carrier plate for the heating elements and arrays of the heating elements.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for preparing a printed circuit board with a metal micro radiator. Background technique [0002] Printed Circuit Board (PCB) is one of the important components of the electronics industry. PCB can provide fixed and assembled mechanical support for electronic components, and can realize electrical connection between electronic components. In addition, the component numbers and some graphics are printed on the PCB, which provides convenience for component insertion, inspection and maintenance. Almost every kind of electronic equipment, ranging from electronic watches and calculators to large computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed circuit boards are used for the electrical interconnection between them. [0003] The traditional printed circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/30H05K7/20
Inventor 王征罗苑李保忠
Owner RAYBEN TECH ZHUHAI
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