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Thermosetting resin composition and application thereof

A resin composition and thermosetting technology, which can be used in other household appliances, synthetic resin layered products, applications, etc., can solve the problems of difficult processing, unsatisfactory copper clad substrates, poor heat resistance, etc., and achieve excellent dielectric properties , low plasticity, good heat resistance

Active Publication Date: 2014-04-02
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above resins have good dielectric properties, they all have defects such as difficult processing and poor heat resistance, which cannot meet the requirements of copper clad substrates.

Method used

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  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Get a container, add 49 parts by weight of bisphenol A type cyanate resin BA230S (LONZA company, cyano equivalent is 139g / eq), 21 parts by weight of naphthol type novolak epoxy resin NC-7000L (Nippon Kayaku Corporation , EEW is 232g / eq) Then add 30 parts by weight of phosphonate-carbonate copolymer FRX 95 (FRX Polymers company, phosphorus content is 10.6%) and stir evenly, then add 0.035 parts by weight of curing accelerator zinc octanoate, and solvent Butanone, continue to stir evenly to form a glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. Use several prepregs prepared by stacking each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper clad laminate. The curing temperature is 150-250 ° C. The curing pressure is 25-60kg / cm 2 , The curing time is 90~120min.

Embodiment 2

[0096] Get a container, add 50 parts by weight of bisphenol A type cyanate resin BA230S (LONZA company, cyano equivalent is 139g / eq), 45 parts by weight of naphthol type novolak epoxy resin NC-7300L (Nippon Kayaku Corporation , EEW is 214g / eq) Then add 30 parts by weight of phosphonate polymer HM1100 (FRX Polymers company, phosphorus content is 10.8%) and stir evenly, then add 0.035 parts by weight of curing accelerator zinc octanoate, and solvent methyl ethyl ketone, continue Stir well and serve as glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. Use several prepregs prepared by stacking each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper clad laminate. The curing temperature is 150-250 ° C. The curing pressure is 25-60kg / cm 2 , The curing time is 90~120min.

Embodiment 3

[0098] Get a container, add 30 parts by weight of phenolic cyanate ester resin PT-30 (LONZA company, cyano equivalent is 139g / eq), 50 parts by weight of naphthol type novolac epoxy resin NC-7300L (Nippon Kayaku Corporation , EEW is 214g / eq), then add 20 parts by weight of phosphonate oligomer OL5000 (FRX Polymers company, phosphorus content is 10.8%) and stir evenly, then add 0.035 parts by weight of curing accelerator zinc octanoate, and solvent butanone , continue to stir evenly and serve as glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. Use several prepregs prepared by stacking each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper clad laminate. The curing temperature is 150-250 ° C. The curing pressure is 25-60kg / cm 2 , The curing time is 90~120min.

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Abstract

The invention relates to a thermosetting resin composition which comprises (A) epoxy resin with a naphthol structure on a molecular main chain; (B) cyanate ester compound or / and cyanate ester prepolymer; and (C) phosphonate or / and phosphonate-carbonic ester copolymer. The thermosetting resin composition provided by the invention is low in dielectric constant and dielectric loss tangent, a prepreg and a copper clad laminate prepared by using the above thermosetting resin composition has excellent dielectrical property, humidity resistant property and craft processability, and the fire resistance is up to the UL94 V-0 level.

Description

technical field [0001] The invention relates to a thermosetting resin composition, in particular to a halogen-free thermosetting resin composition and prepregs, laminates and high-frequency circuit substrates made using it. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the continuous increase of the amount of transmitted information requires the continuous increase of application frequency and the continuous miniaturization of communication equipment. Equipment requirements are increasingly pressing. At present, the operating frequency of traditional communication equipment generally exceeds 500MHz, and most of them are 1-10GHz; with the demand for transmitting large information in a short period of time, the operating frequency is also continuously increased, and with the continuous increase of frequency, it brings signal integrity. However, as the basic material for signal transmission, the diel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08L85/02C08K5/098C08J5/24C08G59/40B32B15/092B32B27/04H05K1/03
CPCB32B5/022B32B5/024B32B15/14B32B2260/021B32B2260/046B32B2262/101B32B2264/102B32B2264/104H05K1/0326C08J2363/02C08L63/00H05K1/0366B32B15/20C08J2379/00C08J2463/04C08J2485/02C08L2205/03B32B2307/204B32B2307/306B32B2307/3065B32B2457/08Y10T428/31522C08J5/244C08J5/249C08L79/04C08L85/02
Inventor 曾宪平辛玉军
Owner GUANGDONG SHENGYI SCI TECH
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