37results about How to "Achieve halogen-free flame retardant" patented technology

The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy.

The invention discloses a halogen-free flame retardant antistatic polycarbonate composition and a preparation method thereof. The composition comprises the components based on parts by weight: 50-70 parts of polycarbonate, 5-20 parts of polymer which can form a third phase, 8-15 parts of impact modifier, 3-15 parts of phosphonium flame retardant, 0.2 part of fluoro-polyolefine additive, 1-10 parts of conducting material and 0.1-1 part of other accessory ingredient. When in operation, the polymer which can form the third phase, the phosphonium flame retardant, the conducting material and other accessory ingredient are firstly melted and extruded by a double screw extruder to prepare intermediate composition; after being melted and extruded by the double screw extruder, the intermediate composition, the polycarbonate, the impact modifier and the fluoro-polyolefine additive are pelleted and then dried. The composition prepared by the invention does not contain chlorine and bromine, has excellent antistatic property, flame retardance, impact resistance and formability and needs a little conductive filler.

The invention provides a phosphorus-containing flame retardant composition, including: a hypophosphite compound, a DOPO derivative and a polyphosphazene compound. The composition as a flame retardant can play a synergistic effect of several phosphorus-containing compounds, realizes halogen-free flame retardance under small addition amount and reaches level V-0. The invention also provides a contains a polyphenyl ether resin composition containing the above phosphorus-containing flame retardant compositions and a prepreg and a copper clad laminated board prepared from the same. After curing, the polyphenyl ether resin composition achieves flame retardance of V-0 grade under the condition to which the halogen flame retardant does not apply and keeps good dielectric property and heat resistance of polyphenyl ether resin; the prepreg and copper clad laminated board made from the composition have good dielectric property and heat resistance, and realize halogen-free flame retardance to UL 94-V0 grade while ensuring excellent heat resistance and dielectric property; and the composition is applicable to the field of high speed and high frequency printed circuit board, and is in line with the future requirements of green and environmental protection.

The invention discloses a halogen-free flame-retardant resin composition which comprises the following components in parts by weight: 20-70 parts of solventless resin, 20-70 parts of solvent, 0-50 parts of curing agent, 8-35 parts of inorganic flame retardant, 0.01-1 part of promoter and 3-30 parts of phosphazene flame retardant; the respective components are mixed and stirred at 20-60 DEG C to prepare a colloidal liquid, and the halogen-free flame-retardant resin colloidal liquid is coated on glass cloth through a vertical or horizontal gluing machine, and is pre-dried through a drying path of the gluing machine to prepare a glass cloth prepreg; and the glass cloth prepeg is further cut and put in a hot press for hot forming to prepare a halogen-free flame-retardant glass cloth laminatedplate or mould pressing composite material. When the halogen-free flame-retardant resin composition is adopted, the prepared halogen-free flame-retardant glass cloth laminated plate can meet the requirements for large-sized electrical machinery and electric appliances, electronic devices and environmental friendliness, and is suitable for F-level and H-level electrical insulating materials of many electrical products such as laminated sheet materials of electronic products, motors, transformers, and the like.

The invention discloses a halogen-free resin composition, which comprises the following components in part by weight based on the solid weight: (a) 5 to 35 parts of bismaleimide resin, (b) 10 to 60 parts of composite cyanate resin, (c) halogen-free epoxy resin, and (d) 0.0005 to 1 part of accelerator. The resin composition, a prepreg and a laminated board obtained by the invention are halogen-free and flame-retardant, have high damp heat resistance and heat resistance and a low heat expansion coefficient, and are suitable for the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like.

The invention relates to a thermosetting resin composition which is composed of a combination and a solvent, wherein the combination comprises the following components in parts by weight: 20-100 parts of halogen-free epoxy resin, 10-30 parts of nitrile-base resin, 20-100 parts of allyl modified bismaleimide resin prepolymer, 20-100 parts of curing agent and 10-100 parts of filler; and the combination is dissolved in the solvent, and accounts for 65-75 wt% of the total composition. The UL-V0 green environment-friendly thermosetting resin composition has excellent toughness, machinability and water absorptivity.

The invention discloses a high-abrasion-resistance, halogen-free and flame-retardant insulation material for a thin-wall locomotive cable. The high-abrasion-resistance, halogen-free and flame-retardant insulation material is prepared from, by weight, 10-13 parts of water magnesium powder, 3.2-4 parts of polyphosphoric acid, 0.9-1.4 parts of lauryl amine, 6-8 parts of tin-bismuth alloy powder, 26-33 parts of polypropylene, 14-16 parts of carbon fibers, 17-23 parts of ultra-high molecular weight polyethylene, 0.2-0.4 part of an antioxidant 1010, 4.6-5 parts of antimonous oxide, 0.2-0.4 part of aluminum stearate, 43-50 parts of polyamide 6, a proper amount of absolute ethyl alcohol, a proper amount of xylene and a proper amount of deionized water. The high-abrasion-resistance, halogen-free and flame-retardant insulation material has the advantages of being prominent in abrasion resistance, high in mechanical strength, excellent in flame retardant property, low in smoke, nontoxic, good in insulation performance and the like, and is simple in production process, wide in raw material source, low in cost and worthy of popularization.

