Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
37results about How to "Achieve halogen-free flame retardant" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Thermosetting resin composition, prepreg and laminated board
ActiveCN102115600AExcellent heat and humidity resistanceImprove heat resistanceGlass/slag layered productsMetal layered productsEpoxyDielectric loss
The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy.
Owner:SHENGYI TECH SUZHOU
Halogen-free flame-proof static resistant polycarbonate composition and method for producing the same
The invention discloses a halogen-free flame retardant antistatic polycarbonate composition and a preparation method thereof. The composition comprises the components based on parts by weight: 50-70 parts of polycarbonate, 5-20 parts of polymer which can form a third phase, 8-15 parts of impact modifier, 3-15 parts of phosphonium flame retardant, 0.2 part of fluoro-polyolefine additive, 1-10 parts of conducting material and 0.1-1 part of other accessory ingredient. When in operation, the polymer which can form the third phase, the phosphonium flame retardant, the conducting material and other accessory ingredient are firstly melted and extruded by a double screw extruder to prepare intermediate composition; after being melted and extruded by the double screw extruder, the intermediate composition, the polycarbonate, the impact modifier and the fluoro-polyolefine additive are pelleted and then dried. The composition prepared by the invention does not contain chlorine and bromine, has excellent antistatic property, flame retardance, impact resistance and formability and needs a little conductive filler.
Owner:SOUTH CHINA UNIV OF TECH
Phosphorus-containing flame retardant composition, and phosphorus-containing polyphenyl ether resin composition, prepreg and laminated board using the same
ActiveCN104774476AExcellent dielectric propertiesImprove heat resistanceSynthetic resin layered productsCircuit susbtrate materialsDielectricHalogen
The invention provides a phosphorus-containing flame retardant composition, including: a hypophosphite compound, a DOPO derivative and a polyphosphazene compound. The composition as a flame retardant can play a synergistic effect of several phosphorus-containing compounds, realizes halogen-free flame retardance under small addition amount and reaches level V-0. The invention also provides a contains a polyphenyl ether resin composition containing the above phosphorus-containing flame retardant compositions and a prepreg and a copper clad laminated board prepared from the same. After curing, the polyphenyl ether resin composition achieves flame retardance of V-0 grade under the condition to which the halogen flame retardant does not apply and keeps good dielectric property and heat resistance of polyphenyl ether resin; the prepreg and copper clad laminated board made from the composition have good dielectric property and heat resistance, and realize halogen-free flame retardance to UL 94-V0 grade while ensuring excellent heat resistance and dielectric property; and the composition is applicable to the field of high speed and high frequency printed circuit board, and is in line with the future requirements of green and environmental protection.
Owner:GUANGDONG SHENGYI SCI TECH
Thermosetting resin composition and application thereof
ActiveCN103694642ALow dielectric constantExcellent dielectric propertiesSynthetic resin layered productsElectrical equipmentDielectric lossCopper foil
The invention relates to a thermosetting resin composition which comprises (A) epoxy resin with a naphthol structure on a molecular main chain; (B) cyanate ester compound or / and cyanate ester prepolymer; and (C) phosphonate or / and phosphonate-carbonic ester copolymer. The thermosetting resin composition provided by the invention is low in dielectric constant and dielectric loss tangent, a prepreg and a copper clad laminate prepared by using the above thermosetting resin composition has excellent dielectrical property, humidity resistant property and craft processability, and the fire resistance is up to the UL94 V-0 level.
Owner:GUANGDONG SHENGYI SCI TECH
Halogen-free flame-retardant resin composition and preparation method of prepreg and laminated plate
ActiveCN102134376AStrong self-extinguishingGood synergistic flame retardant effectLaminationLamination apparatusElectric machinerySolvent
The invention discloses a halogen-free flame-retardant resin composition which comprises the following components in parts by weight: 20-70 parts of solventless resin, 20-70 parts of solvent, 0-50 parts of curing agent, 8-35 parts of inorganic flame retardant, 0.01-1 part of promoter and 3-30 parts of phosphazene flame retardant; the respective components are mixed and stirred at 20-60 DEG C to prepare a colloidal liquid, and the halogen-free flame-retardant resin colloidal liquid is coated on glass cloth through a vertical or horizontal gluing machine, and is pre-dried through a drying path of the gluing machine to prepare a glass cloth prepreg; and the glass cloth prepeg is further cut and put in a hot press for hot forming to prepare a halogen-free flame-retardant glass cloth laminatedplate or mould pressing composite material. When the halogen-free flame-retardant resin composition is adopted, the prepared halogen-free flame-retardant glass cloth laminated plate can meet the requirements for large-sized electrical machinery and electric appliances, electronic devices and environmental friendliness, and is suitable for F-level and H-level electrical insulating materials of many electrical products such as laminated sheet materials of electronic products, motors, transformers, and the like.
