2163 results about "Cyanate ester" patented technology

A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.

A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

The present invention relates to reactive compositions containing A) one or more blocked polyurethane prepolymers which have a content of blocked isocyanate groups (calculated as NCO) of 0.1 to 20 wt. % and are prepared from i) at least one aromatic, aliphatic, araliphatic and/or cycloaliphatic diisocyanate having a content of free NCO groups of 5 to 60 wt. %, ii) a polyol component containing at least one polyester polyol, and/or at least one polyether polyol and/or at least one polycarbonate polyol,

iii) CH-acidic cyclic ketones corresponding to formula (I) as blocking agents

wherein X represents an electron-attracting group,

• R¹ and R² independently of one another represent the radicals H,
• C₁-C₂₀ (cyclo)alkyl, C₆-C₂₄ aryl, C₁-C₂₀ (cyclo)alkyl ester or amide, C₆-C₂₄ aryl ester or amide, mixed aliphatic/aromatic radicals with 1 to 24 carbon atoms that can also be part of a 4- to 8-membered ring, n is an integer from 0 to 5, and B) one or more OH-functional compounds in which the OH component undergoes activation by a deposition amine component. The present invention also relates to a composite system containing two adherends bonded together with the reactive composition according to the invention.

The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy.

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether structure, a naphthol aralkyl type cyanate ester resin (b), a bisphenol A cyanate ester resin (c), a brominated flame retardant (d) and an inorganic filler (e), which resin composition is for use in a printed wiring board for high multilayer and high frequency and is improved in moldability and copper foil peel strength, which are conventional problems, without any decrease in electric characteristics and heat resistance after moisture absorption while keeping flame retardancy, a prepreg comprising the above resin composition and a glass woven fabric, a metal-foil-clad laminate obtained by disposing a metal foil on one side or both sides of a stack of at least one prepreg and laminate-molding the resultant set, and a resin sheet obtained by applying a solution of the above resin composition to a surface of a metal foil or a film.

Additive manufacturing of a fibre-reinforced polymer (FRP) product using an additive manufacturing print head; a reservoir in the additive manufacturing print head; short carbon fibers in the reservoir, wherein the short carbon fibers are randomly aligned in the reservoir; an acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin in the reservoir, wherein the short carbon fibers are dispersed in the acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin; a tapered nozzle in the additive manufacturing print head operatively connected to the reservoir, the tapered nozzle produces an extruded material that forms the fibre-reinforced polymer product; baffles in the tapered nozzle that receive the acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin with the short carbon fibers dispersed in the acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin; and a system for driving the acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin with the short carbon fibers dispersed in the acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin from the reservoir through the tapered nozzle wherein the randomly aligned short carbon fibers in the acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin are aligned by the baffles and wherein the extruded material has the short carbon fibers aligned in the acrylate, methacrylate, epoxy, cyanate ester or isocyanate resin that forms the fibre-reinforced polymer product.

A cyanate ester compound represented by the formula (1),

• • wherein Ar₂ represents a phenylene group, a naphthylene group or a biphenylene group, Ar₁ represents a naphthylene group or a biphenylene group when Ar₂ is a phenylene group, or Ar₁ represents a phenylene group, a naphthylene group or a biphenylene group when Ar₂ is a naphthylene group or a biphenylene group, R_x represents all substituents of Ar₁ each R_x is the same or different and represents hydrogen, an alkyl group or an aryl group, R_y represents all substituents of Ar₂, each R_y is the same or different and represents hydrogen, an alkyl group or an aryl group, and n is an integer of 1 to 50.

A transparent, non elastomeric, high index, impact resistant polythiourethane/urea material comprising the reaction product of: a) at least one (alpha, omega)-diiso(thio)cyanate cycloaliphatic or aromatic prepolymer having a number average molecular weight ranging from 100 to 3000 gmol-1, and b) at least one primary diamine, in an equivalent molar ratio amine function/iso(thio)cyanate function from 0.5 to 2, preferably from 0.90 to 1.10, wherein, said prepolymer and diamine are free from disulfide (-S-S-) linkage and at least one of the prepolymer or the diamine contains one or more S atoms in its chain.

The invention provides a halogen-free resin composition which comprises (A) 100 parts of cyanate ester resin, (B) 5-50 parts of styrene maleic anhydride, (C), 5-100 parts of polyphenyl ether resin, (D) 5-100 parts of maleimide resin, (E) 10-150 parts of nitrogenous compound, and (F) 10-1000 parts of inorganic filler. As the composition comprises components in special proportion, the halogen-free resin composition is low in dielectric constant, low in dielectric loss, high in heat resistance and high in flame resistance. The halogen-free resin composition can be prepared as a semi-cured film or a resin film, so that the composition can be applied to a copper foil substrate and a printed circuit board.

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150C.

