The present application relates to a kind of printed wiring board deep jump layer hole
processing method and printed wiring board, wherein printed wiring board deep jump layer hole
processing method includes the following steps: providing printed wiring board with multilayer structure, the printed wiring board includes target inner layer;The depth control drilling
processing is carried out to the printed wiring board, to form
blind hole from the surface of the printed wiring board to the direction of the target inner layer, the bottom of the
blind hole and the target inner layer between remaining preset thickness
insulation layer;The
laser drilling processing is carried out to the
blind hole of the depth control drilling processing completion, to remove the
insulation layer reserved at the bottom of the blind hole, until the target inner layer is exposed, to form the jump layer hole that the surface of the printed wiring board and the target inner layer are communicated.The method of the present application can complete high-quality jump layer hole processing from
surface layer to deep layer inner layer in printed wiring board under the premise of keeping small aperture.