Owner:SICHUAN DONGFANG INSULATING MATERIAL
Epoxy resin composition, and prepreg and copper foil-clad laminated sheet prepared by using epoxy resin composition
ActiveCN102850722AHigh functionalityLow water absorptionSynthetic resin layered productsPrinted circuit aspectsPolymer scienceFirming agent
The present invention relates to an epoxy resin composition, and a prepreg and a copper foil-clad laminated sheet prepared by using the epoxy resin composition. The epoxy resin composition comprises the following components: (A) an epoxy resin containing two or more than two epoxy groups, (B) an active ester curing agent, and (C) a phosphate compound. According to the epoxy resin composition of the present invention, the epoxy resin having a specific molecular structure is adopted, and functionality is high, such that the resulting cured product has characteristics of high glass transition temperature and low moisture absorption; the active ester is adopted as a curing agent, such that the advantage of the active ester is completely provided, wherein the advantage comprises that no polar group is produced when the active ester reacts with the epoxy resin so as to provide excellent dielectric property and good moisture heat resistance; with application of the active ester as the curing agent, water absorption of the phosphorous-containing component can be further improved, a water absorption rate and a dielectric loss value of the cured resin material can be reduced, and purposes of no halogen, fire retardation and good moisture heat resistance can be concurrently achieved; and the prepreg and the copper foil-clad laminated sheet in the present invention have characteristics of no halogen, fire retardation, excellent dielectric property and excellent moisture heat resistance.
Owner:GUANGDONG SHENGYI SCI TECH
125 DEG C irradiation crosslinked EPCV photovoltaic halogen-free flame-retardant sheath material and preparation method thereof
ActiveCN103524893AAchieve halogen-free flame retardantImprove flame retardant performanceRubber insulatorsPlastic/resin/waxes insulatorsMechanical propertyRaw material
The invention discloses a 125 DEG C irradiation crosslinked EPCV photovoltaic low-smoke halogen-free sheath cable material. The material is mainly prepared from the following raw materials in parts by weight: 10-20 parts of ethylene-propylene-diene monomer; 0-5 parts of a thermoplastic elastomer; 0-25 parts of polyethylene; 0-15 parts of an ethylene-vinyl acetate copolymer; 1-5 parts of a compatibilizer; 45-65 parts of aluminum hydroxide; 1-3 parts of a stabilizer; and 1-3 parts of a silicone master batch. The product has excellent oil proof performance and excellent flame retardant performance, has extremely low smoke release quantity during combustion, enables the light transmittance in smoke to reach more than 90%, moreover, has excellent mechanical properties and weather resistance, and completely meets the UL4703-2010 standard performance requirements.
Owner:JIANGSU DASHENG POLYMER
Thermosetting epoxy resin composition and use thereof
ActiveCN103756257AExcellent dielectric propertiesExcellent heat and humidity resistancePrinted circuit aspectsConductive materialDielectricEpoxy
The invention relates to a thermosetting epoxy resin composition which comprises epoxy resin, an active ester curing agent, and polyphosphonate or / and phosphonate-carbonate copolymer. The prepreg prepared by the epoxy resin composition and a copper foil coated laminated board have excellent dielectric property and heat and humidity resistance, and the flame retardance can reach level UL94V-0.
Owner:GUANGDONG SHENGYI SCI TECH
Halogen-free resin composition and prepreg and laminated board made of same
ActiveCN102174242AAchieve halogen-free flame retardantMeet the requirements of high-performance printed circuit board substratesSynthetic resin layered productsLaminationHigh densityInterconnection
The invention discloses a halogen-free resin composition, which comprises the following components in part by weight based on the solid weight: (a) 5 to 35 parts of bismaleimide resin, (b) 10 to 60 parts of composite cyanate resin, (c) halogen-free epoxy resin, and (d) 0.0005 to 1 part of accelerator. The resin composition, a prepreg and a laminated board obtained by the invention are halogen-free and flame-retardant, have high damp heat resistance and heat resistance and a low heat expansion coefficient, and are suitable for the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like.
