The invention provides a low-profile dual-polarized magnetoelectric
dipole antenna which is realized on the basis of a standard multilayer PCB (
Printed Circuit Board) technology, the antenna is realized by stacking
antenna array elements on a standard multilayer PCB, and the
antenna array elements are of nine-layer structures which are sequentially arranged from top to bottom; the
antenna array element is composed of a top
metal layer, two cross-polarized electric dipoles, a
magnetic dipole, a through hole, a defected
ground plane (DGS), an iron core, a prepreg plate layer, a feed unit and a
ground plane layer. The antenna is thin in thickness, balanced in structure, light in weight, easy to manufacture and high in yield.
High isolation between the elements can generate high
beam scanning performance. The method is very suitable for a packaging technology and a standard PCB technology, and is an attractive candidate for
millimeter wave application in a
fifth generation (5G) mobile
system. The designed low-profile dual-polarization magnetoelectric
dipole antenna is simulated, and the result shows that the two polarization
radiation modes of the infinite array uniformly cover the
light beam steering range, and blind spots do not appear in the
phased array.