62results about How to "Highly compliant" patented technology

A surgical access device includes a seal housing and a roller disposed in the housing and defining a working channel. The roller may be stationary or moveable within the seal housing to form both a zero seal in the absence of an instrument, and an instrument seal in the presence of an instrument. Rotation of the roller is contemplated and low-friction surfaces are discussed to reduce instrument insertion forces. Multiple rollers, wiper elements, low-friction braid, pivoting elements and idler rollers are contemplated. The rollers will typically be formed of a gel material in order to facilitate the desired compliance, stretchability and elongation desired.

An electronic patch includes a first circuit layer comprising a substantially flat first substrate and a first conductive circuit, a second circuit layer comprising a substantially flat second substrate and a second conductive circuit, and an undulated ribbon that connects the first circuit layer and the second circuit layer. The undulated ribbon includes a third conductive circuit that connects the first conductive circuit and the second conductive circuit. An elastic layer encloses the first circuit layer, the second circuit layer, and the undulated ribbons.

A computer network system and method for printing in the pharmacy all information specific to a particular prescription recipient, synchronized in time with the fulfillment of the prescription. The computer network system and method determines what accompanying information to associate with a prescription, integrates that accompanying information into one integrated document, and prints the document, along with a prescription label, in the pharmacy prior to when the prescription recipient receives the prescription. In addition, the systems and methods determine layout of the specific accompanying information associated with a prescription to physically distinct sections of the paper.

A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

The invention provides a method for controlling the climate of an environment, e.g. a house, which exchanges thermal energy with an ambient space. Energy is supplied to the environment e.g. by radiators, floor heating, electrical heating fans etc. According to the method, a numerically expressed comfort criteria, and a numerically expressed weight of importance of compliance with the comfort criterion are defined. Subsequently, a supply of a specific amount of energy is considered, and with respect to that amount, a numerical expression of a degree of compliance with the comfort criterion, and a numerical expression of costs related to the supply of that amount of energy are provided.

An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and a first group of conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first group of one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first group of conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Methods and apparatus, including computer program products, for risk assessment and analysis. Asset data representing a set of assets is received. Threat data representing a set of threats is received. Measures data representing a set of measures is received. A loss expectancy based upon the value of the assets, the potential reduction of value caused by the threats, and the protection of the value caused by the measures is automatically calculated. Project data representing a simulated project is received. A revised loss expectancy is automatically calculated based upon the value of the assets, the potential reduction of value caused by the threats, and the protection of the value caused by the measures as modified by the simulated project. A savings caused by the simulated project is automatically calculated based upon the loss expectancy and revised loss expectancy.

A wafer level fabricated integrated circuit package having an air gap formed between the integrated circuit die of the package and a flexible circuit film located over and conductively attached to the die though raised interconnects formed on the die is described. The flexible circuit film further includes routing conductors that connect inner landings on the bottom surface of the flexible circuit film with outer landings on the top surface of the flexible circuit film. The outer landings are offset a horizontal distance from the inner landings. In some embodiments, contact bumps are formed on the outer landings of the flexible circuit film layer for use in connecting the package to other substrates. The wafer level chip scale package provides a highly compliant connection between the die and any other substrate that the die is attached to.

The present invention provides a microtesting rig for measuring mechanical properties of small specimens. The rig includes a microsized specimen positioned on a mounting block, an interchangeable contact tip connected with an actuator and configured for contact with the microsized specimen, and a magnifying imaging system for imaging the microsized specimen. The contact tip may be a fiber platen for compression testing or a fiber grip for tension testing.