Owner:SHENGYI TECH SUZHOU
Thermosetting resin composition
ActiveCN103897346AImprove toughnessImprove solubilitySynthetic resin layered productsMetal layered productsSolventPrepolymer
The invention relates to a thermosetting resin composition which is composed of a combination and a solvent, wherein the combination comprises the following components in parts by weight: 20-100 parts of halogen-free epoxy resin, 10-30 parts of nitrile-base resin, 20-100 parts of allyl modified bismaleimide resin prepolymer, 20-100 parts of curing agent and 10-100 parts of filler; and the combination is dissolved in the solvent, and accounts for 65-75 wt% of the total composition. The UL-V0 green environment-friendly thermosetting resin composition has excellent toughness, machinability and water absorptivity.
Owner:GUANGDONG SHENGYI SCI TECH
High-abrasion-resistance, halogen-free and flame-retardant insulation material for thin-wall locomotive cable
InactiveCN105820558AGood strength and elongation at breakExcellent mechanical properties and electrical conductivityElectroconductive/antistatic filament manufacturePlastic/resin/waxes insulatorsBismuthAluminium
The invention discloses a high-abrasion-resistance, halogen-free and flame-retardant insulation material for a thin-wall locomotive cable. The high-abrasion-resistance, halogen-free and flame-retardant insulation material is prepared from, by weight, 10-13 parts of water magnesium powder, 3.2-4 parts of polyphosphoric acid, 0.9-1.4 parts of lauryl amine, 6-8 parts of tin-bismuth alloy powder, 26-33 parts of polypropylene, 14-16 parts of carbon fibers, 17-23 parts of ultra-high molecular weight polyethylene, 0.2-0.4 part of an antioxidant 1010, 4.6-5 parts of antimonous oxide, 0.2-0.4 part of aluminum stearate, 43-50 parts of polyamide 6, a proper amount of absolute ethyl alcohol, a proper amount of xylene and a proper amount of deionized water. The high-abrasion-resistance, halogen-free and flame-retardant insulation material has the advantages of being prominent in abrasion resistance, high in mechanical strength, excellent in flame retardant property, low in smoke, nontoxic, good in insulation performance and the like, and is simple in production process, wide in raw material source, low in cost and worthy of popularization.
Owner:ANHUI KANGLIYA CO LTD
Flame-retardant low-dielectric copper-clad plate and preparation method thereof
ActiveCN111055585AGood physical and mechanical propertiesLow dielectric constantLamination ancillary operationsSynthetic resin layered productsDielectricGlass fiber
The invention discloses a flame-retardant low-dielectric copper-clad plate and a preparation method thereof. The method is characterized by comprising the following steps: mixing a flame-retardant thermosetting resin composite composed of 28 to 44 parts by mass of epoxy resin, 56-72 parts by mass of an unsaturated phosphorus-containing phenolic aldehyde curing agent, 21-48 parts by mass of hydrocarbon resin, 0.1-0.5 part by mass of an accelerant, and 0.1-0.5 part by mass of an initiator with 45-70 parts by mass of a filler and a solvent A to prepare a resin solution; and impregnating the glass fiber cloth, removing most of the solvent A through a drying tunnel at 50-100 DEG C, baking the impregnated glass fiber cloth at 130-170 DEG C for 4-7 minutes to obtain prepregs, superposing 3-20 layers of prepregs, attaching copper foils to the two sides of the prepregs, and curing in a hot press. The flame-retardant low-dielectric copper-clad plate has excellent dielectric property, heat resistance, mechanical strength and the like while halogen-free flame retardance is realized.
Owner:艾蒙特成都新材料科技有限公司
Phosphorus-containing active ester and halogen-free composition thereof, and copper-clad laminate
ActiveCN108250676AImprove electrical performanceHalogen freeGroup 5/15 element organic compoundsElectrical equipmentDielectric loss factorHalogen
The invention provides a phosphorus-containing active ester and a halogen-free resin composition thereof, and a prepreg and a laminated board using the halogen-free resin composition. The halogen-freeresin composition comprises (A) thermosetting resin, and (B) phosphorus-containing active ester resin. The prepreg and the laminated board prepared by using the halogen-free resin composition have low dielectric loss factors and can achieve halogen-free flame retardancy.