The invention discloses a flame-retardant low-dielectric copper-clad plate and a preparation method thereof. The method is characterized by comprising the following steps: mixing a flame-retardant thermosetting resin composite composed of 28 to 44 parts by mass of epoxy resin, 56-72 parts by mass of an unsaturated phosphorus-containing phenolic aldehyde curing agent, 21-48 parts by mass of hydrocarbon resin, 0.1-0.5 part by mass of an accelerant, and 0.1-0.5 part by mass of an initiator with 45-70 parts by mass of a filler and a solvent A to prepare a resin solution; and impregnating the glass fiber cloth, removing most of the solvent A through a drying tunnel at 50-100 DEG C, baking the impregnated glass fiber cloth at 130-170 DEG C for 4-7 minutes to obtain prepregs, superposing 3-20 layers of prepregs, attaching copper foils to the two sides of the prepregs, and curing in a hot press. The flame-retardant low-dielectric copper-clad plate has excellent dielectric property, heat resistance, mechanical strength and the like while halogen-free flame retardance is realized.

The invention provides a phosphorus-containing active ester and a halogen-free resin composition thereof, and a prepreg and a laminated board using the halogen-free resin composition. The halogen-freeresin composition comprises (A) thermosetting resin, and (B) phosphorus-containing active ester resin. The prepreg and the laminated board prepared by using the halogen-free resin composition have low dielectric loss factors and can achieve halogen-free flame retardancy.

The invention discloses an electronic pouring sealant with high sealing performance, high temperature resistance, high toughness and high flame retardance. The electronic pouring sealant is formed by mixing a component A and a fumed silica curing agent according to a weight ratio of 95:5, wherein the component A is prepared from the following raw materials in parts by weight: 30-40 parts of an epoxy resin, 30-50 parts of aluminum hydroxide, 10-20 parts of a toughening agent and 0.2-1.5 parts of a defoaming agent, wherein the epoxy resin is one or a mixture of several of bisphenol A type epoxy resin, alicyclic epoxy resin, phenol formaldehyde epoxy resin, bisphenol F type epoxy resin and glycidyl amine type epoxy resin, and the toughening agent is low-molecular-weight polyethylene glycol ether, polynonyl dianhydride, carboxyl-terminated liquid nitrile rubber or hydroxyl-terminated liquid nitrile rubber. The electronic pouring sealant is good in heat resistance, high in sealing performance, waterproof and oil-proof capacity and low in volume shrinkage rate, has toughness after curing, cannot damage electronic components, improves the yield of the electronic components after potting, and prolongs the service life of the electronic components.

The invention discloses a high-reliability halogen-free copper-clad plate for IC packaging and a preparation method thereof, and belongs to the technical field of 5G copper-clad plates and productionthereof. The copper-clad plate comprises a bottom copper foil layer, a top copper foil layer and an insulating medium layer which is positioned between the bottom copper foil layer and the top copperfoil layer and is formed by superposing 1-8 prepregs. Each prepreg is obtained by dipping glass fiber cloth in a resin glue solution and then drying the glass fiber cloth. The resin glue solution comprises dipentadiene phenol epoxy resin, maleimide resin, a curing agent, a phosphate flame retardant and a silicon dioxide filler. According to the resin glue solution, low-viscosity dipentadiene phenolepoxy resin and various maleimide resin compounds are used as a main resin system, epoxy resin and styrene maleic anhydride resin are compounded to be used as a curing agent, and angular silicon dioxide and spherical silicon dioxide are used as fillers. The prepared copper-clad plate has the characteristics of high frequency, high speed, high heat resistance, low thermal expansion coefficient, good dimensional stability and the like.

The invention provides a PA6 composite material and a preparation method thereof. The PA6 composite material is prepared from the following ingredients in parts by mass: 33 to 37 percent of PA6 resin,8 to 13 percent of alkali-free glass fiber, 0 to 50 percent of magnesium oxide, 0 to 50 percent of magnesium hydrate and 0 to 5 percent of auxiliary agents, wherein the sum of the mass of the magnesium oxide and the magnesium hydrate does not exceed 60 percent of the total mass of the composite material. The composite material has excellent heat conduction performance, and simultaneously has excellent mechanical performance; the halogen-free flame-retardant effect can be achieved. The process of the preparation method is simple; the preparation method is suitable for industrial production.

The invention provides a thermosetting resin composition, and a prepreg, a metal foil-coated laminated board and a printed circuit board using the same. The thermosetting resin composition includes anepoxy resin, a phosphorus-containing bisphenol, and an ester curing agent having a structure represented by formula I. The ester curing agent having the structure represented by the formula I and thephosphorus-containing bisphenol are used to synergistically cure the epoxy resin, and the phosphorus-containing bisphenol is used as the main curing agent, so the obtained cured epoxy resin has excellent dielectric properties, high heat resistance and high adhesion, and can realize no halogen and flame retardation; and the ester curing agent of the formula I is combined to make no polar groups such as secondary hydroxyl groups generated in the curing process, so excellent dielectric properties are ensured, the glass transition temperature of the cured product is significantly improved, and the cured product contains a large amount of hydrophobic groups, thereby the water absorption rate of the cured product is greatly reduced, and the dielectric constant and the dielectric loss factor ofthe cured product are stable. The produced laminated board and metal foil-coated laminated board have the advantages of good heat resistance, good moisture resistance, good peel strength, good dielectric properties and good flame retardancy.