The invention discloses a
copper-
nickel-gold bump production process based on a display driving
chip. The
copper-
nickel-gold bump production process comprises the following steps: S1, carrying out pre-cleaning treatment on a
wafer; s2, opening the
passivation layer to
expose the bonding pad, and
etching the
wafer to form a counter bore; s3, the counter bores are filled with
metal; s4, performing a yellow light process on the
wafer, and forming a front rewiring layer on the wafer; s5,
thinning the wafer to
expose the counter bore to form a through hole; s6, performing UBM on the surface of the wafer, and forming a bump metallization layer on the rewiring layer; s7,
electroplating the outer surface of the wafer to form an electroplated layer; s8, removing the bump metallization layer, which is not shielded by the electroplated layer, on the surface of the wafer; and S9,
backflow and shaping of the bump. According to the production process of the wafer bump, the problem of
adhesive tape residue can be effectively solved, the residual
adhesive tape can be effectively removed, meanwhile, the problem of
metal residue at the edge of the wafer can be effectively solved, and the problems of
short circuit, packaging reliability reduction or follow-up process
pollution can be avoided.