Owner:GUANGDONG SHENGYI SCI TECH
Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof
ActiveCN102618033BImprove adhesionSimple processPoint-like light sourceElongate light sourcesCooking & bakingCross-link
Owner:CHENGDU DO ITC NEW MATERIAL
Electronic pouring sealant with high sealing performance, high temperature resistance, high toughness and high flame retardance
InactiveCN112812719ALow shrinkageLow weather resistanceNon-macromolecular adhesive additivesMacromolecular adhesive additivesPolymer sciencePolyethylene glycol
The invention discloses an electronic pouring sealant with high sealing performance, high temperature resistance, high toughness and high flame retardance. The electronic pouring sealant is formed by mixing a component A and a fumed silica curing agent according to a weight ratio of 95:5, wherein the component A is prepared from the following raw materials in parts by weight: 30-40 parts of an epoxy resin, 30-50 parts of aluminum hydroxide, 10-20 parts of a toughening agent and 0.2-1.5 parts of a defoaming agent, wherein the epoxy resin is one or a mixture of several of bisphenol A type epoxy resin, alicyclic epoxy resin, phenol formaldehyde epoxy resin, bisphenol F type epoxy resin and glycidyl amine type epoxy resin, and the toughening agent is low-molecular-weight polyethylene glycol ether, polynonyl dianhydride, carboxyl-terminated liquid nitrile rubber or hydroxyl-terminated liquid nitrile rubber. The electronic pouring sealant is good in heat resistance, high in sealing performance, waterproof and oil-proof capacity and low in volume shrinkage rate, has toughness after curing, cannot damage electronic components, improves the yield of the electronic components after potting, and prolongs the service life of the electronic components.
Owner:江苏天康电子合成材料有限公司
High-reliability halogen-free copper-clad plate for IC packaging and preparation method thereof
PendingCN111605264AHigh TgLow hygroscopicitySynthetic resin layered productsLaminationGlass fiberImide
The invention discloses a high-reliability halogen-free copper-clad plate for IC packaging and a preparation method thereof, and belongs to the technical field of 5G copper-clad plates and productionthereof. The copper-clad plate comprises a bottom copper foil layer, a top copper foil layer and an insulating medium layer which is positioned between the bottom copper foil layer and the top copperfoil layer and is formed by superposing 1-8 prepregs. Each prepreg is obtained by dipping glass fiber cloth in a resin glue solution and then drying the glass fiber cloth. The resin glue solution comprises dipentadiene phenol epoxy resin, maleimide resin, a curing agent, a phosphate flame retardant and a silicon dioxide filler. According to the resin glue solution, low-viscosity dipentadiene phenolepoxy resin and various maleimide resin compounds are used as a main resin system, epoxy resin and styrene maleic anhydride resin are compounded to be used as a curing agent, and angular silicon dioxide and spherical silicon dioxide are used as fillers. The prepared copper-clad plate has the characteristics of high frequency, high speed, high heat resistance, low thermal expansion coefficient, good dimensional stability and the like.
Owner:江苏联鑫电子工业有限公司
An environmentally friendly flame-retardant low-odor acrylic structural adhesive
ActiveCN105482749BAchieve halogen-free flame retardantGood adhesionNon-macromolecular adhesive additivesMacromolecular adhesive additivesAdhesiveFire retardant
The invention discloses an environment-friendly inflaming-retarding low-odor acrylic acid structural adhesive. The environment-friendly inflaming-retarding low-odor acrylic acid structural adhesive is composed of a component A and a component B. The component A is prepared from 20-60 parts of acrylate monomers, 12-30 parts of toughened resin, 8-20 parts of carbon formation synergistic resin, 3-10 parts of oxidizing agent, 0.2-4 parts of stabilizer, and 15-30 parts of fire retardant A. The component B is prepared from 20-50 parts of acrylate monomers, 12-25 parts of toughened resin, 8-25 parts of carbon formation synergistic resin, 2-10 parts of reducing agent, 0.2-4 parts of stabilizer, 10-30 parts of fire retardant B, 8-30 parts of phosphorus adhesion inflaming retarding accelerator and 1-3 parts of curing accelerator. The prepared acrylic acid structural adhesive is low in odor, free of halogen and environmentally friendly; meanwhile, flame retardant property can reach the V0 level, and the bonding strength of the adhesive can be effectively improved through the self-made phosphorus adhesion inflaming retarding accelerator and a specific redox system.