A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

The invention discloses a low-temperature curing cyanate ester adhesive and a preparation method thereof, which relate to an adhesive and a preparation method thereof and solve the technical problems of high curing temperature and short room-temperature storage period of the existing cyanate ester adhesive. The adhesive disclosed by the invention is manufactured by adopting cyanate ester resin, a catalyst, modified resin, organic nano particles, inorganic nano particles, a thinning agent and a toughening agent. The preparation method comprises the following steps that: firstly, a mixture A is prepared; secondly, the toughening agent is added into the mixture A to obtain a mixture B; thirdly, the modified resin and the thinning agent are added into the mixture B and are stirred and mixed uniformly, the catalyst is added into the mixture to obtain a substrate, and then the substrate and quartz fiber fabric are subjected to hot melting to be combined into a low-temperature curing cyanate ester carrier adhesive film, so the low-temperature curing cyanate ester adhesive is obtained. The curing temperature of the low-temperature curing cyanate ester adhesive prepared by the preparation method provided by the invention is low, the low-temperature curing cyanate ester adhesive can be cured at a temperature of 120-140 DEG C, and the room-temperature storage period of the low-temperature curing cyanate ester adhesive is as long as 20 days, and meanwhile, the low-temperature curing cyanate ester adhesive has high bonding strength and excellent heat-resistant performance and is suitable for bonded materials which cannot resist to high temperature.

The invention relates to an epoxy resin composition and a high-frequency circuit board manufactured thereby. The epoxy resin composition comprises the following solid components: (A) cyanate compound or prepolymer thereof, wherein the molecule of the cyanate compound contains at least two cyanato groups; (B) active ester; and (C) epoxy resin containing a naphthol structure; calculated in solid component in parts by weight, the total amount of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, and the component (B), i.e. active ester, is 10-70 parts by weight, and the amount of the component (C), i.e. epoxy resin containing naphthol structure, is 30-90 parts by weight, wherein the weight ratio of the component (A), i.e. the cyanate compound containing at least two cyanato groups in the molecule thereof or the prepolymer thereof, to the component (B), i.e. active ester, is (0.2-5):1. The high-frequency circuit board manufactured by using the epoxy resin composition of the invention comprises a plurality of layers of prepregs which are overlapped mutually, and copper foils which are compressed on the two sides respectively; and each of the plurality of layers of prepregs comprises a base material and the epoxy resin composition which is adhered to the base material through impregnation and drying.

The invention belongs to the technical field of materials, and particularly relates to a preparation method of graphene with nano ferroferric oxide precipitated on surface, which concretely comprises the steps of: firstly, oxidizing natural flake graphite and obtaining graphite oxide; further carrying out ultrasonic stripping on the graphite oxide and forming graphene oxide suspension; then, carrying out reduction reaction on the graphene oxide suspension under the action of strong reducing agent, and obtaining black flocculent flake graphene; and finally, taking hydrogen peroxide as an oxidant, and depositing Fe3O4 on the surface of the graphene in an alkaline solution. The invention realizes the modification of nanoscale Fe3O4 for the surface of the graphene. The obtained modified graphene is not doped with other elements except the Fe element, and can be well dispersed in a high-performance resin matrix, so that the mechanical property, the thermal performance, the electromagnetic performance and the friction property of the resin matrix can be improved, and phenolic resin, bismaleimide, cyanate ester and other products can be updated, or a new application field can be developed..

The invention relates to the field of polyurethane, particularly a preparation method and application of 100% water-base foamed polyurethane foam. The 100% water-base foamed polyurethane foam is characterized by comprising a component A and a component B in a mass ratio of 1:1, wherein the component A is polymethylene polyphenyl isocyanate; the component B comprises polyalcohol, catalysts, foam stabilizer, pore opening agent, foaming agent, emulsifier and flame retardant; and the polyalcohol comprises polyether glycol, polyester polyol and flame-retardant polyether glycol. The invention is characterized by adopting high-proportion water. The invention adopts multiple assistants, and especially ingeniously uses three or two catalysts to ensure the open pore foam to have an open pore structure, the foam pores are compact and open, the meridian fibers of the foam pores are thin and soft, and the heat conductivity coefficient of the foam can still reach 0.036-0.040 (W/M.K).

Thermosetting resin compositions which comprise: (A) at least one modified linear polyimide resin obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetracarboxylic acid anhydride, and (B) at least one thermosetting resin selected from the group consisting of an epoxy resin, a bismaleimide resin, a cyanate ester resin, a bis-allyl-nadi-imide resin, a vinylbenzyl ether resin, a benzooxazine resin, a polymer of bismaleimide and diamine, and mixtures thereof, are useful as insulating materials for a flexible circuit boards and can readily have a conductor layer with excellent adhesion strength formed thereon by plating.

A subject of the present invention is to provide a one-pot type epoxy resin composition having both high curability and storage stability and a latent hardener for obtaining the same, and to provide anisotropic conductive materials, conductive adhesive materials, insulating adhesive materials, sealing materials, and the like which have high storage stability, solvent resistance and humidity resistance and can provide high connection reliability, adhesive strength and high sealing properties even under curing conditions such as low temperatures or short periods of time. The present invention relates to a latent hardener for epoxy resins in which a hardener (A) for epoxy resins is covered with a film (c1) obtained by reacting an isocyanate component (b1) comprising a low molecular bifunctional aliphatic isocyanate compound in an amount of 1% by mass or more and 95% by mass or less with an active hydrogen compound (b2), and to a one-pot type epoxy resin composition using the same.

A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.

A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.

The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance.

A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.

A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.