Owner:TONSAN ADHESIVES INC
PA6 composite material and preparation method thereof
The invention provides a PA6 composite material and a preparation method thereof. The PA6 composite material is prepared from the following ingredients in parts by mass: 33 to 37 percent of PA6 resin,8 to 13 percent of alkali-free glass fiber, 0 to 50 percent of magnesium oxide, 0 to 50 percent of magnesium hydrate and 0 to 5 percent of auxiliary agents, wherein the sum of the mass of the magnesium oxide and the magnesium hydrate does not exceed 60 percent of the total mass of the composite material. The composite material has excellent heat conduction performance, and simultaneously has excellent mechanical performance; the halogen-free flame-retardant effect can be achieved. The process of the preparation method is simple; the preparation method is suitable for industrial production.
Owner:东莞市银禧光电材料科技股份有限公司
Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same
ActiveCN109694462AExcellent dielectric propertiesLow water absorptionSynthetic resin layered productsElectrical equipmentMetal foilDielectric loss factor
The invention provides a thermosetting resin composition, and a prepreg, a metal foil-coated laminated board and a printed circuit board using the same. The thermosetting resin composition includes anepoxy resin, a phosphorus-containing bisphenol, and an ester curing agent having a structure represented by formula I. The ester curing agent having the structure represented by the formula I and thephosphorus-containing bisphenol are used to synergistically cure the epoxy resin, and the phosphorus-containing bisphenol is used as the main curing agent, so the obtained cured epoxy resin has excellent dielectric properties, high heat resistance and high adhesion, and can realize no halogen and flame retardation; and the ester curing agent of the formula I is combined to make no polar groups such as secondary hydroxyl groups generated in the curing process, so excellent dielectric properties are ensured, the glass transition temperature of the cured product is significantly improved, and the cured product contains a large amount of hydrophobic groups, thereby the water absorption rate of the cured product is greatly reduced, and the dielectric constant and the dielectric loss factor ofthe cured product are stable. The produced laminated board and metal foil-coated laminated board have the advantages of good heat resistance, good moisture resistance, good peel strength, good dielectric properties and good flame retardancy.
Owner:GUANGDONG SHENGYI SCI TECH
Halogen-free thermosetting resin composition, prepreg prepared from halogen-free thermosetting resin composition and laminated plate for printed circuit
ActiveCN105802127AHigh structural symmetryHigh phosphorus contentSynthetic resin layered productsCircuit susbtrate materialsHeat resistanceGlass transition
The invention relates to a halogen-free thermosetting resin composition, a prepreg prepared from the halogen-free thermosetting resin composition and a laminated plate for a printed circuit. The halogen-free thermosetting resin composition comprises, by weight, 30-60 parts of halogen-free epoxy resin, 5-30 parts of phosphorus-containing bisphenol as a first curing agent, 5-30 parts of dicyclopentadiene-type phenolic aldehyde as a second curing agent and a phosphorus-containing fire retardant. The prepreg prepared from the halogen-free thermosetting resin composition and the laminated plate for a printed circuit have high glass-transition temperatures, excellent dielectric properties, low water absorption rates, high heat resistance and good processability, realizes halogen-free flame retardation and has a UL94V-0 level.
Owner:GUANGDONG SHENGYI SCI TECH
Composition of halogen-free flame-retardant polystyrene plastic and preparation method thereof
The invention discloses a composition of halogen-free flame-retardant polystyrene plastic and a preparation method thereof. The composition of halogen-free flame-retardant polystyrene plastic comprises 100 parts of polystyrene plastic, 15-30 parts of organic silicon rubber and vulcanized cross linker thereof, 0-100 parts of magnesium hydroxide, 0-20 parts of red phosphorus, 5-15 parts of toughening agent, 0.5 parts of coupling agent and 1-3 parts of processing agent. The polystyrene plastic prepared according to the composition has a halogen-free flame-retardant effect, can effectively reducethe adding amount of the magnesium hydroxide on the premise that the same flame-retardant effect is achieved, so that the mechanical property and the processing performance of the polystyrene plasticare not affected. The prepared halogen-free flame-retardant polystyrene plastic is applied to the environmental protection and flame retardance in the field of electrical appliances.
Owner:SHENZHEN POLYTECHNIC
A kind of phosphorus-containing active ester and its halogen-free composition and copper clad substrate
ActiveCN108250676BHalogenatedHalogen Free HalogenatedGroup 5/15 element organic compoundsElectrical equipmentDielectric loss factorCopper foil
The invention provides a phosphorus-containing active ester and its halogen-free resin composition, as well as a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) thermosetting resin; (B) phosphorus-containing active ester resin. Prepregs and laminates made of the halogen-free resin composition have low dielectric loss factor and can realize halogen-free flame retardancy.
Owner:GUANGDONG SHENGYI SCI TECH
Flame retardant glue and preparation method thereof
InactiveCN107312476AAchieve halogen-free flame retardantNon-macromolecular adhesive additivesAldehyde/ketone condensation polymer adhesivesAcetic acidPolyvinyl alcohol
The invention provides flame retardant glue and a preparation method thereof. The preparation method comprises the following steps: adding ammonium hexachloroiridate and zinc acetate into polyvinyl alcohol and fatty amine polyoxyethylene ether; stirring at the temperature of 90 DEG C for an hour, adding 1-mercapyl methyl acetic acid, stirring at the temperature of 130 DEG C for an hour, adding nonyl phenolic resin, and stirring for 2 hours; adding triphenyl phosphate and magnesium hydroxide, stirring at the temperature of 110 DEG C for an hour; adding methyltrialkoxysilane, and stirring for 15 minutes, thereby obtaining the flame retardant glue. The oxygen index is 31, V0 level; by utilizing a 3M 600 adhesive tape, the adhesive force in a drawing coating test is 5B.
Owner:安徽省鸿鑫生物科技有限公司
Halogen-free thermosetting resin composition, prepreg using composition, and laminated plate for printed circuit
InactiveCN107151308AHigh functionalityExcellent dielectric propertiesSynthetic resin layered productsElectrical equipmentHalogenHeat resistance
The invention relates to a halogen-free thermosetting resin composition, a prepreg using the composition, and a laminated plate for a printed circuit. The halogen-free thermosetting resin composition is characterized in that 100 parts by weight of organic solids comprise, by weight, 16-42 parts of halogen-free epoxy resin, 1.5-4.8 parts of a compound containing a hydrobenzooxazine ring, 10-28 parts of a phosphorus-containing bisphenol curing agent with the weight average molecular weight of 1000-6500, and 30-70 parts of silica. The prepreg made of the halogen-free thermosetting resin composition and the laminated plate for the printed circuit have the advantages of high glass transition temperature, excellent dielectric properties, low water absorption rate, high heat resistance, good technologic processability, realization of no halogen and flame retardation, and reaching of UL94 V-0.
Owner:GUANGDONG SHENGYI SCI TECH
Thermosetting resin composition and prepreg, metal foil-clad laminate and printed circuit board using same
ActiveCN109694462BHigh glass transition temperatureLow water absorptionSynthetic resin layered productsElectrical equipmentMetallic foilPolymer science
Provided in the present invention are a thermosetting resin composition, a prepreg using same, a metal foil-cladded laminate, and a printed circuit board. The thermosetting resin composition comprises an epoxy resin, a phosphorous-containing bisphenol, and an ester curing agent having the structure of formula I. The present invention employs the ester curing agent having the structure of formula I and the phosphorous-containing bisphenol for co-curing of the epoxy resin, uses the phosphorous-containing bisphenol as a primary curing agent, provides a cured substance with great dielectric performance, high temperature resistance, and adhesion, also implements halogen-free flame retardation, combined with the ester curing agent of the structure of formula I, produces no polar groups such as a secondary hydroxyl, and significantly increases the glass transition temperature of the cured substance while ensuring great dielectric performance, and, with the cured substance containing a large amount of hydrophobic groups, significantly reduces the water absorption rate of the cured substance, thus increasing the stability of the dielectric constant and of the dielectric loss factor of the cured substance. The laminate manufactured and the metal foil-cladded laminate have great heat resistance, moisture resistance, peel strength, dielectric performance, and flame retardancy.
Owner:GUANGDONG SHENGYI SCI TECH
A kind of pa6 composite material and preparation method thereof
The invention provides a PA6 composite material and a preparation method thereof. The PA6 composite material is prepared from the following ingredients in parts by mass: 33 to 37 percent of PA6 resin,8 to 13 percent of alkali-free glass fiber, 0 to 50 percent of magnesium oxide, 0 to 50 percent of magnesium hydrate and 0 to 5 percent of auxiliary agents, wherein the sum of the mass of the magnesium oxide and the magnesium hydrate does not exceed 60 percent of the total mass of the composite material. The composite material has excellent heat conduction performance, and simultaneously has excellent mechanical performance; the halogen-free flame-retardant effect can be achieved. The process of the preparation method is simple; the preparation method is suitable for industrial production.
Owner:东莞市银禧光电材料科技股份有限公司
A kind of 125 ℃ irradiation cross-linked epcv photovoltaic halogen-free flame retardant sheath material and preparation method thereof
ActiveCN103524893BAchieve halogen-free flame retardantImprove flame retardant performanceRubber insulatorsPlastic/resin/waxes insulatorsCross-linkPolymer science
A zero halogen sheath material used for 125°C irradiation cross-linked EPCV photovoltaics, said material being made primarily of the following starting materials, in parts by weight: 10-20 parts of ethylene propylene diene monomer rubber; 0-5 parts of thermoplastic elastomer; 0-25 parts of polyethylene; 0-15 parts of ethylene-vinyl acetate copolymer; 1-5 parts of compatibilizer; 45-65 parts of aluminum hydroxide; 1-3 parts of stabilizer; 1-3 parts of silicone masterbatch. The product has excellent oil repellency properties and flame retardant properties, releases very little smoke during combustion, light transmittance in the smoke can reach more than 90%, and the product also has excellent mechanical properties and weather resistance properties, fully satisfying the performance requirements of UL 4703-2010 standards.
Owner:JIANGSU DASHENG POLYMER
Thermosetting resin composition, prepreg and laminated board
ActiveCN102115600BExcellent heat and humidity resistanceImprove heat resistanceGlass/slag layered productsMetal layered productsPolymer sciencePrepolymer
The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy.
Owner:SHENGYI TECH SUZHOU
Dihydroxy low-molecular-weight polyphenyl ether alkyl phosphate and thermosetting resin composition and application thereof
PendingCN113801318AEliminate generationImprove aging resistanceSynthetic resin layered productsElectrical equipmentPolymer scienceFirming agent
The invention relates to dihydroxyl low-molecular-weight polyphenyl ether alkyl phosphate and a thermosetting resin composition and an application thereof, a phosphate group is introduced into polyphenyl ether, so that the dihydroxyl low-molecular-weight polyphenyl ether alkyl phosphate can be used as a curing agent of epoxy resin, and a phosphate group with a flame-retardant effect is also introduced; meanwhile, a large number of hydroxyl groups generated by the epoxy resin are eliminated, and the aging resistance of the material is improved; the dihydroxy low-molecular-weight polyphenyl ether alkyl phosphate is used as a curing agent and a flame retardant in the resin composition, so that the glass transition temperature and the heat resistance of a prepreg prepared from the resin composition and a laminated board for a printed circuit can be remarkably improved; and the product has excellent dielectric property, low water absorption rate, heat and humidity resistance and good process processing performance; and a cured laminated board can realize halogen-free flame retardance, and reaches UL94V-0.
Owner:LANZHOU RUIPU TECH CO LTD
Halogen-free fire-resistant engineering plastics using waste PET bottle chips as raw material and preparation method thereof
The invention discloses halogen-free fire-resistant engineering plastics using waste PET bottle chips as a raw material, a preparation method thereof and application thereof. The plastics consists of the following components in percentage by weight: 36 to 65 percent of waste PET bottle chips, 15 to 40 percent of reinforcing agent, 3 to 8 percent of toughening agent, 5 to 8 percent of phosphorous fire retardant, 2 to 8 percent of nitrogen fire retardant, 0 to 4 percent of nanometer clay, 0 to 0.5 percent of nucleating agent and 0 to 0.5 percent of antioxidant. The halogen-free fire-resistant engineering plastics are prepared by using the waste PET bottle chips as the raw materials, thereby contributing to environmental protection, reducing pollution of waste bottles and making recycled materials have high performance; in addition, because the phosphorous-nitrogen fire-resistant system and the nanometer clay are combined, the compound material is halogen free and fire resistant and simultaneously the fire-resistant material has a higher CTI value; and thus, the engineering plastics are applied in a field of electric products.
Owner:GUANGZHOU SUPER DRAGON ENG PLASTICS
Features
- R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
Why Patsnap Eureka
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com